Method for manufacturing high-purity metal wire

Abstract

The invention discloses a method for manufacturing a high-purity metal wire. The method comprises the following steps: S1, performing slitting and degassing pretreatment on an electrolyzed raw material plate to form a raw material metal strip; S2, rolling the raw material metal strip to manufacture a semi-finished product of the high-purity metal wire; S3, annealing the semi-finished product of the high-purity metal wire; S4, carrying out cold-press welding on a plurality of annealed semi-finished products of the high-purity metal wires to ensure that the metal wires are connected end to end in sequence; and S5, coldly drawing the semi-finished product of the high-purity metal wire which is subjected to cold press welding to directly form a finished product of the high-purity metal wire; or continuously annealing the metal wire before the high-purity metal wire is drawn to the size of wire diameter of the finished product of the high-purity metal wire, and drawing the metal wire to the size of the wire diameter of the finished product of the high-purity metal wire. The invention provides the high-purity metal wire manufacturing method with the advantages of high production efficiency, low energy consumption, little investment and simple process, and the manufactured high-purity metal wire has the characteristics of high purity, high conductivity, good manufacture performance and the like.

Description

technical field [0001] The invention relates to a method for manufacturing high-purity metal wires, in particular to a method for directly using electrolytic metal plates to prepare high-purity metal wires. Background technique [0002] High-purity metal wires (including high-purity copper wires, high-purity nickel wires, etc.) are widely used in the manufacturing industry of electronic and electrical products, such as high-definition TV signal lines, high-quality audio A large number of high-purity metal wires are used. Physical parameters such as diameter, purity and ductility of high-purity metal wires are key factors affecting the quality of electronic and electrical products based on them. With the development trend of miniaturization and high performance of electronic and electrical products, high-purity metal wires are required to have higher purity, better ductility, thermal conductivity and lower resistance value. [0003] Such as figure 1 Shown is a conventional...

AI Technical Summary

Problems solved by technology

[0005] 1. In the process of smelting and casting ingots, iron, manganese, titanium, silicon, carbon, rare earth and other auxiliary materials need to be added, which increases the impurity content in the finished nickel wire. Generally, the impurity content in the nickel wire reaches about 0.5%. In addition to reducing the purity of the material, it is also very easy to form inclusions in the nickel wire, which increases the resistivity of the nickel wire and deteriorates the plasticity, making it difficult to meet the processing and application requirements of metal wires for electronic products;

[0006] 2. There are many production links, large investment in equipment, and a large production area;

[0007]3. Long production cycle

Generally, it takes 7 days from feeding materials to finished products, and the production efficiency is low;

[0008] 4. High energy consumption

[0009] 5. During the smelting process, since the smelting temperature is above 1500°C, and the temperature of the subsequent two thermal processing is around 1000°C, there will be more than 2% loss in the production process

[0010] 6. The product qualification rate is low

[0011] The production process of conventional pure copper wire is similar to the preparation process of the above-mentioned pure nickel wire, and there is also the phenomenon that the material purity is reduced due to easy doping during the smelting process, so the cost and difficulty of preparing ultra-high-purity copper wire are high.

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