Method for manufacturing white light LED by single crystals

A manufacturing method and single crystal technology, applied in semiconductor devices, electrical components, circuits, etc., can solve the problems that white light LEDs are not involved, and achieve good physical and chemical stability, excellent thermal conductivity, and timely heat dissipation

Inactive Publication Date: 2010-11-24
BEIJING UNIV OF TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, YAG:Ce 3+ Design method of fluorescent crystal

Method used

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  • Method for manufacturing white light LED by single crystals
  • Method for manufacturing white light LED by single crystals

Examples

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example 1

[0008] Example 1: Using 61% Al 2 o 3 , 35%Y 2 o 3 and 4% CeO 2 The proportioned raw materials are mixed and put into a 60mm diameter iridium crucible, heated to 1970°C in a D400 single crystal furnace to melt, and the pure YAG single crystal rod is used as the seed crystal for crystal growth, the rotation speed is 12r / min, and the diameter is drawn The speed is 2.0mm / h, and the size of the grown crystal is 20mm in diameter and 83mm in length. Fix the grown crystal on the glass according to the required size and cut it with a carbon cutting machine, soak the wafer in acetone for grinding and polishing, microscopically observe that there are no blisters and defects, and then polish it for more than 6 hours. The size of the chip is a single chip with a thickness of 0.2mm and a side length of 1.2mm. The single chip is packaged on an LED chip with a rated power of 1w (the size of a single LED light-emitting chip is 1mm×1mm) with a shadowless adhesive to complete the packaging o...

example 2

[0009] Example 2: Using 65% Al 2 o 3 , 33%Y 2 o 3 and 2% CeO 2 The proportioned raw materials are mixed and put into a 60mm-diameter iridium crucible, heated to 1970°C in a D400 single crystal furnace to melt, and the pure YAG single crystal rod is used as a seed crystal to grow the crystal at a speed of 12r / min. It is 2.0mm / h, and the growth crystal size is 18mm in diameter and 63mm in length. Grind and polish the wafer, observe microscopically that there are no blisters and defects, and then polish for more than 6 hours. After polishing, the single crystal is processed into a sheet with a thickness of 0.5mm and a side length of about 2.2mm, and is packaged with a shadowless adhesive. On an LED chip with a power of 3w (the size of a single LED chip is 2mm×2mm), the adjusted current is 300-750mA, which is higher than the maximum current of 650mA of the phosphor-encapsulated white LED, and the voltage is 0-3.6V. Good, the color of white light is soft and soft, the heat dis...

example 3

[0010] Example 3: Using 59% Al 2 o 3 , 40%Y 2 o 3 and 1% CeO 2 The proportioned raw materials are mixed and put into a 60mm-diameter iridium crucible, heated to 1970°C in a D400 single crystal furnace to melt, and the pure YAG single crystal rod is used as a seed crystal for crystal growth. The crystal growth rate is 2.2mm / h, and the growth crystal size is 9.5mm in diameter and 28.0mm in length; the single crystal is polished and processed into a sheet with a thickness of 0.8mm and a side length of 2.5mm, and is packaged in a 3w LED chip with a shadowless adhesive (The size of a single LED light-emitting chip is 2mm×2mm), the adjustment current is 300-750mA, which is higher than the rated current of 650mA of the phosphor-packaged white LED, and the voltage is 0-3.6V. The luminous performance is good, and the color temperature of white light is in About 6000K, the heat dissipation temperature is more than 40% lower than that of phosphor, and the luminous flux is slightly lo...

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Abstract

The invention relates to a method for manufacturing a white light LED by single crystals. YAG:Ce3+ single crystals are used as a luminescent material of the white light LED. The design idea of the method comprises the following steps of: heating the raw materials of 45 to 70 percent of Al2O3, 20 to 40 percent of Y2O3 and 0 to 4 percent of Ce2O2 in a proportion to the temperature of 1,970 DEG C in an iridium crucible according to the formula of cerium-doped yttrium aluminum garnet, and heating the raw materials into a melt; growing a pure YAG crystal serving as a seed crystal in a D400 single crystal furnace so as to obtain complete single crystals which have various concentrations without obvious defect; adhering the crystals to organic glass and cutting into wafers with the needed dimension and the thickness of 0.2 to 5mm by using a carbon plate cutting machine; and soaking for 12 hours by using acetone, performing coarse sand and fine sand grinding, polishing two sides of the crystals for over 6 hours by using a polishing machine, performing microscope detection to determine no sand hole or defect, and packaging the processed crystals with different concentrations and thicknesses on an LED light-emitting diode by using a high temperature resistant colloid. The crystals have the advantages of excellent heat conductivity and physical and chemical stability, and capacities of effectively improving the luminous efficiency of the LED and prolonging the service life of the LED.

Description

technical field [0001] The present invention relates to a new YAG:Ce for white light LED 3+ The photoluminescent material-single crystal is used in the design method of LED, and the invention relates to the growth, processing and packaging process of the single crystal for LED. Background technique [0002] White light is a multi-color mixed light that can be perceived by the human eye, including at least two wavelengths of light, so people can design LED light sources that produce white light. According to the existing technical capabilities, the way to obtain white light LEDs is about There are three kinds, namely phosphor powder coating light conversion method, multi-color LED combination method and multi-quantum well method, and the most common method of development and research at present is phosphor powder coating method to make white light LED. The phosphor coating method refers to YAG:Ce 3+ Phosphor powder is coated on the surface of the LED chip, and the light emi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/50
Inventor 邹玉林王涛刘娇聂朦
Owner BEIJING UNIV OF TECH
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