Nano silicon window layer with gradient band gap characteristic and preparation method thereof
A nano-silicon and window layer technology, applied in nanotechnology, nanotechnology, nano-optics, etc., can solve the problems of difficult to obtain wide bandgap, i/p interface damage, interface bombardment damage, etc., to reduce interface carrier recombination , small particle bombardment, high conductivity effect
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Embodiment 1
[0030] A preparation method of a nano-silicon window layer with gradient bandgap characteristics, comprising the following steps:
[0031] 1) Put the sample to be treated with the metal back electrode M, the transparent conductive back electrode T1, the n-type silicon-based film N and the intrinsic silicon-based film I stacked in sequence on the substrate into a plasma-enhanced chemical vapor phase of 13.56MHz-100MHz In the PECVD deposition equipment, the surface temperature of the sample to be processed is 150°C, and the background vacuum is 2×10 -4 Pa, into the reaction gas, the source gas in the reaction gas is silane SiH 4 ; The diluent gas is H 2 ; Doping gas is B 2 h 6 ; The ratio of dopant atoms to silicon atoms is 1%; the flow rate ratio of diluent gas to source gas is 250:1, the reaction gas pressure is 2Torr, and the glow power density is 0.08W / cm 2 A silicon film P1 with a thickness of 1.5nm was glow-deposited under the conditions;
[0032] 2) Change the glow p...
Embodiment 2
[0038] A preparation method of a nano-silicon window layer with gradient bandgap characteristics, comprising the following steps:
[0039] 1) Put the sample to be treated with the metal back electrode M, the transparent conductive back electrode T1, the n-type silicon-based film N and the intrinsic silicon-based film I stacked in sequence on the substrate into a plasma-enhanced chemical vapor phase of 13.56MHz-100MHz In the PECVD deposition equipment, the surface temperature of the sample to be processed is 150°C, and the background vacuum is 2×10 -4 Pa, into the reaction gas, the source gas in the reaction gas is silane SiH 4 ; The diluent gas is H 2 ; Doping gas is B 2 h 6 ; The ratio of dopant atoms to silicon atoms is 1%; the flow rate ratio of diluent gas to source gas is 250:1, the reaction gas pressure is 2Torr, and the glow power density is 0.08W / cm 2 A silicon film P1 with a thickness of 1.5nm was glow-deposited under the conditions;
[0040] 2) Change the glow p...
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