Diamond fret saw and manufacturing method thereof

A technology of diamond wire saw and manufacturing method, applied in the direction of manufacturing tools, metal processing equipment, abrasives, etc., can solve the problems of damaged sharpness and thickened metal layer, and achieve sufficient hardness, high retention, and good sharpness. Effect

Inactive Publication Date: 2010-09-08
SUMITOMO ELECTRIC IND LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, although the retention of abrasive grains is improved, the thickness of the metal layer covering

Method used

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  • Diamond fret saw and manufacturing method thereof
  • Diamond fret saw and manufacturing method thereof
  • Diamond fret saw and manufacturing method thereof

Examples

Experimental program
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Example

[0086] (First embodiment)

[0087] First, refer to figure 1 , figure 2 The diamond wire saw according to the first embodiment of the present invention will be described.

[0088] The diamond wire saw 1 of the first embodiment of the present invention, such as figure 1 , figure 2 Shown is a diamond wire saw obtained by dispersing and holding diamond abrasive grains 30 in a plating layer 20 covering the entire outer surface of a metal core wire 10.

[0089] The metal core wire 10 may be any metal wire as long as it can be electroplated on the outer surface 11 and has a certain strength. For example, steel wires such as piano wires, tungsten wires, molybdenum wires, etc. can be used.

[0090] The diameter of the metal core wire 10 can be appropriately changed according to the material, shape, etc. of the material to be cut, and is preferably 0.05 mm to 0.30 mm.

[0091] The coating 20 is such as figure 1 , figure 2 As shown, it is used to cover the outer surface 11 of the metal core wi...

Example Embodiment

[0139] Example 1

[0140] Hereinafter, examples are given to explain the present invention in more detail, but the present invention is not limited to these examples.

[0141] by Figure 5 , Image 6 In the process shown, the diamond wire saw 1 is manufactured.

[0142] A long piano wire with a diameter of 0.14 mm is continuously immersed in the degreasing tank 60, the pickling tank 70, and the water washing tank 80 at a conveying speed of 10 m / min for degreasing treatment, and is then divided into the anode chamber 91 and the anode chamber 91 by the cation exchange membrane 91c. The diamond abrasive grain electrodeposition process of electroplating is performed in the plating tank 90 of the double tank structure of the plating chamber 92.

[0143] Here, the formula of the plating bath in the plating tank 90 is: 0.4 mol of diammonium hydrogen citrate, 0.2 mol of sodium formate, 0.2 mol of nickel sulfate, and 0.2 mol of sodium tungstate.

[0144] In addition, the plating conditions are:...

Example Embodiment

[0148] Example 2

[0149] by Figure 5 , Image 6 The process shown is to manufacture a diamond wire saw.

[0150] A long piano wire with a diameter of 0.14mm is continuously immersed in the degreasing tank 60, the pickling tank 70 and the water washing tank 80 at a conveying speed of 10m / min for degreasing treatment, and then used in a plating tank not shown in the The nickel bath obtained by dispersing the diamond abrasive grains 30 in a nickel solution is electroplated.

[0151] Here, the formula of the nickel bath is 240 g / L nickel sulfate hexahydrate, 45 g / L nickel chloride hexahydrate, and 30 g / L boric acid.

[0152] In addition, the plating conditions are: bath temperature 50℃, current density 20A / dm 2 , Time 1 minute, pH 4.0.

[0153] In addition, the diamond abrasive grains 30 dispersed in the nickel bath are nickel-plated diamond abrasive grains whose outer surface is covered with nickel. The amount of nickel plating is 30% by weight with respect to the diamond abrasive grai...

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Abstract

The present invention provides a diamond fret saw and manufacturing method thereof, in the diamond fret saw, a whole outer surface of a core wire which is made of metal and is dispersedly kept with diamond grains is covered by a coating layer which has the sufficient hardness and is made of nickel alloy containing tungsten, accordingly, the diamond fret saw has good sharpness during being used and is not easy to fret. In addition, according to the invention, in the diamond fret saw, the whole outer surface of the diamond fret saw containing the coating layer and the diamond grains is covered by a metal thin film to enable the keeping performances of the diamond grains dispersedly kept on the outer surface of the core wire made of the metal to be high, and the sharpness of the diamond fret saw during being used can not be damaged.

Description

technical field [0001] The present invention relates to a diamond wire saw and a method for manufacturing the same. Background technique [0002] In the manufacture of various semiconductor devices, a columnar raw material ingot containing single crystal, polycrystalline or amorphous silicon, crystal, etc., for example, is cut into thin plates (wafers) of predetermined thickness dimensions by slicing. As a processing method for cutting such highly brittle materials with high precision and low cost, attempts are being made to use fixed abrasive wire saws in which abrasive grains such as superabrasives such as diamond are fixed to the outer peripheral surface of the wire. [0003] As such techniques, there are the following Patent Documents 1 to 4. [0004] Patent Document 1 below is an invention related to a wire saw and its manufacturing method, and discloses a wire saw in which superabrasive grains are firmly fixed to the wire without falling off, have a constant thickness...

Claims

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Application Information

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IPC IPC(8): B24D3/00B24D11/00
Inventor 细江晃久稻泽信二新田耕司松本断星间昭人
Owner SUMITOMO ELECTRIC IND LTD
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