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Epoxy resin and preparation method thereof

A technology of epoxy resin and epihalohydrin, applied in the field of resin and its preparation, can solve the problems of insufficient high-frequency characteristics, high dielectric constant and dielectric loss tangent, inability to adapt to the high frequency of signals, etc. The effect of optimized electrical properties, simple operation, high thermal stability and resistance to humidity and heat

Inactive Publication Date: 2010-02-10
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, ordinary epoxy resin circuit substrates (FR-4 copper clad laminates) generally have high dielectric constant and dielectric loss tangent (dielectric constant 4.4, dielectric loss tangent about 0.02), and the high-frequency characteristics are not sufficient, so they cannot adapt to signal high frequency requirements

Method used

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  • Epoxy resin and preparation method thereof
  • Epoxy resin and preparation method thereof
  • Epoxy resin and preparation method thereof

Examples

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preparation example Construction

[0028] The invention provides a preparation method of epoxy resin. The method adopts a one-step method, that is, the mixture of p-hydroxystyrene / styrene copolymer and epichlorohydrin is directly condensed under the action of alkali to obtain the epoxy resin. The specific steps are: mixing organic solvent, p-hydroxystyrene / styrene copolymer and epichlorohydrin, feeding p-hydroxystyrene / styrene copolymer and epichlorohydrin at a molar ratio of 1:1 to 20, inert Heating and reacting at 50-150°C for 1 to 5 hours under gas protection, while adding lye dropwise, the molar ratio of lye and p-hydroxystyrene / styrene copolymer is 1 to 2:1, after the reaction is completed, filter and wash with water Salt content is removed, excess epichlorohydrin is removed by vacuum distillation, and finally a multifunctional epoxy resin containing a low-polarity styrene structure is obtained.

[0029] The lye used therein can be sodium hydroxide, potassium hydroxide, etc. The lye used is preferably a th...

Synthetic example 1

[0049] Mix p-hydroxystyrene / styrene copolymer, epichlorohydrin and dioxane, and feed the p-hydroxystyrene / styrene copolymer and epichlorohydrin at a molar ratio of 1:5. Dioxane has a p-hydroxystyrene / styrene copolymer weight ratio of 1.89. p-Hydroxystyrene / styrene copolymer synthesized by known method, Wn is 4300. Above-mentioned mixture is heated under nitrogen protection, and heating temperature is at 80 degree, and constantly stirs, and dropwise adds sodium hydroxide solution simultaneously, the concentration of used sodium hydroxide solution is 25wt%, sodium hydroxide and p-hydroxystyrene / styrene copolymer The molar ratio of the lye is 2 / 1, and the lye is added dropwise within 3 hours. During the reaction process, the moisture and epichlorohydrin in the system are continuously separated from the system by azeotropic, and the stratified epichlorohydrin returns to the system. Excess epichlorohydrin and dioxane were distilled off under reduced pressure, methyl isobutyl keton...

Synthetic example 2

[0051] Mix p-hydroxystyrene / styrene copolymer, epichlorohydrin and toluene, and feed the p-hydroxystyrene / styrene copolymer and epichlorohydrin at a molar ratio of 1:10. Dioxane has a p-hydroxystyrene / styrene copolymer weight ratio of 1.89. p-Hydroxystyrene / styrene copolymer synthesized by known method, Wn is 30000. Above-mentioned mixture is heated under the protection of nitrogen, heating temperature is at 100 degree, and constantly stirs, dropwise adds sodium hydroxide solution simultaneously, the concentration of used sodium hydroxide solution is 25wt%, sodium hydroxide and p-hydroxystyrene / styrene copolymer The molar ratio of the lye is 2 / 1, and the lye is added dropwise within 2 hours. During the reaction, the moisture and epichlorohydrin in the system are continuously separated from the system by azeotropy, and the stratified epichlorohydrin returns to the system. Excess epichlorohydrin and toluene were distilled off under reduced pressure, methyl isobutyl ketone was a...

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Abstract

The invention relates to an epoxy resin and a preparation method thereof. The epoxy resin has the following structural formula (I). The preparation method can adopt a one-step method, namely directlycondensing the mixture of hydroxystyrene / styrene copolymer and epihalohydrin in the presence of alkali to obtain the epoxy resin, and also can adopt a two-step method, namely firstly etherifying the hydroxystyrene / styrene copolymer and epihalohydrin in the presence of catalysts and then closing loop in the presence of alkali liquor. The epoxy resin of the invention has high heat resistance, low dielectric constant and low dielectric dissipation factors, thus being used for manufacturing the resin sheets, resin composition copper foils, the prepregs, the laminate and the printed circuit boards.R is shown in (II), and n and m are natural numbers.

Description

technical field [0001] The invention relates to a resin and a preparation method thereof, in particular to a multifunctional epoxy resin and a preparation method thereof. Background technique [0002] Among conventional printed circuit board materials, epoxy resins excellent in adhesive properties are widely used. Epoxy resin generally refers to molecules containing two or more epoxy groups, with organic compounds such as aliphatic, alicyclic or aromatic as the skeleton, and can be cured by appropriate chemical reagents (curing) through epoxy groups. A general term for compounds that react to form a three-dimensional network cured product in the presence of an agent). It is one of the most important varieties of thermosetting polymer materials. Epoxy resins are widely used in adhesives, coatings, laminates, molding materials, casting materials, printed circuit boards due to their good chemical stability, electrical insulation, corrosion resistance, adhesion and mechanical ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08F212/08C08F212/14C08F8/08
Inventor 苏民社陈勇杨中强
Owner GUANGDONG SHENGYI SCI TECH
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