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Polyamide composition

A polyamide composition, polyamide technology, applied in the field of polyamide composition, can solve the problem of not being able to fully prevent dripping, achieve the effects of suppressing the reduction of flame retardancy, excellent mechanical properties, and high strength

Active Publication Date: 2010-07-07
KURARAY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, for modified polyolefins, similarly to the above-mentioned fluororesins such as PTFE having fibril-forming ability, simply by blending modified polyolefins, especially as a flame retardancy test based on the UL-94 standard For the test piece, when using a thin test piece with a thickness of about 0.75mm, it may not be able to prevent dripping sufficiently

Method used

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  • Polyamide composition
  • Polyamide composition
  • Polyamide composition

Examples

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preparation example Construction

[0056] Phosphoric acid, phosphorous acid, hypophosphorous acid, these salts or esters etc. are mentioned as a catalyst used for preparation of polyamide (A). Examples of the aforementioned salts or esters include salts of phosphoric acid, phosphorous acid, or hypophosphorous acid and metals such as potassium, sodium, magnesium, vanadium, calcium, zinc, cobalt, manganese, tin, tungsten, germanium, titanium, and antimony. Ammonium salt of phosphoric acid or hypophosphorous acid, ethyl ester, isopropyl ester, butyl ester, hexyl ester, isodecyl ester, stearyl ester, decyl ester, stearyl ester, phenyl ester of phosphoric acid, phosphorous acid or hypophosphorous acid.

[0057]The intrinsic viscosity [η] of the polyamide (A) used in the present invention measured at 30°C in concentrated sulfuric acid is preferably 0.6 to 1.1 dl / g, more preferably 0.65 to 1.0 dl / g, particularly preferably 0.7 to 0.95 dl / g. Using a polyamide having an intrinsic viscosity [η] within the above range pr...

Embodiment 1～7 and comparative example 1～12

[0168] Components other than general-purpose glass fibers or chopped fibers were premixed (dry mixed at one time) according to the compounding recipes in Tables 1 to 3 below, and then the premixed mixture was supplied to a twin-screw extruder (plastic) from a hopper. In "BTN-32, screw diameter: 30mm, L / D=28, barrel temperature: 320°C, rotational speed: 150rpm" manufactured by the Engineering Research Institute), plasticization is performed by supplying general-purpose glass fibers or chopped fibers from a side feeder kneading, cooling, and cutting to obtain granules of the polyamide composition.

[0169] Using the pellets, mechanical properties, flame retardancy, degree of deformation, solder heat resistance, bulge flow length, and appearance were evaluated. The results are shown in Tables 1 to 3.

[0170] As can be seen from Tables 1 to 3, when only fluororesin as an anti-dripping agent (C) is blended into polyamide (PA9T-1) exhibiting good fluidity (Comparative Examples 1, ...

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Abstract

Disclosed is a polyamide composition containing 100 parts by mass of a polyamide (A) having a melting point of 270-340 DEG C, 1-100 parts by mass of a flame retardant (B), and 1-10 parts by mass of a drip inhibitor (C). In this polyamide composition, a fluororesin (C1) and at least one polymer (C2) selected from the group consisting of ionomers and modified aromatic vinyl polymers having a halogen atom content of less than 15% by mass are used at a mass ratio (fluororesin (C1) / polymer (C2)) of from 1 / 4 to 4 / 1 as the drip inhibitor (C).

Description

technical field [0001] This invention relates to polyamide compositions. More specifically, the present invention relates to a polyamide composition excellent in flame retardancy, heat resistance, moldability (fluidity) and mechanical properties, which is suitable as a material for molding electronic parts of An electronic component having a thin portion compatible with a Surface Mount Technology (SMT: Surface Mount Technology) system. Background technique [0002] When using the surface mount technology method, a printed circuit board coated with paste solder is prepared in advance, and surface mount components (SMD: Surface Mount Device) such as chips (chips) are mounted on it with a dedicated device called a chip mounter. Next, the solder is melted by heating to about 250° C. in a high-temperature furnace (reflow process), and the surface mount component and the printed circuit board are joined. Conventionally, the "pin insertion method" (Through Hole Technology) is use...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L77/00C08K7/14
CPCC08L27/12C08L77/00C08L29/08C08L2666/04
Inventor 松冈秀治重松宇治田村兴造河原茂
Owner KURARAY CO LTD