The invention provides a
crystal bar workpiece plate, and a
crystal bar
cutting device and method. The
crystal bar workpiece plate comprises a fixed plate and an adjustment plate, wherein the fixed plate is used for placing a crystal bar; the adjustment plate is located on a surface away from the crystal bar, of the fixed plate, a circle center hole and a plurality of
waist-shaped through holes are formed in the adjustment plate, the circle center hole is located in the middle of the adjustment plate, and the plurality of
waist-shaped through holes are located in the periphery of the circle center hole; and the fixed plate is connected with the adjustment plate through bolts located in the circle center hole and the plurality of
waist-shaped through holes, and the bolts in the waist-shapedthrough holes are capable of moving in the waist-shaped through holes to adjust the relative positions of the fixed plate and the adjustment plate, so that adjustment for a
crystal orientation deflection angle of the crystal bar is realized. According to the crystal bar workpiece plate, and the crystal bar
cutting device and method, position adjustment for the crystal bar is realized through thestructural design that the fixed plate and the adjustment plate are cooperated, and by adjusting the position of the adjustment plate relative to the fixed plate, and the
crystal orientation deflection angle of the crystal bar is adjusted to be in an expected range, so that a finally-
cut wafer can meet the requirements. With the adoption of the crystal bar workpiece plate, and the crystal bar
cutting device and method, the quality of the
cut wafer can be increased, and the production efficiency can be increased.