Preparation method for low excursion flat belt voltage silicon carbide (SiC) metal oxide semiconductor (MOS) capacitance
A technology of flat-band voltage and manufacturing method, which is applied in the field of microelectronics, can solve problems such as difficult nitrogen-containing gas dosage, influence on device interface characteristics, flat-band voltage offset, etc., and achieve reduction of dangling bonds, ease of interface stress, and flat-band voltage The effect of small offset
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Example Embodiment
[0019] Embodiment 1, including the following steps:
[0020] Step 1. Perform standard cleaning treatment on the N-SiC epitaxial material:
[0021] 1.1) Ultrasonic cleaning of N-SiC epitaxial material with deionized water;
[0022] 1.2) Clean with concentrated sulfuric acid, heat it to smoke and cook for 10 minutes, soak for 30 minutes, and rinse the surface with deionized water several times;
[0023] 1.3) Use H with a ratio of 5:1:1 2 O, H 2 O 2 Soak the N-SiC epitaxial material in a water bath with deionized water for 5 minutes at a temperature of 80℃, and then wash with hydrogen fluoride solution, and rinse the surface several times with deionized water for the second time. ;
[0024] 1.4) Use H with a ratio of 6:1:1 2 O, H 2 O 2 Soak the N-SiC epitaxial material in a water bath after the second rinse with deionized water for 5 minutes with the No. 2 mixed liquid composed of HCl and HCl at a temperature of 80°C, and clean with hydrogen fluoride solution, and then use deionized water...
Example Embodiment
[0029] Embodiment 2, including the following steps:
[0030] Step 1. Perform standard cleaning treatment on the N-SiC epitaxial material:
[0031] 1.1) Ultrasonic cleaning of N-SiC epitaxial material with deionized water;
[0032] 1.2) Clean with concentrated sulfuric acid, heat it to smoke and cook for 10 minutes, soak for 30 minutes, and rinse the surface with deionized water several times;
[0033] 1.3) Use H with a ratio of 5:1:1 2 O, H 2 O 2 Soak the N-SiC epitaxial material in a water bath with deionized water for 5 minutes at a temperature of 80℃, and then wash with hydrogen fluoride solution, and rinse the surface several times with deionized water for the second time. ;
[0034] 1.4) Use H with a ratio of 6:1:1 2 O, H 2 O 2 Soak the N-SiC epitaxial material in a water bath after the second rinse with deionized water for 5 minutes with the No. 2 mixed liquid composed of HCl and HCl at a temperature of 80°C, and clean with hydrogen fluoride solution, and then use deionized water...
Example Embodiment
[0039] Embodiment 3 includes the following steps:
[0040] Step 1. Perform standard cleaning treatment on the N-SiC epitaxial material:
[0041] 1.1) Ultrasonic cleaning of N-SiC epitaxial material with deionized water;
[0042] 1.2) Clean with concentrated sulfuric acid, heat it to smoke and cook for 10 minutes, soak for 30 minutes, and rinse the surface with deionized water several times;
[0043] 1.3) Use H with a ratio of 5:1:1 2 O, H 2 O 2 Soak the N-SiC epitaxial material in a water bath with deionized water for 5 minutes at a temperature of 80℃, and then wash with hydrogen fluoride solution, and rinse the surface several times with deionized water for the second time. ;
[0044] 1.4) Use H with a ratio of 6:1:1 2 O, H 2 O 2 Soak the N-SiC epitaxial material in a water bath after the second rinse with deionized water for 5 minutes with the No. 2 mixed liquid composed of HCl and HCl at a temperature of 80°C, and clean with hydrogen fluoride solution, and then use deionized water f...
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