Modified epoxide resin pouring sealant and preparation method thereof

An epoxy resin, potting glue technology, applied in the direction of epoxy resin glue, adhesive, adhesive type, etc., can solve the problems of poor high and low temperature impact resistance, insufficient storage time, high hygroscopicity, etc. High and low temperature impact resistance, increase the ability to inhibit cracking, reduce the effect of hygroscopicity and expansion coefficient

Inactive Publication Date: 2013-04-24
东莞市松山湖微电子材料研发中心
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the existing epoxy resin potting adhesives often have problems such as high hygroscopicity, poor high and low temperature impact resistance, easy cracking, and insufficient storage time.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] Example 1: Prepare the required modified epoxy resin potting glue through the following three steps: the first step is to prepare graphene modified epoxy resin, first weigh 0.5% graphene and place it in 10.0% acetone and stir evenly 1h at a speed of 700 rpm; pour it into a high-speed disperser, add 99.5% epoxy resin, and stir evenly for 2.5 hours at a speed of 150 rpm; finally take out the mixture and place it in an open container Place it in a vacuum oven at 75°C±2°C and keep it warm until constant weight to obtain the desired graphene-modified epoxy resin. The second step is to prepare component A. First, add 72.97% graphene-modified epoxy resin and 1.0% diethylene glycol dibutyl ether into the vacuum planetary mixer, and stir for 30 minutes, wherein the vacuum degree is 0.079MPa and the speed is 50r / min; then add 25.0% nano-silica, 0.5% polyethylene glycol ether, 0.45% methacryloxypropyltrimethoxysilane, 0.08% carbon black, and stir for 80min, wherein the vacuum deg...

Embodiment 2

[0024] Example 2: Prepare the required modified epoxy resin potting glue through the following three steps: the first step is to prepare graphene modified epoxy resin, first weigh 1.5% graphene and place it in 30.0.0% acetone Stir evenly for 1.2 hours at a speed of 700 rpm; then pour it into a high-speed disperser, add 98.5% epoxy resin, and stir evenly for 2.8 hours at a speed of 180 rpm; finally take out the mixture and place it in an open container, and put It is placed in a vacuum oven at 75°C±2°C and kept warm until constant weight to obtain the desired graphene-modified epoxy resin. The second step is to prepare component A. First, add 61% graphene-modified epoxy resin and 4.0% diethylene glycol diglycidyl ether into the vacuum planetary mixer in turn, and stir for 30min±5min, where the vacuum degree is 0.085MPa and the rotation speed 50r / min; then add 32.0% nano silicon powder, 2.5% dimethylpolydimethylsiloxane, 0.25% aminopropyltriethoxysilane, 0.25% titanium dioxide i...

Embodiment 3

[0025]Example 3: Prepare the required modified epoxy resin potting glue through the following three steps: the first step is to prepare graphene modified epoxy resin, first weigh 2.5% graphene and place it in 50.0% acetone and stir evenly 1h~1.5h, the speed is 750 rpm; then pour it into a high-speed disperser, and add 97.5% epoxy resin, stir evenly for 3 hours, the speed is 200 rpm; finally take out the mixture and put it in an open container, and put it Place it in a vacuum oven at 75°C±2°C and keep it warm until constant weight to obtain the desired graphene-modified epoxy resin. The second step is to prepare component A. First, add 47.97% graphene-modified epoxy resin and 8.0% 1,6-hexanediol diglycidyl ether into a vacuum planetary mixer, and stir for 30 minutes, where the vacuum degree is 0.080MPa , the rotation speed is 50r / min; then add 39.0% nano-silicon dioxide, 4.5% polyimide, 0.08% glycidyl etheroxypropyl trimethoxysilane, 0.45% scarlet material in turn, and stir for...

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PUM

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Abstract

The invention relates to the technical field of pouring sealant, in particular to modified epoxide resin pouring sealant and a preparation method of the modified expoxide resin pouring sealant. The modified epoxide resin pouring sealant achieves improvement based on the prior art. The pouring sealant is composed of a component A and a curing agent. The weight ratio of the component A to the curing agent is 100 to 3-15, wherein the component A comprises, by weight, 1.0-8.0% of thinner, 25.0-39.0% of nano filler, 0.5-4.5% of flexibilizer, 0.08-0.45% of coupling agent, 0.08-0.45% of pigment, and the balance grapheme modified epoxide resin, and the total weight is equal to 100%. Compared with the prior art, due to addition of the grapheme modified epoxide resin and the nano filler, the pouring sealant is capable of improving high and low temperature resistant impact properties, capable of reducing hygroscopicity and a dilatation coefficient, capable of prolonging storage time, capable of strengthening dehiscence resisting capacity, and capable of having great value of industrial application.

Description

technical field [0001] The invention relates to the technical field of electronic potting glue, is an improvement on the prior art, and in particular relates to a modified epoxy resin potting glue. Background technique [0002] Electronic device potting is an important step in the assembly of electronic products. It is a process that isolates electronic devices from the environment and completes protection operations according to regulations. It prevents moisture, dust, and harmful gases from invading electronic devices, and reduces shock and noise. , Avoid external force damage, stabilize internal parameters, etc. The rapid development of high-performance and high-density electronic potting devices has put forward higher requirements for potting compounds. Epoxy resin potting glue has attracted wide attention in the industry due to its good chemical resistance and strong bonding performance. However, the existing epoxy resin potting adhesives often have problems such as ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/04
Inventor 邓小安徐安莲黄云波
Owner 东莞市松山湖微电子材料研发中心
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