Polyimide copper clad lamination containing thioether structure and preparation method thereof

A technology of polyimide and polyimide layer, applied in chemical instruments and methods, circuit substrate materials, improvement of metal adhesion of insulating substrates, etc., can solve problems such as poor bonding performance and low thermal expansion coefficient, and achieve Excellent film-forming properties, low thermal expansion coefficient, and excellent dimensional stability

Inactive Publication Date: 2009-12-09
SUN YAT SEN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The fourth method has the advantages of low production cost and simple process. However, due to the poor bonding performance of the currently used polyimide system with copper foil, it is difficult to meet the requirements of high performance. Therefore, it is necessary to The traditional polyimide system is improved to obtain a new polyimide system with excellent adhesion to copper foil and low thermal expansion coefficient

Method used

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  • Polyimide copper clad lamination containing thioether structure and preparation method thereof
  • Polyimide copper clad lamination containing thioether structure and preparation method thereof
  • Polyimide copper clad lamination containing thioether structure and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0042]In a 100mL three-necked flask equipped with electromagnetic stirring, a thermometer and an inert gas protection device, add 2.180g (10.0mmol) 4,4'-diaminodiphenyl sulfide, add 27mL N,N-dimethylformamide, Dissolve the diamine. Then drop into 3.2039g (9.95mmol) 3 in batches, 3 ', 4, the 4-benzophenone tetraacid dianhydride, add time interval more than 10 minutes each time, guarantee its sufficient reaction. After the addition, start timing, stir and react at room temperature for 4.5 hours, stop stirring, and obtain the corresponding polyamic acid solution.

[0043] Coat the amic acid solution evenly on a clean copper foil, then place it in a high-temperature vacuum oven, and carry out thermal imidization reaction with gradient temperature rise. , heating up for 0.3h)→190°C (0.15h of heat preservation, 0.3h of temperature rise)→240°C (0.15h of heat preservation, 0.3h of temperature rise)→320°C (0.3h of heat preservation). After the reaction is finished, a polyimide copper...

Embodiment 2

[0045] The polyamic acid solution in Example 1 is evenly coated on the copper foil respectively to control a certain wet film thickness, then the coated surfaces of the two coated copper foils are stacked and placed in a high-temperature vacuum oven In, the thermal imidization reaction was carried out according to the gradient temperature raising conditions described in Example 1. After the reaction is finished, a double-sided polyimide copper-clad laminate is obtained.

Embodiment 3

[0047] Use the mixed diamine of 3.0mmol 4,4`-diaminodiphenyl sulfide and 7.0mmol 4,4`-diaminodiphenyl ether to replace 10.0mmol of 4,4`-diaminodiphenyl sulfide in Example 1 , the reaction time was 5 hours, and other implementation methods were the same as in Example 1. The initial decomposition temperature of the obtained polymer under a nitrogen atmosphere is greater than 480°C; the glass transition temperature measured by DMA is 295.3°C, the peel strength with copper foil is 1.037kgf / cm, and the number of flexures of the copper clad laminate is 117 times (0.5 kgf; 0.38R).

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Abstract

The invention discloses a polyimide copper clad lamination containing thioether structure and a preparation method thereof; the preparation method comprises the following steps: mixing diamine with thioether structure with other diamines and various dianhydrides for reacting to obtain polyamide acid, coating the obtained polyamide acid directly on the surface of copper foils and obtaining polyimide copper clad lamination containing thioether structure at a high temperature by thermal imidization reaction. The polymer of polyimide laminate containing thioether structure prepared by the invention has big polymer molecular weight, good mechanical property, high thermal stability, excellent film-forming ability, low thermal expansion coefficient and good adhesive property to copper and the material can be used to prepare single-layered or multiple-layered free-adhesives copper clad lamination.

Description

technical field [0001] The invention relates to a polyimide copper-clad laminate containing a sulfide structure and a preparation method thereof. technical background [0002] In recent years, with the expansion of application requirements for three-dimensional (three-dimensional or 3D) and flexible assembly and the development of ultra-fine pitch high-density technology, electronic products continue to develop toward "light, thin, short, and small", thereby further To promote the progress of flexible copper clad laminate materials and its manufacturing technology, flexible printed circuit boards (Flexible Printed Circuit Board, referred to as FPCB) have shown their irreplaceable position in the copper clad laminate and packaging industry. It can be bent, wound, and folded freely, and can be arranged arbitrarily according to the requirements of space layout, and can be moved and stretched arbitrarily in three-dimensional space, so as to achieve the integration of component a...

Claims

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Application Information

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IPC IPC(8): H05K1/03H05K3/38B32B15/08B32B15/20C08G73/10
Inventor 张艺牛新星郑雪菲林文璇麦景璋张燕珠肖尚雄刘四委池振国许家瑞
Owner SUN YAT SEN UNIV
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