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Preparation method for high-temperature resistant copper foil adhesive

A technology of high temperature resistance and copper foil adhesive, which is applied in the field of preparation of organic polymer adhesives, can solve the problems of unsatisfactory heat resistance, high toxicity, and high price, and achieve the effects of low cost, convenient operation, and convenient source

Active Publication Date: 2012-11-28
HUNAN HENGYUAN NEW MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

1,4-bis(2,4-diaminophenoxy) benzene aromatic polyamine curing agent is added in an amount of 15-20% (mass percentage) of the novolac epoxy resin, and the obtained adhesive system has good manufacturability, tensile The shear strength is as high as 25MPa, but its heat resistance is not ideal enough
[0007] Bismaleimide resin is another type of resin system derived from polyimide resin system. Imide is a bifunctional compound with active terminal group, which has similar fluidity and moldability to epoxy resin. However, it cannot be dissolved in common organic solvents such as acetone, ethanol, and chloroform, and can only be dissolved in highly polar, toxic, and expensive solvents such as dimethylformamide (DMF), IV-methylpyrrolidone, etc. , so how to improve solubility is an important content of BMI modification

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] A preparation method of high-temperature-resistant copper foil adhesive, which is prepared by mixing component A, component B and compounding additives, wherein:

[0023] 1. The preparation method of component A, specifically comprising the following steps:

[0024] (1) Add 24.6Kg epoxy resin CYD-128, 13.2Kg acrylic acid monomer, 21.9Kg epoxy 604#, 80g triethylamine, 6g hydroquinone, 44.4Kg toluene to the reactor, heat up to 120°C, Back flow insulation 7.5hr, obtain material A;

[0025] (2) Slowly add 2.0Kg of maleic anhydride to material A, keep warm at 120°C for 2 hours after the addition, steam out 14kg of toluene, then add 6Kg of formamide, and discharge to obtain component A for later use;

[0026] 2. The preparation method of component B specifically comprises the following steps:

[0027] (1) Add 14Kg of diamine and 8Kg of formamide into the reaction kettle and mix well, then heat to 80°C and stir until transparent.

[0028] (2) Add 52.1Kg of bismaleimide resi...

Embodiment 2

[0031] A preparation method of high-temperature-resistant copper foil adhesive, which is prepared by mixing component A, component B and compounding additives, wherein:

[0032] 1. The preparation method of component A, specifically comprising the following steps:

[0033] (1) Add 34.6Kg epoxy resin CYD-128, 17.2Kg acrylic acid monomer, 11.9Kg epoxy 604#, 96g triethylamine, 8g hydroquinone, 35.6Kg toluene to the reactor, heat up to 120°C, Back flow insulation 7.5hr, obtain material A;

[0034] (2) Slowly add 2.8Kg of maleic anhydride to material A, after the addition, keep warm at 120°C for 2 hours, steam out 15kg of toluene, then add 10Kg of formamide, and discharge to obtain component A for later use;

[0035] 2. The preparation method of component B specifically comprises the following steps:

[0036] (1) Add 10Kg of diamine and 12Kg of formamide into the reaction kettle and mix well, then heat to 80°C and stir until transparent.

[0037] (2) Add 52.1Kg of bismaleimide r...

Embodiment 3

[0040] A preparation method of high-temperature-resistant copper foil adhesive, which is prepared by mixing component A, component B and compounding additives, wherein:

[0041] 1. The preparation method of component A, specifically comprising the following steps:

[0042] (1) Add 29.6Kg epoxy resin CYD-128, 15.2Kg acrylic acid monomer, 16.9Kg epoxy 604#, 88g triethylamine, 7g hydroquinone, 40Kg toluene to the reaction kettle, heat up to 120°C, reflux Heat preservation for 7.5hr to obtain material A;

[0043] (2) Slowly add 2.4Kg of maleic anhydride to material A, after the addition, keep warm at 120°C for 2 hours, steam 15kg of toluene, then add 8Kg of formamide, and discharge to obtain component A for later use;

[0044] 2. The preparation method of component B specifically comprises the following steps:

[0045] (1) Add 12Kg of diamine and 10Kg of formamide into the reaction kettle and mix well, then heat to 80°C and stir until transparent.

[0046] (2) Add 52.1Kg of bis...

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Abstract

The invention discloses a preparation method for a high-temperature resistant copper foil adhesive. The preparation method comprises the following steps: preparing an epoxy acrylate adhesive by taking hydroxyl-containing epoxy resin and acrylic acid as main raw materials; preparing a bismaleimide adhesive by taking bismaleimide resin as a raw material; and mixing the adhesives prepared from the first and second steps according to a certain proportion, adding auxiliaries and then diluting, thereby acquiring a target product, namely the high-temperature resistant copper foil adhesive. The high-temperature resistant copper foil adhesive prepared by using the preparation method provided by the invention has the advantages of excellent viscosity controllability, wider adjustment scope, excellent manufacturability, thermolysis temperature Tonset more than 300 DEG C, excellent property for splicing a metal copper-copper substrate and a copper-phenolichydroxyl polyimide film, stretching shearstrength reaching up to 30MPa, and 90-degree peel strength reaching up to 2.0kg / cm (substrate: copper-phenolichydroxyl polyimide film).

Description

technical field [0001] The invention relates to a preparation method of an organic polymer adhesive, in particular to a preparation method of a high temperature resistant copper foil adhesive. Background technique [0002] As we all know, epoxy resin has many good properties: (1) Good bonding performance: high bonding strength, wide bonding surface, it is compatible with many metals (such as iron, steel, copper, aluminum, metal alloys, etc.) The bonding strength of metal materials (such as glass, ceramics, wood, plastics, etc.) is very high, and some even exceed the strength of the bonded material itself, so it can be used in many stressed structural parts and is the main component of structural adhesives one. (2) Good processing performance, the flexibility of epoxy resin formula, the diversity of processing technology and product performance are the most prominent among polymer materials; (3) Good stability performance: the curing of epoxy resin mainly depends on the envi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/10C09J179/08
Inventor 高禄生
Owner HUNAN HENGYUAN NEW MATERIAL TECH CO LTD