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UV-curable organosilicon pressure-sensitive adhesive composition

A silicon pressure-sensitive adhesive and composition technology, applied in the direction of adhesives, etc., can solve the problems of high viscosity of the system, difficulty in coating, difficulty in reaching the degree of cross-linking, etc., and achieve excellent high temperature resistance, increase in cross-linking density and cohesion Effect

Active Publication Date: 2011-10-19
广东宏昌新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Although U.S. Patent (US5091483, Mazurek et al.1992) and Canadian Patent (CA 1185734, Hayes, 1985) respectively use free radical and cationic photoinitiators to prepare UV-curable silicone pressure-sensitive adhesives, the components of the two The organosilicon polymers are all linear molecules, the system has high viscosity and is not easy to coat. At the same time, the number of cross-linkable functional groups in the components is small, and it is difficult to achieve a high degree of cross-linking

Method used

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  • UV-curable organosilicon pressure-sensitive adhesive composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] 1. Preparation of unsaturated hyperbranched polyorganosiloxane:

[0028] Take methyl-bis(dimethyl-vinyl)siloxysilane as AB 2 Type monomer, under chloroplatinic acid catalyzed hydrosilylation reaction to prepare unsaturated hyperbranched polyorganosiloxane. Add 50mL xylene, 10g monomeric methyl-bis(dimethyl-vinyl)siloxysilane and 0.1g chloroplatinic acid catalyst to a 100mL round-bottomed flask successively, and react in a constant temperature oil bath at 60°C with magnetic stirring. Monitor the progress of the reaction by FTIR, when there is no silicon-hydrogen bond characteristic absorption peak in the reaction system (IR: 2159cm -1 )

[0029] end the reaction. Then the solvent xylene was distilled off under reduced pressure to obtain a colorless liquid which was unsaturated hyperbranched polyorganosiloxane. The hyperbranched polyorganosiloxane has a branching degree DB=0.4; a molecular weight Mn=8000. Its synthesis and structure are shown in the following formula...

Embodiment 2

[0034] The UV-curable silicone pressure-sensitive adhesive composition described in this embodiment consists of the following components:

[0035] Example 1 gained unsaturated hyperbranched polyorganosiloxane: 35 grams;

[0036] Methyl vinyl MQ tackifying silicone resin [MQ ratio is 0.8, molecular weight Mn=6000]: 65 grams;

[0037] Photoinitiator: 2-hydroxy-2-methyl-1-phenylacetone: 0.72 grams;

[0038] Catalyst: Dibutyltin dilaurate: 0.15 g.

[0039] The composition is coated on a polyester film with a thickness of 30um, the thickness of the adhesive layer is controlled to be 20um, and placed under a 2KW high-pressure mercury lamp to irradiate for 1.5min at a distance of 15cm to obtain a silicone pressure-sensitive adhesive tape. Initial adhesion performance: 20#; Peel strength: 9.6N / 25mm; Holding performance: 33.4h. The composition was coated on a release film, the thickness of the adhesive layer was controlled to be 50um, and it was placed under a 2KW high-pressure merc...

Embodiment 3

[0041] The UV-curable silicone pressure-sensitive adhesive composition described in this embodiment consists of the following components:

[0042] Example 1 gained unsaturated hyperbranched polyorganosiloxane: 60 grams;

[0043]Methyl vinyl MQ tackifying silicone resin [MQ ratio is 0.6, molecular weight Mn=9000]: 40 grams;

[0044] Photoinitiator: benzoin ether: 0.12 grams;

[0045] Catalyst: 0.9 g of dibutyltin dilaurate.

[0046] The composition is coated on a polyimide film with a thickness of 30um, the thickness of the adhesive layer is controlled to be 20um, and placed under a 2KW high-pressure mercury lamp for 1.5min irradiation at 15cm to prepare a silicone pressure-sensitive adhesive tape. Initial tack: 11#; Peel strength: 13.5N / 25mm; Stickiness: 632h; Temperature resistance: 280°C.

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Abstract

The invention discloses a UV-curable organosilicon pressure-sensitive adhesive composition, mainly comprising the following ingredients: 2-60wt% of nonsaturated hyperbranched organosilicon polymer and 40-98wt% of MQ tackifying silicone resin, radical photoinitiator and catalyst, wherein, and the summation of nonsaturated hyperbranched organosilicon polymer and MQ tackifying silicone resin is 100wt%. The nonsaturated hyperbranched organosilicon polymer is at least one of polysiloxane, carbosilane, silazane or organosilicon polymer containing boron. The UV-curable organosilicon pressure-sensitive adhesive composition prepared by using nonsaturated hyperbranched organosilicon polymer as main ingredient, can significantly improve the crosslinking density and cohesion of the pressure-sensitive adhesive, and allows the organosilicon pressure-sensitive adhesive to have excellent properties of high temperature resistance, solvent resistance and radiation resistance.

Description

technical field [0001] The invention belongs to the field of preparation and application of silicone pressure-sensitive adhesives. In particular, it relates to a UV-curable silicone pressure-sensitive adhesive composition. Background technique [0002] Silicone pressure-sensitive adhesive not only has the good bond strength and initial tack required by conventional pressure-sensitive adhesive products, but also has many unique properties. It is a special adhesive product that can be applied under severe conditions. [0003] Silicone pressure-sensitive adhesives are usually made of silicone rubber, MQ type silicone resin (containing M unit R 3 SiO 1 / 2 and Q link SiO 4 / 2 ), comprehensive catalysts and crosslinking agents, fillers and other additives, and organic solvents. At present, the research systems of silicone pressure-sensitive adhesives at home and abroad mainly include solvent-based, high-solid-content, hot-melt and emulsion-type silicone pressure-sensitive adhesi...

Claims

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Application Information

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IPC IPC(8): C09J183/07C09J183/05C09J183/16C09J183/08
Inventor 唐敏锋吴伟卿
Owner 广东宏昌新材料科技有限公司
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