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Ceramic powder for electronic component packaging material and production method for ceramic powder

A technology of electronic components and packaging materials, applied in the field of electronic ceramic materials, can solve the problems of unsuitable packaging of electronic components and substrate materials, unsuitable for industrialized mass production, poor product performance, etc., and achieve low production cost and excellent comprehensive performance , high efficiency effect

Active Publication Date: 2013-01-30
UNIV OF ELECTRONIC SCI & TECH OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The glass-ceramic is also prepared by traditional glass technology, using a platinum crucible to melt at a temperature of 1450-1650°C for 2-5 hours, and its main crystal phase has a cyclosilicate structure, TCE=8.5-11.5×10 -6 / °C, the high thermal expansion ring silicate glass-ceramic is only used as a metal-to-metal, metal-to-ceramic and ceramic-to-ceramic sealant, as well as a high-performance coating for metal and ceramics, and is not suitable for packaging electronic components and substrate materials; and the silicate glass-ceramic adopts traditional glass technology, the melting temperature is as high as 1450-1650 ℃, and raw ore powder and rare earth metal oxides with high impurity content are used as part of the raw materials, so there is still high energy consumption , High production cost, poor product performance, and not suitable for industrialized mass production

Method used

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  • Ceramic powder for electronic component packaging material and production method for ceramic powder
  • Ceramic powder for electronic component packaging material and production method for ceramic powder
  • Ceramic powder for electronic component packaging material and production method for ceramic powder

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] Embodiment 1: weigh 60kg BaO, 9kg B 2 o 3 , 23kg SiO2 2 、3kg Al 2 o 3 , 5kg TiO2 2 , placed together in a ball mill, with ethanol as the ball milling agent and zirconium balls as the ball, after 3 hours of ball milling, drying at 70°C, and sieving to obtain a powder with an average particle size of 4.3 μm; sintering at 750°C And after 1.5 hours of heat preservation, the powder after grinding and sieving is the composite oxide; then weigh 45kg of composite oxide, 55kg of quartz (125μm) and place it in the ball mill for 11 hours after wet grinding. Drying under high pressure until the moisture content is ≤0.5%, and sieving to obtain a white powder with an average particle size of 3.0 μm, which is ceramic powder for electronic packaging materials.

[0023] After the above ceramic powder is pressed and formed at 20MPa, it is sintered in the air and at a temperature of 970°C and kept for 1 hour, and the coefficient of thermal expansion is 18.3×10 -6 / °C (25-400°C) cera...

Embodiment 2

[0024] Embodiment 2: weigh 52kg BaO, 10kg B 2 o 3 、30kg SiO2 2 、5kg Al 2 o 3 , 3kg ZrO 2 and 1kg Co 2 o 3 Put them together in a ball mill, use deionized water as the ball milling agent, and zirconium balls as the balls, after 5 hours of ball milling, dry at 100°C, sieve to obtain a powder with an average particle size of 3.5μm, and then grind at 750°C sintering and heat preservation for 2 hours, and then the powder after grinding and sieving is the composite oxide; then weigh 57kg of the composite oxide and 43kg of quartz (105μm), and place them in the ball mill for 9 hours after wet grinding. Dry at 100°C until the moisture content is ≤1%, and the blue powder with an average particle size of 2.5 μm obtained through sieving is the ceramic powder for electronic packaging materials.

[0025] After the above-mentioned ceramic powder is pressed and formed at 20MPa, in a reducing atmosphere N 2 +H 2 Sintering at a temperature of 950°C and holding for 1.5 hours to obtain a...

Embodiment 3

[0026] Embodiment 3: weigh 16kg BaO, 5kg B 2 o 3 , 52kg SiO2 2 、5kg Al 2 o 3 , 15kg MgO, 7kg ZrO 2 Put them together in a ball mill, use a mixture of ethanol and deionized water at a ratio of 7:3 as the ball milling agent, and zirconium balls as the balls, after 7 hours of ball milling, dry at 80°C, and sieve to obtain an average particle size of 2.8 μm powder; then sintered at 750°C and held for 2.5 hours, then ground and sieved to form the composite oxide powder; then weigh 73kg of composite oxide, 27kg of quartz (74μm) and 0.5kg of Cr 2 o 3 Using a mixture of ethanol and deionized water at a ratio of 7:3 as the ball milling agent and zirconium balls as the balls, after 7 hours of ball milling, dry at 80°C until the moisture content is ≤1%, and sieve to obtain a powder with an average particle size of 2.1 μm. The green powder is ceramic powder for electronic packaging materials.

[0027] After the above-mentioned ceramic powder is pressed and formed at 20MPa, in a red...

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Abstract

The invention belongs to ceramic powder for producing an electronic component packaging material and a production method for the ceramic powder. The ceramic powder comprises 35 to 85 weight percent of composite oxides containing part of BaO, B2O3, SiO2, Al2O3, MgO, CaO, SrO, ZnO, ZrO2, and TiO2, and 15 to 65 weight percent of quartz powder and colorant; and the production method comprises the following steps of preparing the composite oxides, preparing the raw materials of the ceramic powder, performing ball-milling, mixing and drying. According to the method, the composite oxides, quartz or composite oxides, quartz, and colorant are adopted, the composite oxides are sintered, and the sintered composite oxides and the quartz powder are mixed so as to obtain the ceramic powder for the packaging material, so that the method has the characteristics of simple process, high efficiency, low energy consumption and production cost and the like, and can be used for industrial large-scale production. The ceramic powder which is prepared by the method can be sintered at the temperature of between 800 and 1,000 DEG C by the conventional method to form the electronic component packaging material and a base plate for a chip, wherein the thermal expansion coefficient of the electronic component packaging material and the base plate is 10<-20> to 10<-6> / DEG C, and the electronic component packaging material and the base plate are high and reliable in comprehensive performance.

Description

technical field [0001] The invention belongs to the technical field of electronic ceramic materials, which is used for producing ceramic powder for packaging materials of electronic components and the production method of the ceramic powder; -6 Ceramic powder and production method of electronic packaging materials at / ℃. The ceramic powder can not only be used to produce packaging materials for electronic components such as integrated circuit chips, especially ball grid arrays (BGA), but also can be used to make chip substrates. Background technique [0002] With the continuous miniaturization, multi-functionality, high-performance and low-cost of electronic equipment, the core integrated circuit (IC) continues to improve in terms of chip size, integration scale, packaging density, and signal frequency. This key link puts forward higher requirements. The rapid development of large-scale integrated circuits (LSI) has prompted the emergence of array-type chip packaging forms...

Claims

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Application Information

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IPC IPC(8): C03C10/14C04B35/01C04B35/626
Inventor 李波张树人
Owner UNIV OF ELECTRONIC SCI & TECH OF CHINA
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