Back point contact crystalline silicon solar cell and preparation method thereof
A technology of point contact on the back and solar cells, applied in the direction of circuits, photovoltaic power generation, electrical components, etc., can solve the problems of suboptimal passivation effect, easy overflow of silicon nitride hydrogen, weakened passivation effect, etc., to achieve enhanced anti-corrosion Effects of UV radiation performance, reduction of reflection, and improvement of photoelectric conversion efficiency
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[0039] Steps §1, §2, §3, §5, §7 and §8 are all traditional crystalline silicon cell preparation processes, and the process parameters are different.
[0040] §1 figure 2 a, Use the general single crystal silicon cleaning method, that is, sodium hydroxide + isopropanol (NaOH + IPA) solution to remove the surface damage of P-type CZ silicon and make texture to form an anti-reflection structure and chemical cleaning; P-type CZ silicon wafer 125 monocrystalline silicon wafers for industrial use, resistivity 0.5-5Ωcm, thickness 180-220um;
[0041] §2 figure 2 b, Diffusion in a POCl3 atmosphere to form an n+ emitter and remove the surrounding pn junction and phosphosilicate glass to form a pn+ junction silicon substrate with a pn+ structure;
[0042] §3 figure 2 c, a 70nm amorphous silicon nitride film with a refractive index of 2.3 was deposited on the surface of the n+ emitter by conventional direct PECVD;
[0043] §4 Use HF acid to clean the surface of the structure obtain...
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