Heat conduction insulating casting glue and preparation method thereof

A technology of heat conduction insulation and pouring glue, which is applied in the direction of inorganic insulators, chemical instruments and methods, heat exchange materials, etc. It can solve the problems that affect the performance and use requirements of castable glue, the fillers are prone to agglomeration and settlement, and the pouring process of heat conduction glue is poor. , to achieve the effect of improving crack resistance and impact strength, good salt spray resistance and moisture resistance, and good manufacturability

Active Publication Date: 2013-05-08
GUILIN ELECTRICAL EQUIP SCI RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The Chinese invention patent of 200510035368.2 "thermally conductive adhesive and its preparation method" and the Chinese invention patent of 200910037710.0 "an epoxy resin composition, an adhesive film made using it and its production method" require the use of solvents, which are easy to cause environmental damage. Pollution; 200710189891.X's Chinese invention patent "low temperature, high thermal conductivity, electrical insulation epoxy resin nanocomposite preparation process" mainly adds nano powder, which is costly and requires ultrasonic dispersion, making it difficult to achieve industrial scale production
[0003] In short, the existing thermally conductive adhesive solution is basically to add thermally conductive fillers to the original insulating material matrix to achieve the purpose of improving thermal conductivity. The existing problems are: the viscosity of the resin composition used is relatively high, and the viscosity is greater after adding fillers, and the fillers are prone to agglomeration Settlement, and the amount of thermally conductive filler added is limited, which affects the improvement of the thermal conductivity of the obtained material
In addition, due to the poor pouring process of the obtained thermal conductive adhesive, defects are easily formed during the curing process, which seriously affects the performance and use requirements of the castable adhesive.

Method used

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  • Heat conduction insulating casting glue and preparation method thereof
  • Heat conduction insulating casting glue and preparation method thereof
  • Heat conduction insulating casting glue and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] The main components of the thermally conductive and insulating castable glue in this example are as follows:

[0035] 85g of hydantoin epoxy resin in component A; 15g of hyperbranched polyether polyol toughening agent. The hydantoin epoxy resin used contains five-membered diaza rings, and its molecular structural formula is:

[0036]

[0037] B component, methyl hexahydrophthalic anhydride 60g;

[0038] C component, 300 mesh boron nitride 50g, 400 mesh silicon powder 84g, 800 mesh silicon powder 66g;

[0039] The preparation process of the thermally conductive and insulating pouring glue in this example is as follows;

[0040] 1. Weigh 85g of hydantoin epoxy resin and 15g of hyperbranched polyether polyol toughening agent, and mix it for 30 minutes at 15°C, which is component A;

[0041] II. Take 60g of methyl hexahydrophthalic anhydride as component B of the anhydride curing agent

[0042] III. Add component B to component A and mix for 40 minutes at 20°C;

[00...

Embodiment 2

[0047] The main components of the thermally conductive and insulating castable glue in this example are as follows:

[0048] A component hydantoin epoxy resin 90g; hyperbranched polyether polyols toughening agent 10g, hydantoin epoxy resin used is the same as example 1;

[0049] B component tetrahydrophthalic anhydride 45g, methyl hexahydrophthalic anhydride 35g, methyl nadic anhydride 30g;

[0050] Component C: 100g of 400-mesh silicon micropowder, 78g of 400-mesh alumina, 102g of 800-mesh alumina, 50g of 300-mesh boron nitride, and 50g of 700-mesh aluminum nitride.

[0051] The preparation process of the thermally conductive and insulating pouring glue in this example is as follows;

[0052] 1. Weigh 90g of hydantoin epoxy resin and 10g of hyperbranched polyether polyol toughening agent, and mix it for 25 minutes at 20°C, which is component A;

[0053] II. Take 45g of tetrahydrophthalic anhydride, 35g of methyl hexahydrophthalic anhydride, and 30g of methyl nadic anhydride a...

Embodiment 3

[0059] The main components of the thermally conductive and insulating castable glue in this example are as follows:

[0060] A component hydantoin epoxy resin 87g; hyperbranched polyether polyols toughening agent 13g, used hydantoin epoxy resin is the same as example 1;

[0061] B component hexahydrophthalic anhydride 50g, methyl tetrahydrophthalic anhydride 40g;

[0062] Component C: 100g of 400-mesh silica powder, 120g of 400-mesh alumina, and 130g of 800-mesh alumina.

[0063] The preparation process of the thermally conductive and insulating pouring glue in this example is as follows;

[0064] 1, take hydantoin epoxy resin 87g, hyperbranched polyether polyols toughening agent 13g, mix 25 minutes at 25 ℃, be A component;

[0065] II. Take 50g of hexahydrophthalic anhydride and 40g of methyltetrahydrophthalic anhydride as component B of the anhydride curing agent

[0066] III. Add component B to component A and mix at 40°C for 35 minutes;

[0067] IV. Take 100g of 400-me...

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Abstract

The invention relates to a heat conduction insulating casting glue and a preparation method thereof. The casting compound comprises the following main components in parts by weight: (A) 100 parts of hydantoin epoxy resin, (B) 60-120 parts of anhydride curing agent, and (C) 200-400 parts of inorganic heat conductive filler, wherein the component A (per 100 weight parts) contains 10-15 weight partsof alcohol plasticizer; the component B is one or more of hexahydrophthalic anhydride, tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride and methylnadic anhydride; and the component C is one or more of silica micropowder, aluminum oxide, aluminum nitride and boron nitride in 300-900 meshes. The preparation method of the casting compound comprises the following steps: mixing A and B proportionally; soaking C in ethanol solution of silane coupling agent, dispersing at a high speed, filtering, and oven-drying; heating the mixture of A and B, adding C, mixing, and debubbling; and casing, and curing. The casting compound provided by the invention has low viscosity, greatly improved heat-conducting property and improved mechanical properties, and is convenient in casting. The preparation method of the casting compound is solvent-free, and has no pollution to the environment.

Description

(1) Technical field [0001] The invention relates to the technical field of insulating materials, in particular to a heat-conducting and insulating casting glue and a preparation method thereof. (2) Background technology [0002] In recent years, due to the increase in power and integration of products in the motor and electronics manufacturing industries, in order to quickly dissipate the heat generated when the products are in use, ensure product safety, and improve service life, the insulation material industry requires the insulation structure and insulation of motors and electrical appliances. The thermal conductivity of materials is increasingly concerned, and the research on high thermal conductivity products has become a hot spot. The main insulation material with high thermal conductivity has been researched for more than ten years. In the past two years, products such as high thermal conductivity wire-covered flat wire, high thermal conductivity row insulation, high...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08G59/42C08G59/26C08K9/06C08K3/02C08K3/22C08K3/28C08K3/38H01B3/02C09K5/14
Inventor 周键黄孙息陈求索王轶
Owner GUILIN ELECTRICAL EQUIP SCI RES INST
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