Au-Sn alloy electroplating liquid

An alloy electroplating solution, au-sn technology, applied in the field of electroplating, can solve the problems of damage resist, unstable Au-Sn alloy coating, unsuitable electroplating, etc., and achieve the effect of stable performance

An alloy electroplating solution, au-sn technology, applied in the field of electroplating, can solve the problems of damage resist, unstable Au-Sn alloy coating, unsuitable electroplating, etc., and achieve the effect of stable performance

CN102433576AInactive Publication Date: 2012-05-02张家港舒马克电梯安装维修服务有限公司镀锌分公司
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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0014] Au-Sn alloy electroplating solution, made of KAu(CN) 2 , (C 2 h 5 -SO 3 ) 2 Sn, pyridine-3-sulfonic acid, succinic and citric acids, resorcinol and hydroquinone;

[0015] The concentration of Au compound calculated as Au is 10g / L; the concentration of organic acid tin salt calculated as Sn is 15g / L; the concentration of complexing agent is 30g / L; the concentration of pH buffer or stabilizer is 150g / L; Oxidant concentration 20g / L.

Embodiment 2

[0017] Au-Sn alloy electroplating solution, made of NaAu(CN) 2 , (C 3 h 7 COO) 2 Sn, composed of ethylenediaminetriacetic acid and hydroxyquinoline, tartaric acid and ethylene glycol, and hydroxyphthalic acid;

[0018] The concentration of Au compound calculated as Au is 10g / L; the concentration of organic acid tin salt calculated as Sn is 12g / L; the concentration of complexing agent is 10g / L; the concentration of pH buffer or stabilizer is 200g / L; Oxidant concentration 15g / L.

Embodiment 3

[0020] Au-Sn alloy plating solution, NaAu(CN) 2 and HAuCl, (C 4 h 9 SO 2 ) 2 Sn, complexing agent: a mixture of hydroxyquinoline, ethylenediaminetetraacetic acid and pyridine-3-sulfonic acid, the pH buffer is malonic acid and malic acid, Sn 2+ Antioxidant: a mixture of hydroxycinnamic acid, catechol and sodium ascorbate stearate;

[0021] The concentration of Au compound in terms of Au is 7g / L; the concentration of organic acid tin salt in terms of Sn is 20g / L; the concentration of complexing agent is 20g / L; the concentration of pH buffer or stabilizer is 100g / L; Oxidant concentration 5g / L.

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Abstract

The invention discloses an Au-Sn alloy electroplating liquid which consists of an Au compound, an organic acid Sn compound, a complexing agent, a pH buffering agent or stabilizing agent and a Sn<2+> antioxidant. Sinking is not generated in the processes of storing and using the Au-Sn alloy electroplating liquid disclosed by the invention; and the Au-Sn alloy electroplating liquid is stable in property, and dose not damage the fine corrosion inhibitor patterns on an electroplating piece substrate.

Description

technical field [0001] The invention belongs to the technical field of electroplating, and in particular relates to an Au-Sn alloy electroplating solution. Background technique [0002] In the assembly of electronic components such as IC (integrated circuits), Au-Sn alloy sheets are used as Au-type solder for soldering and bonding semiconductor chips and ceramic chassis, ceramic packages and covers. In order to prevent electronic components such as semiconductor chips from being damaged by heat during soldering. Au-Sn platform gold with a composition of 80Wt.%Au and 20Wt.%Sn and a melting point of 280°C must be used. Industrially, Au-Sn alloy solder sheets with a certain thickness and similar size and shape to the soldering part are processed through melting, casting and calendering. However, the Au-Sn alloy foil processed by metallurgical methods such as melting and rolling is brittle. When the alloy foil is melted and welded, it is easy to change the original size and sh...

Claims

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Application Information

Patent Timeline
02 May 2012
Publication
CN102433576A
IPC
C25D3/56
Inventors
蒋惠良