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Monocrystalline silicon etching solution and application method thereof

A single crystal silicon texturing and texturing liquid technology, applied in chemical instruments and methods, crystal growth, final product manufacturing, etc. The effect of increasing nucleation density and improving efficiency

Active Publication Date: 2011-09-21
CECEP SOLAR ENERGY TECH (ZHENJIANG) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, it has the disadvantage of being volatile and its high price. Therefore, researchers are looking for a better additive or without using additives, and can obtain a uniform "pyramid" suede
No matter what kind of suede liquid is used, the suede with the best effect is between 3 and 6 μm in size, and it is impossible to obtain a more uniform suede

Method used

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  • Monocrystalline silicon etching solution and application method thereof
  • Monocrystalline silicon etching solution and application method thereof
  • Monocrystalline silicon etching solution and application method thereof

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Experimental program
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Embodiment 1

[0023] Embodiment 1: as figure 1 As shown, the monocrystalline silicon texturing solution of the present invention mainly consists of an inorganic alkaline etching solution, a surfactant and alcohols, wherein the inorganic alkaline etching solution is a 2% NaOH aqueous solution by mass percentage, and the surfactant Is the dispersant MF (its molecular formula is C 23 h 18 o 6 S 2 Na 2 ) and naphthalenesulfonic acid formaldehyde condensate, the mass ratio of the dispersant MF and naphthalenesulfonic acid formaldehyde condensate is 5:1, the content of the mixture is 0.3% of the quality of the alkaline corrosion solution, and the alcohols are ethylene glycol Alcohol, the content is 4% of the mass of alkaline corrosion solution.

[0024] When in use, keep the temperature of the texturing solution at 75-85°C, and the corrosion time for 10-20 minutes. The thinning of one side of the silicon wafer is about 3-8 μm.

Embodiment 2

[0025] Embodiment 2: The monocrystalline silicon texturizing liquid of the present invention is mainly composed of inorganic alkaline etching liquid, surfactant and alcohols, wherein the inorganic alkaline etching liquid is 0.4% KOH aqueous solution by mass percentage, and the surface active The agent is dispersant MF (its molecular formula is C 23 h 18 o 6 S 2 Na 2 ) and naphthalenesulfonic acid formaldehyde condensate, the mass ratio of the dispersant MF and naphthalenesulfonic acid formaldehyde condensate is 3:1, the content of the mixture is 0.02% of the alkaline corrosion liquid quality, and the alcohols are isopropyl Alcohol, the content is 0.1% of the mass of alkaline corrosion solution.

[0026] When in use, keep the temperature of the texturing solution at 75-85°C, and the corrosion time for 10-15 minutes. The thinning of one side of the silicon wafer is about 3-8 μm.

Embodiment 3

[0027] Embodiment 3: The monocrystalline silicon texturing liquid of the present invention mainly consists of inorganic alkaline etching liquid, surfactant and alcohols, wherein the inorganic alkaline etching liquid is 4.5% by mass percentage of NaOH and NaOH 2 SiO 3 The mixed aqueous solution, the surfactant is a dispersant MF (its molecular formula is C 23 h 18 o 6 S 2 Na 2 ) and naphthalenesulfonic acid formaldehyde condensate, the mass ratio of the dispersant MF and naphthalenesulfonic acid formaldehyde condensate is 4:1, the mixture content is 0.6% of the alkaline corrosion liquid quality, the alcohols are ethanol, The content is 8% of the mass of alkaline corrosion solution.

[0028] When in use, keep the temperature of the texturing solution at 75-85°C, and the corrosion time for 10-15 minutes. The thinning of one side of the silicon wafer is about 3-8 μm.

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Abstract

The invention discloses a monocrystalline silicon etching solution which comprises an inorganic alkaline etching solution. The invention is characterized in that the inorganic alkaline etching solution contains surfactant and alcohol, wherein the surfactant accounts for 0.02-0.6% by mass of the alkaline etching solution, and the alcohol accounts for 0.1-8% by mass of the alkaline etching solution. By using the invention, the pyramids on the small etched surface of the monocrystalline silicon wafer are uniform, the dimensions of the pyramids are less than 2 mu m, and the small etched surface does not have white spots or obvious traces.

Description

technical field [0001] The invention relates to a monocrystalline silicon solar cell additive texturing liquid and a using method thereof. Background technique [0002] The etchant used for the anisotropic etching of monocrystalline silicon, the currently known solutions are all alkaline solutions, which are generally divided into two categories: one is inorganic etchant, including alkaline solution, such as KOH, NaOH, LiOH, etc.; the other is It is an organic corrosion agent, including EPW (ethylenediamine, phthalic acid and water) and hydrazine (tetramethylammonium hydroxide). These two classes of etchants have very similar corrosion phenomena. [0003] In the alkaline etching process of monocrystalline silicon, the main components of a typical alkaline solution are sodium hydroxide (NaOH), sodium silicate (NaOH) 2 SiO 3 ), isopropanol (IPA) and H 2 O. At a temperature of about 80°C, the following corrosion reactions will occur in the alkaline aqueous solution of sing...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C30B33/10
CPCY02P70/50
Inventor 魏文文勾宪芳吴回君孙晨财陈呈高荣刚王鹏姜利凯
Owner CECEP SOLAR ENERGY TECH (ZHENJIANG) CO LTD
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