Epoxy-group-containing copolymer, epoxy (methyl) acrylate copolymer using same, and processes for producing copolymers

A manufacturing method and acrylate technology, applied in plastic/resin/wax insulators, organic insulators, etc., can solve the reduction of mechanical properties such as the strength and elongation of the cured product, the reduction of the strength and elongation of the cured product, and the chemical structure. Low molecular weight, etc.

Inactive Publication Date: 2011-06-29
SHOWA DENKO KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0014] But the method of simply controlling the molecular weight, as the molecular weight of the unsaturated polyester resin becomes lower, the mechanical properties such as the strength and elongation of the obtained cured product will decrease, and the polyester terminal groups (hydroxyl, carboxyl) will also increase, which causes The problem that the water resistance of the obtained cured product is greatly reduced
[0015] In addition, in the case of a dicyclopentadiene-modified unsaturated polyester resin whose molecular terminals are blocked with dicyclopentadiene in order to reduce the amount of hydrophilic terminal groups, the dicyclopentadiene-modified unsaturated polyester resin Due to the low chemical structure and molecular weight of ester resin, mechanical properties such as strength and elongation of the obtained cured product often decrease

Method used

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  • Epoxy-group-containing copolymer, epoxy (methyl) acrylate copolymer using same, and processes for producing copolymers
  • Epoxy-group-containing copolymer, epoxy (methyl) acrylate copolymer using same, and processes for producing copolymers
  • Epoxy-group-containing copolymer, epoxy (methyl) acrylate copolymer using same, and processes for producing copolymers

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0167]In the PPV-4060 personalized organic synthesis device (simple autoclave) of Tokyo Physical and Chemical Machinery, add 3,4-epoxycyclohexane-1-allyl carboxylate (hereinafter referred to as "CEA") 9.11g (50mmol ), 36.6 g of 1-decene (Linialen-10, manufactured by Idemitsu Kosan Co., Ltd., purity 96.6% 250 mmol), 2.238 g of di-tert-butyl peroxide (Parbuchol-D, manufactured by NOF Corporation, purity 98%, 15 mmol), and after nitrogen replacement, the reaction vessel was sealed and reacted at 144° C. for 3 hours. After the reaction, use the 6850 series II gas chromatograph (GC) produced by Agilent Technologies to measure the residual amount of monomers. As a result, 55.8% of allyl 3,4-epoxycyclohexane-1-carboxylate has reacted, 1-decane 25.4% of ene was reacted (the copolymerization ratio is 1:2.28). GPC analysis showed that the number average molecular weight was 1230 and the weight average molecular weight was 1980. In addition, CEA used as a raw material was manufactured b...

Embodiment 2～24

[0173] Use various epoxy-containing monomers (the first monomer) and olefins (the second monomer), change the polymerization conditions, and polymerize under the same condition that the feed weight is about 50g as in Example 1, the obtained results together with The results of Example 1 are shown in Table 1 below. It was found that copolymerization proceeded under any conditions.

[0174] [Table 1]

[0175]

[0176] パヘキサ-TMH: 1,1-(di-tert-hexylperoxide)-3,3,5-trimethylcyclohexane

[0177] [Evaluation of Thermosetting Composition for Cover Layer]

[0178]

Embodiment 25

[0180] Components other than the fluorine-based surfactant and the leveling agent among the components shown below were blended with the copolymer obtained in Example 1, and kneaded using triple rollers. After kneading with 3 rollers, add a surfactant and a leveling agent, and mix with a resin mixer to prepare a thermosetting resin composition.

[0181] Copolymer of Example 1: 28.6 parts by mass

[0182] Acid anhydride: HN-5500E (manufactured by Hitachi Chemical Industries, Ltd.) 8.4 parts by mass

[0183] Curing agent: 0.37 parts by mass of 2E4MZ (manufactured by Shikoku Chemical Industry Co., Ltd.)

[0184] Thixotropic agent: Aerosil R974 (manufactured by Japan Aerosil Co., Ltd.) 1.85 parts by mass

[0185] Barium sulfate: 7.4 parts by mass of B94 (manufactured by Sakai Chemical Industry Co., Ltd.)

[0186] Silicone powder: 1.85 parts by mass of X-52-854 (manufactured by Shin-Etsu Chemical Co., Ltd.)

[0187] Fluorinated surfactant: 0.11 parts by mass of PolyFOX PF6520 (...

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Abstract

Disclosed are a novel epoxy-group-containing copolymer and a process for producing the copolymer. Also disclosed are an epoxy (methyl) acrylate copolymer produced by using an epoxy-group-containing copolymer as a raw material and a process for producing the copolymer. The epoxy-group-containing copolymer comprises a specific epoxy-group-containing repeating unit and an olefin-type repeating unit. The copolymer can be reacted with (methyl) acrylic acid, thereby producing the novel epoxy (methyl) acrylate copolymer.

Description

technical field [0001] The present invention relates to a new epoxy-group-containing copolymer expected to be used in the fields of electrical insulating materials such as solder resists and interlayer insulating films, sealing materials for ICs and super LSIs, and laminated boards, and its production method. In addition, the present invention relates to an epoxy (meth)acrylate copolymer and its production method, which is obtained by reacting the above-mentioned epoxy group-containing copolymer with (meth)acrylic acid, and does not contain styrene or the like It is expected to be used in the fields of electrical insulating materials such as solder resists and interlayer insulating films, sealing materials for ICs and super LSIs, laminated boards, etc., and can be either photocured or thermally cured. In addition to having balanced flexibility and toughness, it is excellent in low dielectric properties, adhesion, water resistance, heat resistance, chemical resistance, and ele...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08F218/12C08F224/00
CPCC08F220/14H01B3/40C08F220/32C08F218/02C08F2810/20C08F8/14C08F224/00C08F220/18C08F218/12
Inventor 内田博大贺一彦藤田俊雄原真尚
Owner SHOWA DENKO KK
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