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Curable resin composition for encapsulating optical semiconductor and cured product thereof

A resin composition and compound technology, applied in semiconductor devices, epoxy resin glue, adhesive types, etc., can solve the problems of LED products in terms of illuminance decrease durability, sealing part depression, and alicyclic epoxy resin volatilization. and other problems, to achieve the effect of excellent coloring resistance and corrosive gas resistance

Inactive Publication Date: 2015-03-18
NIPPON KAYAKU CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, the sealing portion of the surface-mounted LED product is dented, which sometimes causes failure
In addition, depending on the degree of the depression, the electric wire portion that supplies current to the LED chip may be exposed, and in this case, the function as a sealing material may no longer be realized.
Therefore, this cycloaliphatic epoxy resin also has a problem in volatilization during heating and curing.
[0006] In addition, in recent years, LED products have become brighter for lighting or TV backlights, and LED lighting has begun to generate a lot of heat. Therefore, resin compositions using this alicyclic epoxy resin are also used in LED chips. Coloration is caused on the surface, and the final LED product has a decrease in illuminance and a problem in durability (Patent Document 3)

Method used

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  • Curable resin composition for encapsulating optical semiconductor and cured product thereof
  • Curable resin composition for encapsulating optical semiconductor and cured product thereof
  • Curable resin composition for encapsulating optical semiconductor and cured product thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0116] Hereinafter, the present invention will be described more specifically through examples, and unless otherwise specified, "parts" means parts by weight. In addition, the present invention is not limited to these Examples. In addition, in the examples, the epoxy equivalent was measured in accordance with JIS K-7236, and the viscosity was measured at 25° C. using an E-type viscometer. In addition, the analysis conditions of gas chromatography (hereinafter referred to as GC) are to use HP5-MS (0.25mm I.D.×15m, film thickness 0.25μm) as the separation column, set the temperature of the column oven to the initial temperature of 100°C, and The temperature was raised at a rate of 15°C and held at 300°C for 25 minutes. In addition, the carrier gas is helium. The measurement conditions of gel permeation chromatography (hereinafter referred to as GPC) are as follows. The column is connected with Shode×SYSTEM-21 column (KF-803L, KF-802.5 (×2 pieces), KF-802), the eluent is tetra...

Synthetic example 1

[0119] Synthesis of Diene Compounds

[0120] In a flask with stirrer, reflux condenser, stirring device, Dean-Stark trap (Dynstar tube), add 1,4-cyclohexanedicarboxylic acid while carrying out a nitrogen purge 172 parts, 448 parts of 3-cyclohexene-1-methanol, 600 parts of toluene, 4 parts of p-toluenesulfonic acid, adjust the degree of reduced pressure in the system so as to reflux at 45°C, and carry out 12 hours while removing the generated water. Reaction. After completion of the reaction, the reaction solution was washed three times with 120 parts of a 10% by weight aqueous sodium hydroxide solution, and then washed with water 70 parts / time until the waste water was neutral. Toluene and unreacted 3-cyclohexene-1-methanol were distilled off under heating and reduced pressure using a rotary evaporator to obtain 343 parts of a diene compound that was liquid at normal temperature.

[0121] Synthesis of epoxy resin

[0122] In a flask equipped with a stirrer, a reflux condens...

Embodiment 1

[0127] For the epoxy resin (EP-1) that synthesis example 1 obtains, use methylhexahydrophthalic anhydride (manufactured by New Japan Physical and Chemical Co., Ltd., リカシッッド MH700, hereinafter referred to as H1; acid anhydride equivalent 168) as a curing agent, use Hexadecyltrimethylammonium hydroxide (manufactured by Tokyo Chemical Industry Co., Ltd., 25% by weight methanol solution, referred to as C1) was mixed as a curing accelerator in the proportions (parts by weight) shown in Table 1 below. After 20 minutes of defoaming, the curable resin composition of the present invention was obtained. In addition, the usage-amount of a hardening|curing agent is calculated by 1 equivalent with respect to 1 equivalent of epoxy groups of an epoxy resin.

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Abstract

The invention aims to provide a curable resin composition for encapsulating an optical semiconductor and a cured product thereof, which can prevent sinking after curing and have excellent property of etchant gas resistance and excellent dyeing resisting property. The curable resin composition contains epoxy resin, solidifying agent and / or solidifying booster expressed by formula (1) (in the formula, a plurality of R1 can be same or different and can independently present hydrogen atom or methyl). The curable resin composition of the invention, used as the optimized solidifying agent cyclohexane-1, 3, 4-triformic-3, 4-anhydride and methyl hexahydrophthalic anhydride, has particular effect in preventing sinking after curing.

Description

technical field [0001] The present invention relates to a curable resin composition suitable for electrical and electronic material applications, particularly optical semiconductor applications, its cured product, and an optical semiconductor device including the cured product. Background technique [0002] Conventionally, an epoxy resin composition has been used in consideration of the balance between performance and economy as a sealing material for optical semiconductor elements such as LED products. Glycidyl ether-type epoxy resin compositions typified by bisphenol A-type epoxy resins that are particularly excellent in the balance of heat resistance, transparency, and mechanical properties are widely used. [0003] However, as a result of shortening the emission wavelength of LED products (indicating the situation of 480nm or less in LED products that mainly emit blue light), the sealing material is colored on the LED chip due to the influence of short-wavelength light, ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G59/24C08G59/42C08G59/68C09J163/00H01L33/56
CPCH01L2924/0002
Inventor 川田义浩中西政隆洼木健一宫川直房佐佐木智江青木静铃木瑞观小柳敬夫
Owner NIPPON KAYAKU CO LTD
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