Activation of electrode surfaces by means of vacuum deposition techniques in a continuous process
A technology of physical vapor deposition and workpieces, which is applied in the direction of electrodes, electrode coatings, electrode manufacturing, etc., and can solve problems such as the impact of batch methods
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Embodiment 1
[0015] A series of 20 pieces of grade 1 titanium of dimensions 1000 x 500 x 0.89 mm were etched in 18 vol% HCl and degreased with acetone. The sheets were placed on individual trays in the conditioning chamber of the IBAD apparatus for continuous manufacturing, followed by depressurization to 130 Pa. The sheet is then fed continuously to the deposition chamber where it is -5 The dynamic vacuum of the plasma generated at a pressure of Pa is subjected to ion bombardment in two steps. In the first step, the flakes are subjected to argon ion bombardment at low energy (200-500eV), with the aim of cleaning possible residues from their surfaces; The bombardment with platinum ions aims to deposit a dense coating. At the completion of 0.3mg / cm 2 For Pt deposition, the sheet was transferred to the subsequent decompression chamber (maintained at 130 Pa). At the end of the processing of all chips, the decompression chamber was pressurized with ambient air before recycling the chips. ...
Embodiment 2
[0018] A series of 10 nickel sheets of size 1000 x 500 x 0.3 mm were blasted with corundum until an R slightly below 70 μm was obtained. z Roughness values, etched in 20% by volume HCl and degreased with acetone. Utilizing the same apparatus and bombardment in a second step with ruthenium ions extracted from the plasma phase at energies of 1000-2000 eV, by the IBAD method described in Example 1 with 0.1 mg / cm 2 A ruthenium film coats the wafer. After deposition, the flakes were extracted and subjected to a thermal post-treatment at 400 °C in air for 1 h, thereby oxidizing the coated ruthenium to RuO 2 . 1cm cut from some electrodes thus obtained 2 The samples were measured for hydrogen evolution potential under standard conditions, at 10kA / m 2 A current density of -968 mV / NHE was obtained in 32% by weight NaOH at a temperature of 90°C.
Embodiment 3
[0020] 20 m of coils of 500 mm wide and 0.36 mm thick nickel expanded mesh were thermally degreased and etched in 20 vol% HCl until a R of approximately 20 μm was obtained z Roughness value. Coils were loaded in the feed section of a magnetron plasma sputtering (MPS) device for continuous roll-to-roll deposition and subjected to 10 -3 Pa pressure. The device was operated at a line velocity of 0.2 cm / s. During the pass deposition part, pass through pure Ar (used between the substrate and the chamber wall at a nominal power of 200W at 5.10 -5Plasma generated under Pa, and the bias voltage is zero) sputtering to further clean the sheet, followed by reactive sputtering (200W, maintained at about 5.10 -1 20% Ar / O in dynamic vacuum of Pa 2 mixture and a deposition temperature of about 450°C) obtained RuO 2 layer to coat it. After deposition, the recovered part will be coated with 0.3 mg / cm corresponding to a thickness of 3 μm 2 RuO 2 The expanded metal is rolled back into co...
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Abstract
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