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Thermoplastic resin adhesive film

A thermoplastic resin and adhesive film technology, which is applied in adhesives, film/sheet adhesives, printed circuit components, etc., can solve problems such as difficult operation, difficult wide use, and difficult processing, so as to improve the use of The effect of life and long-term stability, convenience for large-scale industrial production, and simple process conditions

Inactive Publication Date: 2013-02-27
彭代信
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Traditional printed circuit boards for high-frequency signals are made of polytetrafluoroethylene, and the bonding film is made of fluoride polymer. US Patent No. 7,687,142 uses polyfluoroethylene as the bonding film to press multilayer circuit boards. Its dielectric constant , The heat resistance can meet the requirements, but the processing is difficult, the mold loss is particularly large, the product is not easy to obtain, and the physical properties are affected by the hybrid components in polyfluoroethylene, which is unstable
Later, U.S. Patent No. 5,571,609 disclosed polyolefin materials as an adhesive film. Its dielectric constant is relatively low, and its heat resistance is relatively good. The glass transition temperature reaches 280°C. However, the product is sticky and difficult to handle, so it is difficult to be widely used.
Chinese patent CN101328277 improves sticky properties by introducing low-molecular-weight maleic anhydride-added polybutadiene resin and high-molecular-weight maleic anhydride-grafted styrene-butadiene copolymer, but the peel strength of the product is very small , there is a line reliability problem

Method used

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  • Thermoplastic resin adhesive film
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  • Thermoplastic resin adhesive film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] Add polyphenylene ether particles with a weight-average molecular weight of 40,000 to the extruder, and extrude a film with a thickness of 100 microns at 270°C; put the film into two printed sheets with graphics and blackening or browning treatment A composite board is formed between the circuit boards, and the composite board is placed in a vacuum press at 30Kg / cm 2 Compress under pressure, raise the temperature from 50°C to 220°C at a heating rate of 5°C / min, and maintain at 220°C for 30 minutes; continue to make the above-pressed composite board according to the conventional circuit board manufacturing process, and finally make the finished board. and perform performance testing.

Embodiment 2

[0021] Add polyphenylene ether particles with a weight average molecular weight of 5000 into the blow molding machine, and blow out a film with a thickness of 50 microns at 250°C; put the film into two pieces of printed circuits that have been patterned and blackened or browned A composite board is formed between the boards, and the composite board is placed in a vacuum press at 20Kg / cm 2 Compress under pressure, raise the temperature from 50°C to 210°C at a heating rate of 5°C / min, and maintain at 210°C for 30 minutes; continue to make the above-pressed composite board according to the conventional circuit board manufacturing process, and finally make the finished board. and perform performance testing.

Embodiment 3

[0023] Add polyphenylene ether particles with a weight-average molecular weight of 10,000 to the extruder, and extrude a film with a thickness of 80 microns at 280°C; put the film into two printed sheets with graphics and blackening or browning treatment A composite board is formed between the circuit boards, and the composite board is placed in a vacuum press at 24Kg / cm 2 Compress under pressure, raise the temperature from 50°C to 220°C at a heating rate of 5°C / min, and maintain at 220°C for 30 minutes; continue to make the above-pressed composite board according to the conventional circuit board manufacturing process, and finally make the finished board. and perform performance testing.

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Abstract

The invention relates to a thermoplastic resin adhesive film and application thereof. The adhesive film comprises symmetrical polyphenylene ether molecules, is not sticky and has low dielectric constant and dielectric loss, and a high-frequency multilayer printed circuit board prepared by the adhesive film has high glass transition temperature, excellent heat resistance and flame resistance and an environmental protection function. The adhesive film serves as a thermally conductive and insulating layer of the high-frequency printed circuit board, so that the printed circuit board has the advantages of high thermal conductivity, quick signal transmission, low loss and the like.

Description

technical field [0001] The invention relates to a thermoplastic resin, in particular to a thermoplastic resin adhesive film and its application. Background technique [0002] With the development of light, thin, small, high-density and multi-functional electronic products, the assembly density and integration of components on printed circuit boards are getting higher and higher, and the frequency of transmission signals is getting higher and higher. Layer requirements are getting higher and higher. [0003] Adhesive film is used in the lamination process of multi-layer printed circuit boards to bond different circuit layers. Its material affects signal transmission, which requires the selected adhesive film to have a small dielectric constant and can be faster. At the same time, the dielectric loss of the adhesive film is also required to be relatively low, so that the signal loss during transmission can be small, and the signal can be completely transmitted to the next dev...

Claims

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Application Information

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IPC IPC(8): C09J7/00C09J171/12H05K1/02
Inventor 彭代信
Owner 彭代信