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Epoxide resin pouring sealant with low density and high impact resistance and preparation method thereof

An epoxy resin, high impact resistance technology, applied in the direction of epoxy resin glue, chemical instruments and methods, adhesives, etc., to achieve low density, prevent further growth, and good impact resistance

Active Publication Date: 2009-11-18
INST OF CHEM MATERIAL CHINA ACADEMY OF ENG PHYSICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In short, the research on epoxy resin modification is still focused on the simple toughening research, and there is no research report that can reduce the epoxy density and improve its impact strength.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0031] The preparation method of low density and high impact resistance epoxy resin potting glue of the present invention comprises the following steps:

[0032] a. Preparation of polyurethane prepolymer

[0033] At 80°C to 100°C, the polyurethane prepolymer is prepared by bulk polymerization of diisocyanate and diol, wherein the molar ratio of diisocyanate to diol is: -NCO:-OH=1.1~5;

[0034] b. Pretreatment of hollow glass microspheres

[0035] First dry the commercially available hollow glass microspheres at 100°C-120°C for 2 hours; then add the hollow glass microspheres into the ethanol solution of KH-550 silane coupling agent, stir and mix evenly; heat to 40°C-60°C, Ultrasonic treatment for 60 minutes, then heated to 80 ℃ ~ 120 ℃ to remove ethanol, cooled to room temperature for later use;

[0036] c. Preparation of polyurethane prepolymer-coated hollow glass microspheres

[0037] Add the polyurethane prepolymer prepared in step a into an acetone solvent to dissolve co...

Embodiment 1

[0058] Preparation of low-density high-impact epoxy potting compound.

[0059] The ratio is as follows (take the configuration of 100g potting glue as an example):

[0060] Composition Quantity Mass

[0061] E-51 epoxy resin 100 51.8g

[0062] 593 curing agent 30 15.5g

[0063] Accelerator 3 1.6g

[0064] Reactive diluent 20 10.4g

[0065] Hollow glass microspheres coated with PU prepolymer 40 20.8g

[0066] Defoamer 3 1.5g

[0067] Preparation process: Take 37.5g of PTMG-1000 vacuum dehydration, put it into a three-necked flask, heat up to 90°C-95°C to completely melt, then add 12.5g of isophorone diisocyanate, 3 drops of stannous octoate catalyst, and blow nitrogen for 10 Minutes, heated at constant temperature to continue the reaction for 3 hours, and the system temperature was lowered to room temperature to obtain a polyurethane prepolymer;

[0068] First dry 19g of hollow glass microspheres at 120°C, then add them into the ethanol solution of KH-550 silane coupling...

Embodiment 2

[0071] Change PTMG-1000 in Example 1 to PTMG-2000, other conditions are constant, can obtain low density high impact resistance epoxy resin encapsulant, its impact resistance is 15KJ / m 2 .

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Abstract

The invention relates to a preparation method for epoxide resin pouring sealant with low density and high impact resistance. The epoxide resin pouring sealant in the invention comprises epoxide resin, curing agent and promoter thereof, reactive diluent, polyurethane prepolymer coating hollow glass microballoon, foam killer and the like. The encapsulating material has low toxicity, fine wetting quality, and condensate thereof has low density, high impact resistance, low linear expansibility and good weather resistance. The pouring sealant is applicable to encapsulation of electrical apparatus elements under the condition of miniaturization, light weight and impact resistance.

Description

technical field [0001] The invention belongs to the technical field of adhesives, and in particular relates to a low-density, high-impact-resistant epoxy resin potting adhesive and a preparation method thereof. Background technique [0002] Simply put, potting is an operation process that uses potting materials to reasonably arrange, assemble, connect, seal and protect the components that make up electronic devices to prevent moisture, dust and other harmful substances. The intrusion of gas to electronic components slows down vibration, prevents external force damage and stabilizes the parameters of electronic components. At present, with the expansion of the application range, the integration, miniaturization and precision of electronic components, the demand for potting materials in the electronic field is not limited to dielectric insulation performance, but also requires light weight, high resistance Unique properties such as impact to meet the needs of low-density and ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/02C09J11/04C09K3/10C09C3/10
Inventor 赵秀丽白战争罗雪方王建华罗世凯黄奕刚
Owner INST OF CHEM MATERIAL CHINA ACADEMY OF ENG PHYSICS
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