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Diamond fret saw and manufacturing method thereof

A technology of diamond wire saw and manufacturing method, applied in the direction of manufacturing tools, metal processing equipment, abrasives, etc., can solve the problems of damaged sharpness and thickened metal layer, and achieve sufficient hardness, high retention, and good sharpness. Effect

Inactive Publication Date: 2010-09-08
SUMITOMO ELECTRIC IND LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, although the retention of abrasive grains is improved, the thickness of the metal layer covering the abrasive grains is also thickened, and there is a problem that the sharpness is impaired during use.

Method used

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  • Diamond fret saw and manufacturing method thereof
  • Diamond fret saw and manufacturing method thereof
  • Diamond fret saw and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach

[0087] First, refer to figure 1 , figure 2 , the diamond wire saw according to the first embodiment of the present invention will be described.

[0088] The diamond wire saw 1 of the first embodiment of the present invention, such as figure 1 , figure 2 Shown is a diamond wire saw in which diamond abrasive grains 30 are dispersed and held in a plating layer 20 covering the entire outer surface of a metal core wire 10 .

[0089] The metal core wire 10 may be any metal wire as long as the outer surface 11 can be plated and has a certain strength. For example, steel wires such as piano wires, tungsten wires, molybdenum wires, and the like can be used.

[0090] The diameter of the metal core wire 10 can be appropriately changed according to the material and shape of the material to be cut, but is preferably 0.05 mm to 0.30 mm.

[0091] The coating 20 is as figure 1 , figure 2 As shown, it is used to cover the outer surface 11 of the metal core wire 10 and to disperse and...

Embodiment 1

[0140] Hereinafter, examples are given to describe the present invention in more detail, but the present invention is not limited to these examples.

[0141] pass Figure 5 , Figure 6 In the steps shown, the diamond wire saw 1 is manufactured.

[0142] A long piano wire with a diameter of 0.14 mm is continuously dipped in the degreasing tank 60, the pickling tank 70 and the water washing tank 80 at a conveying speed of 10 m / min to carry out the degreasing treatment, and then the anode chamber 91 and the anode chamber 91 are separated by a cation exchange membrane 91c. The diamond abrasive grain electrodeposition process of electroplating is carried out in the plating tank 90 of the double tank structure of the plating chamber 92 .

[0143] Here, the formulation of the plating bath in the plating tank 90 is: 0.4 mol of diammonium hydrogen citrate, 0.2 mol of sodium formate, 0.2 mol of nickel sulfate, and 0.2 mol of sodium tungstate.

[0144] In addition, the electroplating ...

Embodiment 2

[0149] pass Figure 5 , Figure 6 The process shown, manufactures a diamond wire saw.

[0150] A long piano wire with a diameter of 0.14 mm is continuously immersed in the degreasing tank 60, the pickling tank 70 and the water washing tank 80 at a conveying speed of 10 m / min. Electroplating is performed in a nickel bath obtained by dispersing diamond abrasive grains 30 in a nickel solution.

[0151] Here, the formula of the nickel bath is: nickel sulfate hexahydrate 240g / L, nickel chloride hexahydrate 45g / L, boric acid 30g / L.

[0152] In addition, the electroplating conditions are: bath temperature 50°C, current density 20A / dm 2 , time 1 minute, pH 4.0.

[0153] In addition, as the diamond abrasive grains 30 dispersed in the nickel bath, nickel-plated diamond abrasive grains whose outer surfaces are covered with nickel are used. The amount of nickel plating was 30% by weight based on the diamond abrasive grains, and the average particle diameter of the diamond abrasive gr...

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Abstract

The present invention provides a diamond fret saw and manufacturing method thereof, in the diamond fret saw, a whole outer surface of a core wire which is made of metal and is dispersedly kept with diamond grains is covered by a coating layer which has the sufficient hardness and is made of nickel alloy containing tungsten, accordingly, the diamond fret saw has good sharpness during being used and is not easy to fret. In addition, according to the invention, in the diamond fret saw, the whole outer surface of the diamond fret saw containing the coating layer and the diamond grains is covered by a metal thin film to enable the keeping performances of the diamond grains dispersedly kept on the outer surface of the core wire made of the metal to be high, and the sharpness of the diamond fret saw during being used can not be damaged.

Description

technical field [0001] The present invention relates to a diamond wire saw and a method for manufacturing the same. Background technique [0002] In the manufacture of various semiconductor devices, a columnar raw material ingot containing single crystal, polycrystalline or amorphous silicon, crystal, etc., for example, is cut into thin plates (wafers) of predetermined thickness dimensions by slicing. As a processing method for cutting such highly brittle materials with high precision and low cost, attempts are being made to use fixed abrasive wire saws in which abrasive grains such as superabrasives such as diamond are fixed to the outer peripheral surface of the wire. [0003] As such techniques, there are the following Patent Documents 1 to 4. [0004] Patent Document 1 below is an invention related to a wire saw and its manufacturing method, and discloses a wire saw in which superabrasive grains are firmly fixed to the wire without falling off, have a constant thickness...

Claims

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Application Information

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IPC IPC(8): B24D3/00B24D11/00
Inventor 细江晃久稻泽信二新田耕司松本断星间昭人
Owner SUMITOMO ELECTRIC IND LTD
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