A microporous plate chemical copper activation backwashing process and its system

Abstract

The invention provides a microwell plate chemical copper activating back scrubbing process and a system of the microwell plate chemical copper activating back scrubbing process. The process includes the steps of microetching, first time wash, first time preimpregnation, activation, second time wash, copper deposition and second time preimpregnation. The microetching is used for increasing roughness of the surface of copper and ensuring combining force of a copper layer. The first time wash is used for washing remaining micro corrosion agent of a panel. The first time preimpregnation is used for activating the panel and hole wall. The activation is used for enabling the hole wall to adsorb a layer of metal which has catalytic ability and enabling the surface of the matrix to attach to a activation target. The second wash is used for washing remaining activation agent of the panel. The copper deposition is used for enabling non-conductive insulation hole to be transformed into an active conductive through hole under the action of copper ions in the activation of target reduction deposition on the hole wall. The second time preimpregnation is used for ensuring that the activation target is not solved. Due to the fact that the microwell plate chemical copper activating back scrubbing process and the system of the microwell plate chemical copper activating back scrubbing process are conducted, the activation target in a printed circuit board (PCB) is not solved, the risk of poor backlight is reduced, quality of products is improved, and production cost is reduced.

Description

technical field [0001] The invention relates to the technical field of PCB boards, in particular to a microporous plate chemical copper activation backwashing process and a system thereof. Background technique [0002] PCB (Printed Circuit Board), the Chinese name is printed circuit board, referred to as printed board, is one of the important components of the electronics industry. Almost every kind of electronic equipment, ranging from electronic watches and calculators to computers, communication electronic equipment, and military weapon systems, as long as there are electronic components such as integrated circuits, printed boards are used for the electrical interconnection between them. . [0003] In the production and processing of PCB boards with through holes, a key link is the hole metallization process. This process converts non-conductive insulating through-holes into active conductive through-holes, and the existing PCB boards make holes for conduction. The most...

AI Technical Summary

Problems solved by technology

This process is complicated, the production cycle is long, and the cost is high. After activation, the activated target in the PCB hole is easily dissolved in the subsequent secondary countercurrent rinsing and washing, which leads to the problem of poor backlight on the PCB and reduces the The product yield of the PCB board, in order to prevent the activation target from being dissolved, the concentration of the activator can be increased, and the increase of the concentration of the activator will increase the cost of the enterprise

[0004] Chinese patent discloses an application number: 201210332993.3, a method for setting a metal target layer in the conductive layer of a printed circuit board and its layered structure, the steps of which are: first coat the insulating substrate with copper, and then bake the board, After that, the drilling process, copper sinking operation, circuit making, and insulating layer solder mask operation process are carried out to obtain semi-finished products. Finally, nickel sinking, target sinking, and gold sinking operations are performed on the circuit part of the semi-finished board body in sequence, and copper sinking is carried out on the PCB board. During operation, the chemical electroless copper plating method is mainly used to form the first coating layer on the copper foil after the drilling process, so that the copper foils on both sides are connected to each other to complete the copper sinking operation. This copper sinking operation process adopts the original Copper immersion method, simple process, high cost, and not conducive to subsequent nickel immersion, target immersion, gold immersion operations, low product defective rate

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