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Method for preparing metallic submicron microsphere array film and electric deposition device

A microsphere array and submicron technology, applied in the direction of nanotechnology, nanotechnology, nanostructure manufacturing, etc., can solve the problems of inability to prepare highly ordered metal submicron microsphere array films, shedding, etc., and achieve easy repeatability and control , Uniform size and simple operation

Inactive Publication Date: 2010-09-29
BEIJING UNIV OF CHEM TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The invention solves the problem that the self-assembly method cannot realize the preparation of a highly ordered metal submicron microsphere array film, and has the characteristics of simple operation, controllable material thickness and easy repetition
In addition, in the step of preparing the starting template of polystyrene opal film in this method, by modifying the surface of the conductive glass doped with tin dioxide, so that the starting template can be evenly attached to the surface of the conductive glass, overcoming Solved the problem of polystyrene film peeling off on the glass surface

Method used

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  • Method for preparing metallic submicron microsphere array film and electric deposition device
  • Method for preparing metallic submicron microsphere array film and electric deposition device
  • Method for preparing metallic submicron microsphere array film and electric deposition device

Examples

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example 1

[0038] Example 1, preparation of metal silver submicron microsphere array film

[0039] The present invention provides an electrochemical deposition device. The device as figure 2 Shown: 1. is the rubber stopper containing the electrode, 2. is the glass tube containing the electroplating solution, 3. is the O-ring for sealing, 4. is the silica inverse opal template for electroplating, 5. is Tin dioxide-doped fluorine-doped conductive glass, 6, is the clip that conductive glass and glass are clamped. The glass tube is connected up and down and fixed on the inverse opal template, and the gasket acts as a seal between the bottom of the tube and the sample film. The plating process takes place in the sample inside the O-ring.

[0040] The specific steps of the method for preparing a submicron metal silver ball array thin film using the above-mentioned device are:

[0041] (1) Synthesis of monodisperse polystyrene submicron spheres. Using the soap-free emulsion polymerization...

example 2～3

[0051] Examples 2-3, preparation of metallic nickel submicron microspheres and platinum submicron microsphere array films

[0052] According to the method in Example 1, nickel submicron microspheres and platinum submicron microsphere array films were prepared, and the electroplating solution was replaced with the corresponding formula.

[0053] The nickel electroplating solution is an aqueous solution, and its composition is: nickel chloride 12.5g / L, boric acid 23g / L, nickel sulfate 8.2g / L, and the deposition current density is 0.2mA / cm 2 According to formula 1, the time for electroplating a 4 μm thick nickel ball array film is calculated as 61.6 min.

[0054] Composition of platinum electroplating solution: 0.2408g chloroplatinic acid, 7ml ethanol, 10ml deionized water, deposition current density 0.06mA / cm 2 According to formula 1, the time for electroplating a metal platinum film with a thickness of 4 μm is 62 minutes.

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Abstract

The invention relates to a method for preparing a metallic submicron microsphere array film and an electric deposition device. The method comprises the following steps of: vertically self-assembling polystyrene microspheres to obtain an ordered microsphere array film grown on conductive glass, synthesizing a silicon dioxide macroporous nano net by using the ordered microsphere array film as an initial template and adopting a sol-gel method, and obtaining the metallic submicron microsphere array film attached to the conductive glass by using the nano net as a second-step template and adopting an electrochemical deposition method. The electric deposition device comprises a glass tube filled with electroplating liquid; a tube orifice is sealed by using a plug containing platinum opposite electrodes and a silver / silver chloride reference electrode on the upper part of the glass tube; and the lower part of the glass tube is connected with an inverse opal film attached to the surface of the conductive glass through an O-shaped gasket and fixed on the inverse opal film. The method solves the problem of difficulty in preparing the high-ordered metallic microsphere array film, and lays a foundation for researching three-dimensional photonic band gap performance of a metallic microsphere array, particularly silver spheres with special optical property.

Description

technical field [0001] The invention relates to a method and an electrodeposition device for growing an ordered metal submicron microsphere array film material on tin dioxide-doped fluorine-doped conductive glass by using a two-step template method and an electrochemical deposition method. Background technique [0002] The submicron microsphere array film material is a kind of long-range ordered structure composed of submicron microspheres as the basic unit in the form of cubic close packing with a thickness of micron. Due to its periodic and ordered structure for the modulation of light waves, submicron microsphere array materials can be used as photonic crystals to achieve light shielding and reflection enhancement. Preparation and properties of submicron ball array materials. [0003] The submicron microspheres that are usually easy to synthesize mainly include silica, polystyrene and polymethyl methacrylate microspheres. The process of film formation generally includes...

Claims

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Application Information

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IPC IPC(8): B82B3/00C25D3/46
Inventor 徐联宾王飞陈建峰
Owner BEIJING UNIV OF CHEM TECH
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