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Ultraviolet laser solidification rapid-prototyping photosensitive resin and manufacture method thereof

A technology of photosensitive resin and ultraviolet laser, which is applied in the direction of photosensitive materials used in optomechanical equipment, optomechanical equipment, optics, etc., to achieve the effect of good photosensitivity and high precision

Inactive Publication Date: 2012-03-21
NANCHANG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, this patent also appears to be somewhat insufficient

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] 1. Add 3,4-epoxycyclohexylcarboxylic acid-3 ， ,4 ， - Cyclohexyl methyl ester 1300g, 3,3-[oxybismethylene]-bis[3-ethyl]oxetane 400g, bisphenol A type epoxy acrylate (EA-612) 500g gram, polycaprolactone triol (Polyol0301) 330 grams, trimethylolpropane triacrylate 100 grams, 1,4-cyclohexyl dimethanol divinyl ether 100 grams, benzoin dimethyl ether 100 grams, triaryl Sulfonium hexafluoroantimonate 170 g.

[0033] 2. Heat to 50°C and stir for 30 minutes to make it into a transparent light yellow uniform liquid, which is a prepared photosensitive resin. Measure its critical exposure E c 11.2 mJ / cm 2 , The test method is the method reported in "Zhao Yi. Experimental Research on Properties of Photosensitive Resin in Laser Rapid Prototyping [J]. Polymer Materials Science and Engineering, 2004, 20 (1): 184-186".

[0034] 3. Utilize the SLA-3500 UV laser curing rapid prototyping equipment produced by 3D Systems to make some test pieces, and then post-cure these test pieces fo...

Embodiment 2

[0036] 1. Add 3,4-epoxycyclohexylcarboxylic acid-3 ， ,4 ， - 1200 grams of cyclohexyl methyl ester, 400 grams of 1,4-bis[(3-ethyl-3-oxymethyleneoxetane)methyl]benzene, bisphenol A type epoxy resin (E-51 ) 100 g, pentaerythritol triacrylate 600 g, polycaprolactone diol (Polyol0201) 320 g, 1,4-butanediol diglycidyl ether 100 g, 2-hydroxy-2-methyl-1-benzene Base-1-acetone 100 grams, triarylsulfonium hexafluoroantimonate 180 grams.

[0037] 2. Heat to 40°C and stir for 30 minutes to make it into a transparent light yellow uniform liquid, which is a prepared photosensitive resin. Measure its critical exposure E c 12.4 mJ / cm 2 .

[0038] 3. Utilize the SLA-3500 UV laser curing rapid prototyping equipment produced by 3D Systems to make some test pieces, and then post-cure these test pieces for 90 minutes in a UV box with a power of 500 milliwatts. Their warpage factors CF(6)=0.01, CF(11)=0.03 were measured.

Embodiment 3

[0040] 1. Add 3,4-epoxycyclohexylcarboxylic acid-3 ， ,4 ， - Cyclohexyl Methyl Ester 1000g, Bisphenol A Type Epoxy Resin (E-51) 650g, Tripropylene Glycol Diacrylate 350g, Polycaprolactone Triol (Polyol 0301) 200g, Trimethylolpropane Tris 300 grams of acrylate, 210 grams of triethylene glycol divinyl ether, 100 grams of benzoin dimethyl ether, and 190 grams of triarylsulfonium hexafluoroantimonate.

[0041] 2. Heat to 50°C and stir for 20 minutes to make it into a transparent light yellow uniform liquid, which is a prepared photosensitive resin. Measure its critical exposure E c 12.9 mJ / cm 2 .

[0042] 3. Utilize the SLA-3500 UV laser curing rapid prototyping equipment produced by 3D Systems to make some test pieces, and then post-cure these test pieces for 90 minutes in a UV box with a power of 500 milliwatts. Their warpage factors CF(6)=-0.01, CF(11)=0.03 were measured.

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Abstract

The invention discloses an ultraviolet laser solidification rapid-prototyping photosensitive resin and a manufacture method thereof. The ultraviolet laser solidification rapid-prototyping photosensitive resin comprises the following components in mass ratio: 5-80% of epoxy resin, 0-65% of oxetane compound, 1-12% of cationic initiator, 1-40% of hydroxy organic compound, 0-55% of unsaturated oligmer containing C-C double bonds, 0-35% of unsaturated monomer containing C-C double bonds, 0-20% of glycidyl ether or epoxy diluent with low molecular weight and 0-10% of free redical type photopolymerization initiator. The manufacture method comprises the following steps: mixing the raw materials in the mass ratio, heating at 20-80DEG C, and stirring for 5-120 minutes to obtain transparent faint yellow uniform liquid. The photosensitive resin disclosed by the invention has good photosensitiveness, and the critical exposure Ec is less than 15mJ / cm<2>; a formed part has high precision; the camber factor CF(6) of the formed part is between-0.01 and 0.01; and the camber factor CF (11) is between -0.03 and 0.03. The photosensitive resin disclosed by the invention can be directly manufactured into any part with complex shape, high precision and low cost.

Description

technical field [0001] The invention belongs to the field of rapid prototyping and manufacturing, and relates to an ultraviolet laser curing rapid prototyping material and a preparation method. Background technique [0002] Rapid prototyping is a rapid design and prototyping technology developed in the late 1980s. The core idea of ​​rapid prototyping is discrete accumulation molding. That is: the computer three-dimensional surface or solid model of the required parts is designed by CAD software: the three-dimensional model is discretized into a series of ordered two-dimensional layers along a certain direction (usually the Z direction) (customarily called layering); according to each Layer profile information, process planning, selection of processing parameters, and automatic generation of NC codes: the forming machine manufactures a series of layers and automatically connects them to obtain a three-dimensional physical entity. Rapid prototyping technology combines the re...

Claims

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Application Information

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IPC IPC(8): G03F7/027G03F7/004
Inventor 黄笔武陈义旺谌伟庆刘世民
Owner NANCHANG UNIV
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