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Preparation method of composite conductive shielding materials

A technology of shielding materials and composite conduction, which is applied in metal material coating process, liquid chemical plating, coating, etc., can solve the problems of high cost of silver plating, long process route, large equipment investment, etc., and achieve small equipment investment, The effect of short process and low operating cost

Inactive Publication Date: 2012-03-14
山东中特防科技发展有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The direct chemical silver plating process is relatively simple, but in order to achieve conductive and shielding performance, the thickness of the silver plating layer and the amount of silver deposited per unit area must be increased. Moreover, the current chemical silver plating baths are all disposable baths, which greatly increases the cost of silver plating. Improvement; magnetron sputtering copper-electroplating copper-electroplating silver process route is long, equipment investment is large, and the widely used electroplating silver process is still cyanide silver plating, which does not meet the current clean production requirements; chemical copper plating-electrosilver plating cost Low, but electroless copper plating mainly adopts formaldehyde reduction method, which is very harmful to the environment and human body, and is also restricted by the electroplating silver process

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] In this embodiment, nylon is used as the base material, the length of the base material is 100-500m, the width is 0.6m-1.5m, and the weight is 40-60g / m 2 , the preparation steps are as follows:

[0020] 1. Chemical pretreatment: The substrate is chemically pretreated in a chemical solution of hydrochloric acid 8ml / l, palladium chloride 0.3g / l and stannous chloride 10g / l, the treatment time is 10-15min, and the treatment temperature is 20 -35℃, in this process, under the action of acid, the surface of the substrate is corroded and roughened, and at the same time, palladium salt is used to form active particles, which form crystal nuclei for electroless copper plating, and are formed by continuous and dense copper plating. This process The coarsening, sensitization, and activation are treated at one time, which shortens the process flow and improves production efficiency.

[0021] 2. Electroless copper plating: the composition of the plating solution used is: CuSO 4 .5H...

Embodiment 2

[0027] In the present embodiment, polyester is used as the base material, and the preparation steps are as follows: other steps remain unchanged, and the formula of the treatment solution in the chemical pretreatment is changed as follows: hydrochloric acid 15ml / l, palladium chloride 0.4g / l and tin protochloride 16g / l l; The electroless copper plating formula is changed to the following: CuSO 4 .5H 2 O 12 g / L, potassium sodium tartrate 18 g / L, sodium citrate 20 g / L, 2-mercaptobenzothiazole 0.6 g / L, sodium hypophosphite 30 g / L, the bath temperature is 60°C, and the solution is PH=7-10, chemical plating time is 20-40min; chemical silver plating formula is changed as follows: silver nitrate 10g / L, potassium metabisulfite 25g / L, sodium thiosulfate 80g / L, hydantoin 2g / L L, the solution is pH=3.0-5.5, the temperature of the plating solution is normal temperature, and the electroless plating time is 5 minutes; the components of the treatment solution used in the anti-discoloration t...

Embodiment 3

[0031] Adopt sponge to be base material in the present embodiment, preparation steps are as follows: Other steps are unchanged, and the treatment solution formula in the chemical pretreatment is changed as follows: hydrochloric acid 12ml / l, palladium chloride 0.1g / l and tin protochloride 12g / l l; The electroless copper plating formula is changed to the following: CuSO 4 .5H 2 O 10g / L, potassium sodium tartrate 33 g / L, sodium citrate 28g / L, 2-mercaptobenzothiazole 0.5 g / L, sodium hypophosphite 15-30 g / L, bath temperature is 60°C, solution PH=7-10, chemical plating time is 20-40min; chemical silver plating formula is changed as follows: silver nitrate 18g / L, potassium metabisulfite 25g / L, sodium thiosulfate 120g / L, hydantoin 5g / L, the solution is pH=3.0-5.5, the temperature of the plating solution is normal temperature, and the electroless plating time is 5 minutes; PH=4-6, place at room temperature for 4-5min.

[0032] The test results are as follows: Weight: 55-75 g / m afte...

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PUM

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Abstract

The invention provides a preparation method of composite conductive shielding materials, which completely adopts a chemical deposition method for preparation. The method has the obvious advantages that the flow process is short, the cost is low, and the environment is protected. The method adopts the following technical scheme that the preparation method of the composite conductive shielding materials is characterized in that a copper layer and a silver layer are coated and plated on the surface of polyester or polyamide nonconductive materials by the chemical deposition method. The method has the process flow that the surface chemical pretreatment, the chemical copper plating, the water cleaning, the chemical silver plating and the color degradation prevention treatment are carried out on the surfaces of the polyester or polyamide nonconductive materials, the chemical pretreatment process is carried out in chemical solution containing 8 to 15ml / l of hydrochloric acid, 0.1 to 0.6g / l of palladium chloride and 10 to 16g / l of stannous chloride, the treatment time is 10 to 15min, and the treatment temperature is 20 to 35 DEG C.

Description

technical field [0001] The invention relates to a preparation method of a composite conductive shielding material, which belongs to the technical field of surface treatment of non-metallic materials. Background technique [0002] Shielding material is the use of shielding (materials with specific properties) to prevent or attenuate the transmission channel of interference energy, thereby suppressing electromagnetic interference. Shielding serves two purposes: to limit the leakage of electromagnetic energy radiated internally, and to prevent the entry of external radiated interference. Because the shielding material absorbs energy (eddy current loss), reflects energy (reflects electromagnetic waves at the interface of the interface body) and counteracts energy (electromagnetic induction generates a reverse electric field on the shield body, which can offset part of the electromagnetic interference wave from the outside and the internal electromagnetic wave. Electromagnetic w...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/24C23C18/28C23C18/40C23C18/42
Inventor 冯立明孙延明刘延庆杨茂德
Owner 山东中特防科技发展有限公司
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