Ceramic powder for electronic component packaging material and production method for ceramic powder
A technology of electronic components and packaging materials, applied in the field of electronic ceramic materials, can solve the problems of unsuitable packaging of electronic components and substrate materials, unsuitable for industrialized mass production, poor product performance, etc., and achieve low production cost and excellent comprehensive performance , high efficiency effect
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[0022] Example 1: Weigh 60kg BaO, 9kg B 2 O 3 , 23kg SiO 2 , 3kg Al 2 O 3 , 5kg TiO 2 , Placed in a ball mill together, using ethanol as the ball milling agent and zirconium balls as the ball, after 3 hours of ball milling, drying at 70°C and sieving to obtain powder with an average particle size of 4.3μm; sintering at 750°C After being kept for 1.5 hours, the powder after grinding and sieving is the composite oxide; then weighing 45kg of composite oxide and 55kg of quartz (125μm) in the ball mill and wet grinding for 11 hours at 70℃ Dry it until the moisture content is less than or equal to 0.5%, sieving to obtain a white powder with an average particle size of 3.0μm, which is the ceramic powder for electronic packaging materials.
[0023] After the above ceramic powder is pressed and molded at 20MPa, it is sintered in air and at a temperature of 970℃ and kept for 1 hour, and the coefficient of thermal expansion is 18.3×10 -6 / ℃ (25-400℃) electronic component packaging ceramic ma...
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[0024] Example 2: Weigh 52kg BaO, 10kg B 2 O 3 , 30kg SiO 2 , 5kg Al 2 O 3 , 3kg ZrO 2 And 1kg Co 2 O 3 Put them in a ball mill together with deionized water as the ball milling agent and zirconium balls as the ball. After 5 hours of ball milling, drying at 100℃, sieving to obtain powder with an average particle size of 3.5μm, and then at 750℃ After sintering and holding for 2 hours, the powder after grinding and sieving is the composite oxide; then weigh 57kg of the composite oxide and 43kg of quartz (105μm), and still place it in a ball mill for 9 hours after wet grinding. Dried at a temperature of 100°C to a moisture content ≤1%, and the blue powder with an average particle size of 2.5μm obtained by sieving is the ceramic powder for electronic packaging materials.
[0025] After using the above ceramic powder to be molded by 20MPa, in a reducing atmosphere N 2 +H 2 Sintering at a neutral temperature of 950℃ and holding for 1.5 hours to obtain a thermal expansion coefficient of ...
Example Embodiment
[0026] Example 3: Weigh 16kg BaO, 5kg B 2 O 3 , 52kg SiO 2 , 5kg Al 2 O 3 , 15kg MgO, 7kg ZrO 2 Put it together in a ball mill, use a 7:3 mixture of ethanol and deionized water as the ball milling agent, and zirconium balls as the ball. After 7 hours of ball milling, drying at 80°C, sieving to obtain an average particle size of 2.8μm The powder is then sintered at 750℃ and kept for 2.5 hours, and then ground and sieved to form the composite oxide powder; then weigh 73kg of composite oxide, 27kg of quartz (74μm) and 0.5kg of Cr 2 O 3 Use a 7:3 mixture of ethanol and deionized water as the ball milling agent and zirconium balls as the milling ball. After 7 hours of ball milling, it is dried at 80°C until the moisture content is ≤1%, and then sieved to obtain an average particle size of 2.1μm Green powder is ceramic powder for electronic packaging materials.
[0027] After using the above ceramic powder to be molded by 20MPa, in a reducing atmosphere N 2 +H 2 Sintering at 930℃ and ho...
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