Lead-free solder combination and printed circuit board and electronic device provided with lead-free solder combination

A printed circuit board, lead-free solder technology, applied in the direction of welding/cutting medium/material, welding medium, welding equipment, etc., can solve the basic properties of solder, that is, reduce the bonding, improve the influence of slag and discoloration, and melt temperature increase and other problems, to achieve the effect of improving the combination, improving the mechanical properties, and preventing oxidation

Inactive Publication Date: 2013-04-03
株式会社爱科草英
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0020] In addition, due to the erosion of the copper pad in the PCB, when the copper concentration increases above 1%, the melting temperature of the solder increases rapidly and the wettability decreases
This would require the entire lead bath to be replaced or could cause cracking
[0021] Additionally, when only silicon is added, the effect on dross and discoloration is enhanced
However, if the content of silicon exceeds a certain amount, the basic performance of solder, that is, the bonding property will be reduced.

Method used

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  • Lead-free solder combination and printed circuit board and electronic device provided with lead-free solder combination
  • Lead-free solder combination and printed circuit board and electronic device provided with lead-free solder combination
  • Lead-free solder combination and printed circuit board and electronic device provided with lead-free solder combination

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Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0065] This embodiment provides a lead-free solder composition and a PCB and an electronic device using the lead-free solder composition, the composition includes silver from 0.1wt%-4.0wt%, copper from 0.1wt%-2wt%, 0.001wt%-0.05wt% of silicon, 0.001wt%-0.01wt% of cobalt, and the balance of tin.

[0066] The following will refer to figure 1 Explain the role of the composition of silicon and cobalt in preventing oxidation.

[0067] figure 1

[0068]

[0069] (Amount of oxidation: the amount of oxide; oxidation rate: oxidation rate; comparative example: comparative example; example: embodiment; after 1 hour: after 1 hour; after 2 hours: after 2 hours; after 3 hours: after 3 hours back.)

[0070] figure 1 Experimental data of the amount of oxides measured by the following method are exemplified. Silicon and cobalt are added to the intended base alloy. The resulting alloy is melted to make a solder composition. The solder composition was heated to 260° C. on a hot plate ...

Embodiment 2

[0318] The high temperature lead-free solder compound according to the present embodiment may include tin (Sn), copper (Cu), silicon (Si), and cobalt (Co).

[0319] The effect of the silicon and cobalt components on the prevention of oxidation will be described below with reference to FIG. 16 .

[0320] Figure 16 illustrates experimental data for the amount of oxides measured by the following procedure. A tin-copper based alloy is prepared and co-melted with either or both silicon and cobalt in a high frequency melting furnace to form a solder compound. After sampling the solder compound, its melting temperature was measured using DSC analysis at 5°C / min. Thereafter, in order to measure the amount of oxide, 3 kg of solder was heated to 420° C. in a SUS crucible having a diameter of 160 mm on a hot plane. Then, the solder compound was stirred at 60 rpm using a stirrer having a diameter of 140 mm for 1 hour, 2 hours, and 3 hours, and oxides were extracted therefrom each time a...

Embodiment 3

[0399] The lead-free solder compound for dilution according to the present embodiment may include nickel (Ni), silicon (Si), phosphorus (P), cobalt (CO), and tin (Sn).

[0400] The effects of the silicon and cobalt components in preventing oxidation will be described below with reference to FIG. 20 .

[0401] Figure 20 illustrates experimental data for the amount of oxide measured by the following procedure. Silicon and cobalt are added to Sn-Ni-P based alloys. The resulting alloy is melted to produce a solder compound. On a hot plane, the solder compound was heated to 260°C in a 160mm diameter SUS crucible. Then, the solder compounds were stirred for 1 hour, 2 hours, and 3 hours at a speed of 60 rpm using a stirrer having a diameter of 140 mm, and oxides were extracted therefrom and weighed each time.

[0402] Thereafter, the solder is allowed to solidify, and the solder samples are subsequently cut from the solder. Polish the cut surface of the solder sample. The compos...

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Abstract

The invention provides a lead-free solder compound, which comprises at least two of tin (Sn), silver (Ag), phosphorus (P), nickel (Ni), copper (Cu), bismuth (Bi) and germanium (Ge), comprises silicon (Si) and cobalt (Co), and is used for preventing operability deterioration caused by oxidation of a solder alloy and eliminating the requirement of replacing an entire lead bath due to increase of copper corrosion during welding. The invention further provides a printed circuit board (PCB) and electronic equipment provided with the lead-free solder. Due to the adoption of the lead-free solder compound containing silicon and cobalt as well as the printed circuit board (PCB) and the electronic equipment provided with the lead-free solder, the formation of oxides can be prevented continuously during welding, color change and corrosion of a copper pad are prevented, the mechanical performance and solder bonding property are enhanced, and the wetting property is kept simultaneously.

Description

technical field [0001] The present invention relates to a lead-free solder composition and a printed circuit board (PCB) and electronic device using the lead-free solder composition, and more particularly, to a non-lead (Pb) free lead (Pb) that is harmful to human body. A lead solder composition including tin (Sn), copper (Cu), and silver (Ag) added with silicon (Si) and cobalt (Co), and PCBs and electronic devices using the lead-free solder composition Ternary composition, tertiary composition of tin, copper, silver and nickel added to silicon and cobalt, tertiary composition of tin, copper, silver, nickel, germanium (Ge) and phosphorus (P) added to silicon and cobalt Hexagram compositions, or quaternary compositions of tin, copper, phosphorus and bismuth (Bi) with silicon and cobalt added in order to improve the working efficiency of soldering by continuously preventing oxidation with the help of silicon added therein, in With the help of a small amount of silicon added, di...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26
Inventor 高明玩朴商福宋明圭朴玧秀李光烈
Owner 株式会社爱科草英
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