Heat-conductive insulation filling and preparation method thereof

A heat-conducting and insulating filler and raw material technology, applied in the direction of fibrous fillers, chemical instruments and methods, semiconductor devices, etc., can solve the problems of complex preparation process, inability to balance insulation and heat conduction, etc., and achieve easy dispersion, low production cost, change Hydrophilic effect

Inactive Publication Date: 2014-07-02
ZHANJIANG JUXIN NEW ENERGY +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a heat-conducting insulating filler and its preparation method in order to solve the problems of the above-mentioned invention that insulation and heat conduction cannot be taken into account, and the preparation process is complicated.

Method used

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  • Heat-conductive insulation filling and preparation method thereof
  • Heat-conductive insulation filling and preparation method thereof
  • Heat-conductive insulation filling and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] A thermally conductive insulating filler, prepared by the following method:

[0021] That is, the mesophase carbon microspheres are used as raw materials, and the intermediate product is obtained after oxidative grafting treatment at room temperature in a mixed acid solution of nitric acid and sulfuric acid with a water content of 40% for 2 hours, and then filtered, washed, and dried;

[0022] Among them, the mass ratio of the mesophase carbon microspheres to the mixed acid solution of nitric acid and sulfuric acid containing 40% water is: 1:1;

[0023] Among them, the mesophase carbon microspheres have a particle size of 1-20 μm and a volatile content of less than 10%;

[0024] The mixing mass ratio of nitric acid and sulfuric acid in the mixed acid solution of nitric acid and sulfuric acid is 1:1, and the nitric acid and sulfuric acid used are neither nitric acid nor sulfuric acid with an industrial acid concentration of 98%;

[0025] The intermediate product obtaine...

Embodiment 2

[0027] A thermally conductive insulating filler, prepared by the following method:

[0028] The intermediate product obtained after the oxidation grafting treatment was carbonized and graphitized at a high temperature of 1000° C., and the others were the same as in Example 1, and finally a thermally conductive and insulating filler B was obtained.

Embodiment 3

[0030] A thermally conductive insulating filler, prepared by the following method:

[0031] The intermediate product obtained after the oxidation grafting treatment was carbonized and graphitized at a high temperature of 1800° C. for 1 hour, and the others were the same as in Example 1, and finally a thermally conductive and insulating filler C was obtained.

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Abstract

The present invention disclosed a kind of heat conduction insulation filler and its preparation method, that is, use the middle carbon micro -ball as the raw material, and the oxidation and branches are performed after 2 to 6h under the temperature of 40%nitric acid and sulfuric acid hybrid acid solution.The intermediate product obtained after drying is releasing at 600 to 2700 ° C at high temperature and a graphization treatment of 1h.The intermediate carbon micro -ball selected by the present invention belongs to the by -product ultra -fine charcoal particles in the production of energy charcoal materials, and the raw materials are widely sources.After hybrid acid treatment, the hydrophilicity of the intermediate carbon microsphere surface is improved, and it is easier to disperse in epoxy tree esters to facilitate the LED bottom version of the coating and multi -layer circuit version impregnation to form a uniform coating film.At the same time, different carbonization and graphization treatment environment can be adopted, and the characteristics of the carbon material can be used to prepare a series of products that can meet the requirements of different thermal conductivity.

Description

technical field [0001] The invention relates to a heat-conducting insulating filler and a preparation method thereof, belonging to the field of insulation and heat conduction of inorganic carbon materials. Background technique [0002] my country's LED industry is mainly concentrated in the Zhujiang Triangle area of ​​Guangdong, with an output value of 85.3 billion yuan in 2010. In response to the current concentration of industrial development and the needs of technological innovation, scientific and technological innovation will be carried out around LED epitaxial chips, packaging applications and other fields. The goal is to realize the simultaneous development of white light general lighting upgrading and energy saving, and reduce the production cost of chips and packaging technology by 80%. For this reason, in the market survey, it was found that LED and multilayer printed circuit board manufacturers urgently need high thermal conductivity fillers to solve the problems ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09C1/44C09C3/06C09C3/00H01L33/64
Inventor 金鸣林吴其修王连星李凤仙
Owner ZHANJIANG JUXIN NEW ENERGY
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