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Photosensitive composition adopting composite dissolution-resistant agent/dissolution inhibitor and application of same

A solubilizer and composition technology, which is applied in the application field of positive thermal CTP plates, can solve the problems of difficult and difficult synthesis of polymer compounds, short service life of photosensitive compositions, etc., and achieve good batch stability, Improved storage stability and process stability

Active Publication Date: 2012-01-11
LUCKY HUAGUANG GRAPHICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the problem of short service life of photosensitive compositions has not been well resolved
In addition, the synthesis of this polymer compound is also difficult, and it is still difficult to directly apply this scheme to conventional positive-working thermosensitive CTP plates.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] Preparation method of positive thermal CTP plate

[0027] (1) Preparation of aluminum plate base:

[0028] An aluminum plate with a thickness of 0.28mm is subjected to degreasing treatment for 40 seconds in a 7wt% sodium hydroxide aqueous solution at a temperature of 55°C. Use sine wave alternating current for electrolytic treatment, 50HZ alternating current, current 50A / dm 2 , the electrolysis time is 60 seconds, control Ra=0.3-0.6um, preferably 0.4-0.6um, .Rz (H) The value is 2~3μm. Then, at a temperature of 60°C, deslagging treatment was performed for 10 seconds in a 50wt% aqueous solution of sodium hydroxide, and then at a temperature of 25°C, the current density was 5A / d m 2 , the concentration is 20wt% sulfuric acid solution for 40 seconds, control oxide film = 2.5-3.5g / m 2 . Finally, at 60 °C with NaH 2 PO 4 -NaF solution is sealed for 30 seconds to obtain an aluminum base suitable for a lithographic printing plate.

[0029] (2) Apply the prepared photose...

Embodiment 2

[0052] The photosensitive composition is shown in Table 4:

[0053] Table four

[0054] BTB29 resin (Weihai Tiancheng Chemical Co., Ltd.) 0.87g Infrared absorbing dye LC-01 (Honywell company) 0.02g Succinic anhydride ammonium acid ammonium salt 0.0075g p-toluenesulfonyl hydrazide cyclohexanone hydrazone 0.03g methyl violet 0.02g Solvent: Propylene Glycol Ether Acetate 10g

[0055] The above-mentioned photosensitive lithographic plate is installed on the plate-making machine for exposure. The alkaline developer TPD-II (manufactured by Lucky Group No. 2 Film) was used to develop at 25°C for 30 seconds. The results of sensitivity, development latitude and stability of the photosensitive composition in the solvent are shown in Table 9.

Embodiment 3

[0057] The photosensitive composition is shown in Table 5:

[0058] Table five

[0059] BTB29 resin (Weihai Tiancheng Chemical Co., Ltd.) 0.87g Infrared absorbing dye LC-01 (Honywell company) 0.02g Ammonium Phthalic Anhydride Amic Acid 0.008g

[0060] p-toluenesulfonyl hydrazide cyclohexanone hydrazone 0.0295g methyl violet 0.02g Solvent: Propylene Glycol Ether Acetate 10g

[0061] The above-mentioned photosensitive lithographic plate is installed on the plate-making machine for exposure. The alkaline developer TPD-II (manufactured by Lucky Group No. 2 Film) was used to develop at 25°C for 30 seconds. The results of sensitivity, development latitude and stability of the photosensitive composition in the solvent are shown in Table 9.

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Abstract

The invention discloses a photosensitive composition adopting a composite dissolution-resistant agent / dissolution inhibitor, which comprises the dissolution-resistant agent / dissolution inhibitor, alkali soluble linear phenolic resin, an infrared absorbing dye, a background dye and a solvent, and the dissolution-resistant agent / dissolution inhibitor comprises a sulfonyl hydrazone compound and an ammonia amide salt. Since the chemical reaction type dissolution-resistant agent / dissolution inhibitor formed via compounding of the sulfonyl hydrazone compound and the ammonia amide salt is adopted, and the pH value of the prepared photosensitive composition, coating solution, for the thermosensitive CTP (cytidine triphosphate) plate changes little along with the time, the service life of the photosensitive composition, coating solution, is prolonged to be 7 days and even more than two weeks from 3-4 days when only the sulfonyl hydrazone compound is adopted, and the pH value of the photosensitive composition is still maintained higher than the initial pH value of the photosensitive composition, coating solution, prepared with the original proportion. The thermal sensitivity, resolution line width and developing tolerance of a thermosensitive layer obtained via coating and the storage stability of the plate are superior to or no interior to the effects when only the sulfonyl hydrazone compound is adopted.

Description

technical field [0001] The invention relates to a photosensitive composition, in particular to a photosensitive composition using a compound solvent-resisting / solvent-promoting composition and its application in positive-working thermosensitive CTP plates. Background technique [0002] The solvent-resistant compounds used in traditional positive thermal CTP plates are sulfonate esters, phosphate esters, aromatic esters, aromatic sulfonate esters, aromatic disulfones, carboxylic anhydrides, aromatic ketones, aromatic aldehydes, aromatic amines, aromatic Esters, these compounds can be used alone or in combination. For example, U.S. Patent No. 410207 discloses the effect of a solvent-repelling agent in the formula, and the component added with the solvent-repelling agent has no effect on the exposed part but is effective on the unexposed part. Moreover, it can be seen from the comparison between the exposed part and the unexposed part that the repellent has the characteristic ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/004G03F7/09
Inventor 滕方迁余尚先门红伟李合成冯磊焦红军
Owner LUCKY HUAGUANG GRAPHICS
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