Ceramic, aluminum and porous copper composite material
A composite material and porous copper technology, applied in the field of materials, can solve problems such as poor insulation performance, poor heat dissipation effect, and insufficient firmness, and achieve good heat dissipation performance, strong processing ability, and good insulation performance.
Inactive Publication Date: 2013-03-06
甄海威 +1
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Problems solved by technology
At present, a large number of electronic devices are made of composite materials such as aluminum substrates, but this material is a combination of printed boards and aluminum through epoxy resin bonding, which not only has insufficient compactness and firmness, but also has poor heat dissipation and poor insulation performance.
The printing plate of this material is an organic material, and it will burn when the temperature is high, which is easy to cause a fire
Method used
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[0010] The invention discloses a composite material of ceramics, aluminum and porous copper instead of an aluminum substrate. The upper layer is porous copper 7, the middle is an aluminum plate 5 (or an aluminum alloy plate), and the lower layer is a ceramic substrate 1. The upper and lower surfaces of the aluminum plate 5 are coated with a first tin-plated layer 4 and a second tin-plated layer 9; the upper and lower surfaces of the ceramic substrate are respectively sintered with an upper layer of silver foil 2 and a lower layer of silver foil 8, and the thickness of the upper layer of silver foil 2 and the lower layer of silver foil 8 is 15-20 microns. The porous copper 7 is welded together with the second tin-plated layer 9 of the aluminum plate 5 through the second solder paste layer 6, and the first tin-plated layer 4 of the aluminum plate 5 is welded with the upper silver foil 2 of the ceramic substrate 1 through the first solder paste layer 3 together.
[0011] The ele...
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Abstract
The invention discloses a ceramic, aluminum and porous copper composite material. The composite material is composed of ceramic, aluminum and porous copper, and the ceramic, the aluminum and the porous copper are pretreated. The pretreatment of a ceramic substrate comprises the following steps: coating a photosensitive adhesive, exposing, washing through water, printing a silver paste, sintering the ceramic to make the ceramic have a silver foil 15-20mum higher than the ceramic substrate, and sintering again to make the right side of the ceramic substrate be an electronic circuit required by printing and the wrong side be the sintered silver foil; the aluminum plate pretreatment is that two surfaces of an aluminum (aluminum alloy) plate are electroplated by tin. The ceramic, aluminum and porous copper composite material is prepared through mutually superposing the porous copper, the aluminum and the ceramic, coating a tin paste on the contact surfaces, and tightly welding and fixing the porous copper, the aluminum and the ceramic in a reflow soldering furnace. The composite material can bear electronic elements; and compared with an aluminum substrate, the composite material has the advantages of fast heat radiation, firmness, good insulation performance, and no combustion. The composite material is of great practical significance to electronic device heat radiation, especially LED heat radiation.
Description
technical field [0001] The invention relates to a material, in particular to a heat dissipation composite material of ceramics, aluminum and porous copper. Background technique [0002] With the development of science and technology and the popularization of the Internet, electronic equipment is more and more widely used, and the requirements for circuit board materials are also getting higher and higher. The requirements are not only high thermal conductivity, corrosion resistance, wear resistance, but also insulation, energy Machining. Ceramics, aluminum or copper can only meet some of these requirements. At present, only the tightly welded materials of metal materials and non-metal materials can meet the requirements. At present, a large number of electronic devices are made of composite materials such as aluminum substrates, but this material is a combination of printed boards and aluminum through epoxy resin bonding, which not only has insufficient compactness and fir...
Claims
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Patent Timeline
Login to View More IPC IPC(8): B32B15/04B32B18/00H05K1/05
Inventor 甄海威何永祥
Owner 甄海威