Nano-grade-silver-filled room-temperature-cured conductive adhesive

A room temperature curing, nano-silver technology, applied in the direction of conductive adhesives, adhesives, epoxy glue, etc., can solve the problems of high viscosity and weakened mechanical properties, and achieve the reduction of silver filling, the improvement of mechanical properties and the reduction of cost Effect

Active Publication Date: 2012-04-04
JIANGSU NANOWELL ADVANCED MATERIALS SCI&TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The present invention combines the advantage that the conductive adhesive has good conductivity under the condition of low filling rate of nano-silver wires, discloses a kind of nano-silver filled room-temperature-cured conductive adhesive, which overcomes the It overcomes the shortcomings of high viscosity and weakened mechanical properties brought about by the high filling rate of micron silver powder, and overcomes the shortcomings of medium-temperature curing and high-temperature curing conductive adhesives that need to be baked.

Method used

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  • Nano-grade-silver-filled room-temperature-cured conductive adhesive

Examples

Experimental program
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Effect test

Embodiment 1

[0039]According to the mass ratio of 1:1, mix 10g silver nitrate and 10g PVP into a beaker filled with 500g ethylene glycol, and stir ultrasonically to obtain a uniform and transparent solution; prepare a solution reaction system containing silver ions; add to the solution containing silver ions Add 100 mg of sodium chloride to the reaction system, stir evenly to obtain a reaction precursor; put the prepared suspension into a microwave oven, and the reaction conditions are: 320W, 20min. Add water to the reacted solution, centrifuge at 2000 rpm for 20 minutes to obtain a precipitate, then wash with deionized water, absolute ethanol or acetone three to four times, and dry at regular temperature to obtain solid silver nanowire powder. The scanning electron microscope test sample is to stick the sample on the aluminum base sample stage, figure 1 The SEM photo of the silver nanowires obtained according to Example 1 is given, the nanowire diameter is about 100nm, and the aspect rati...

Embodiment 2

[0044] Mix 20g of silver acetate and 60g of PVP into a beaker filled with 400g of ethylene glycol according to a mass ratio of 1:3, and stir ultrasonically to obtain a uniform and transparent solution; prepare a solution reaction system containing silver ions; add to the solution containing silver ions Add 60 mg of sodium chloride to the reaction system, stir evenly to obtain a reaction precursor; put the prepared suspension into a microwave oven, and the reaction conditions are: 400W, 18min. Add water to the reacted solution, centrifuge at 3000 rpm for 10 minutes to obtain a precipitate, then wash with deionized water, absolute ethanol or acetone three to four times, and dry at regular temperature to obtain solid silver nanowire powder. The scanning electron microscope test sample is to stick the sample on the aluminum base sample stage, figure 2 The silver nanowire SEM photo that obtains according to embodiment 2 is provided; The wire diameter of this nanowire is 280nm, and...

Embodiment 3

[0050] Mix 15g of silver nitrate and 30g of PVP into a beaker filled with 500g of ethylene glycol according to a mass ratio of 1:1, and stir ultrasonically to obtain a uniform and transparent solution; prepare a solution reaction system containing silver ions; add to the solution containing silver ions Add 100 mg of sodium chloride to the reaction system, stir evenly to obtain a reaction precursor; put the prepared suspension into a microwave oven, and the reaction conditions are: 480W, 16min. Add water to the reacted solution, centrifuge at 2000 rpm for 20 minutes to obtain a precipitate, then wash with deionized water, absolute ethanol or acetone three to four times, and dry at regular temperature to obtain solid silver nanowire powder. The scanning electron microscope test sample is to stick the sample on the aluminum base sample stage, image 3 The SEM photo of the silver nanowire obtained according to Example 3 is given, the wire diameter of the nanowire is 92nm, and the ...

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Abstract

The invention provides a nano-grade-silver-filled room-temperature-cured conductive adhesive. A preparation method of the conductive adhesive comprises steps that: (a) silver nitrate or silver acetate powder is mixed with a polyvinyl pyrrolidone (PVP) dispersing agent; the mixture is added to an ethylene glycol solution, such that a solution reaction system containing silver ions is prepared; (b) sodium chloride is added to the solution reaction system containing silver ions; the mixture is well mixed by stirring, such that a reaction precursor is prepared; (c) the obtained reaction precursor is irradiated by using microwaves, such that a mixed solution containing silver nanowires is obtained; water or ethanol is added to the mixed solution, and the mixture is subject to high-speed centrifugation drying, such that silver nanowire powder is obtained; (d) the silver nanowire powder is added to epoxy resin, and the mixture is well mixed by stirring; a curing agent is added to the obtained mixed colloid, and the mixture is mixed, such that a finished product is obtained. The conductive adhesive provided by the invention has better properties than a conductive adhesive filled with pure sheet-shaped silver powder. The conductive adhesive provided by the invention is advantaged in high conductivity, high shear strength, high impact strength, and the like. The conductive adhesive provided by the invention can be widely applied in the field of electronic packaging requiring low-temperature conductive connections.

Description

technical field [0001] The invention relates to the technical field of preparation of electronic packaging materials, in particular to a room-temperature-cured conductive adhesive filled with nano-silver. Background technique [0002] With the development of miniaturization and portability of electronic products, and the high temperature of Pb / Sn solder connection (230°C), large thermal stress, and the fact that Pb is highly toxic, there is an urgent need to develop new connection materials and methods. Due to the advantages of simple coating process and low curing temperature, conductive adhesive has begun to replace Pb / Sn solder, and its demand is increasing day by day. [0003] Conductive adhesive is an adhesive with a certain conductivity after curing or drying. It usually uses matrix resin and conductive fillers, namely conductive particles, as the main components. The conductive particles are combined through the bonding effect of the matrix resin to form a conductive ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J163/02C09J9/02
Inventor 姜清奎常振宇丁渐宝
Owner JIANGSU NANOWELL ADVANCED MATERIALS SCI&TECH
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