A method of manufacturing a metal-clad laminate with improved thickness uniformity of the insulating layer

A technology of insulating layer thickness and manufacturing method, which is applied in the field of electronic materials, can solve the problems of winding edge bursting and prepreg deformation, unfavorable processing and production, and uneven force, so as to reduce the generation of substrate impurities, avoid quality control risks, strong continuity effect

Inactive Publication Date: 2011-12-14
SHENGYI TECH SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the thickness of the edge is higher than that of the middle, when the prepreg passes through the parallel rollers in the manufacturing process, it is easy to cause uneven force and discount.
When the prepreg is rolled or the sheet material is stacked, due to the superposition effect of the edge thickness, it will be significantly thicker than the middle area, which will easily cause the edge of the prepreg to burst and the deformation of the prepreg, which is not conducive to subsequent processing and production.
[0013] It can be seen that the thickness uniformity of the insulating layer of metal-clad laminates is a problem that is of great concern to those skilled in the art but has not been well resolved.

Method used

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  • A method of manufacturing a metal-clad laminate with improved thickness uniformity of the insulating layer
  • A method of manufacturing a metal-clad laminate with improved thickness uniformity of the insulating layer
  • A method of manufacturing a metal-clad laminate with improved thickness uniformity of the insulating layer

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Embodiment 1

[0031] Embodiment one: see figure 1 , a method for manufacturing a metal-clad laminate that improves the thickness uniformity of an insulating layer. The process steps include: adding multifunctional epoxy resin, dicyandiamide (DICY for short), dimethylimidazole and a solvent in a certain proportion, Mix the DICY curing system glue; put the unrolled 7628 glass fiber cloth into the glue tank to soak the glue, control the glue content through the metering roller, heat and dry in the oven, and cut it directly with the shearing machine to obtain 1050mm×1265mm (longitude×weft) 7628 RC43% prepreg, the curing degree of the whole prepreg is controlled at 47±1.5%; when shearing, the prepreg is partially baked by the IR heating and baking device, and the prepreg is surrounded by 7± The curing degree of the resin within the 2mm edge area is increased to 63±2% and 72±2% respectively, and the prepreg after baking is as attached figure 1As shown, 1 is the edge area after baking, 2 is the n...

Embodiment 1-a

[0032] Example 1-a: Take a 7628 prepreg with a curing degree of 63±2% in the range of 7±2mm in the edge area, and the curing degree of the resin in the middle area is 47±1.5%, and the thickness of the laminated insulating layer is 1×7628. A thin core board of about 0.20mm is covered with 35 micron thick copper foil (hereinafter referred to as 1OZ copper foil) on both sides, and sent to a laminator to heat and pressurize to form a copper-clad laminate. The lamination and pressing process of Comparative Example 1-a is basically similar to that of Example 1-a, except that the edge area of ​​the prepreg used is not baked, and the curing degree of the entire width is controlled at 47±1.5%.

Embodiment 1-b

[0033] Example 1-b: Take 7628 prepregs with a curing degree of 72±2% in the range of 7±2mm in the edge region, and the curing degree of the resin in the middle region is 47±1.5%, and the thickness of the laminated boards according to 5×7628 is 1.0 The copper clad laminate of about mm is covered with 18 micron thick copper foil (hereinafter referred to as 0.5OZ copper foil) on both sides, and sent to the laminator to heat and pressurize to form a copper clad laminate. The lamination and pressing process of Comparative Example 1-b is basically similar to that of Example 1-b, except that the edge area of ​​the prepreg used in it is not baked, and the curing degree of the entire width is controlled at 47±1.5%.

[0034] After cutting the glued edge of the plate, that is, the non-working area, a finished plate with a shipping size of 1016mm×1219.2mm (longitude×weft) is obtained. Use a 1-inch micrometer to detect about 30 plates of the two thickness specifications prepared under the ...

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Abstract

The invention discloses a method for manufacturing a metal foil-clad laminate that improves the thickness uniformity of an insulating layer. The process steps include: putting unrolled glass fiber cloth into a glue tank to soak the glue solution, controlling the glue solution content through metering rollers, After being heated and dried in an oven, cut to obtain prepregs of specified size, stack one or more prepregs, cover one or both sides with copper foil or other metal foils, and send them to the laminator for heating and pressure , press-molded metal foil-clad laminate, characterized in that: before the prepreg is wound and cut, the curing degree of the resin in the edge area around the prepreg is increased to 60% to 80% by setting a heating and baking device for partial baking , the width of the peripheral edge area is 5-30 mm. The invention significantly improves the uniformity and consistency of the thickness of various places in the working area of ​​the plate, and satisfies customers' increasingly stringent requirements for assembly processing accuracy and impedance characteristics of the metal foil-clad laminate.

Description

technical field [0001] The invention relates to a method for manufacturing a metal-foil-clad laminate, in particular to a method for manufacturing a resin-glass fiber cloth-based composite material-clad laminate; it belongs to the technical field of electronic materials. Background technique [0002] With the rapid development of electronic technology, the printed circuit board (PCB) is constantly developing in the direction of denser lines and thinner layers. Strict control requirements, so the requirements for the accuracy of the thickness of the insulating layer of the base material (also known as the dielectric layer) are becoming more and more stringent. As a substrate material in PCB manufacturing, metal-clad laminates mainly have three functions of conductivity, insulation and support, and play a leading role in the performance, quality, processability, manufacturing level, manufacturing cost and long-term reliability of PCBs. [0003] In the traditional metal foil-c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B15/08B32B17/04B32B37/12B32B38/04B32B38/08B32B38/16
Inventor 李雪肖升高陈诚张明军罗鹏辉崔春梅段志刚
Owner SHENGYI TECH SUZHOU
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