Side packaging structure of electronic module

Abstract

The invention discloses a side packaging structure of an electronic module, which comprises an upper substrate, a lower substrate and a sealing frame, wherein the sealing frame is arranged at the peripheries of the upper substrate and the lower substrate in a surrounding manner, and forms a containing space with the upper substrate and the lower substrate. A main body of the sealing frame is made of a silicone layer, so that a waterproof effect of an external packaging structure is improved greatly; an opportunity that moisture permeates into the electronic module via the side packaging structure is reduced; and the side packaging structure can avoid damage from an internal polar solvent or a plastic agent by virtue of the characteristic of silica gel.

Description

technical field [0001] The invention relates to an encapsulation structure, in particular to a side encapsulation structure of an electronic module which utilizes multiple layers of silica gel layers to form a sealing structure. Background technique [0002] Various electronic modules such as liquid crystal display (LCD) modules, dye-sensitized solar cell modules, organic light-emitting diode (Organic Light-Emitting Diode; OLED) modules, plasma display modules, and thin battery modules. It has two relatively flat pole layers, and the main electronic module is arranged in the middle. In order to ensure normal operation and not be disturbed by external dust, ions, water vapor, acid and alkali erosion, high heat and other factors, a sealed frame is generally used to cooperate with the upper , The relationship between the sandwiching of the lower substrate to form a central sealed space. [0003] Generally speaking, the sealing frame can be divided into two categories according...

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Problems solved by technology

The second category is polypropylene (PP), polyethylene (PE), thermoplastic polymers and other materials, which use the characteristics of flow at high temperatures to carry out glue, and press and adhere at high temperatures to make local The sealing effect of the crystal is to block the water vapor, oxygen and other polluting factors of the internal environment from the external environment; however, the above two materials still have certain limitations, which are described in detail below

[0004] In terms of the first category above, because epoxy, acrylic, UV glue or PU and other highly polar materials are used, although considerable adhesion can be obtained for most substrates, such as polyimide (PI ), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), metal, glass, glass fiber or liquid crystal polymer, ceramics, etc.; however, because most of them are polar The functional groups of the internal materials, such as organic solvents and plasticizers, will slowly penetrate into the packaging material, thereby destroying the adhesion and blocking ability between the packaging material and the upper and lower substrates, especially for dye-sensitized solar energy. Battery or glue, liquid energy storage battery is even more serious

[0005] The second type of material is quite suitable for dye-sensitized solar cells, glue, and liquid energy storage batteries because it is a non-polar material; although it has fluidity after high temperature melting, it is relatively fluid It is still poor, and when it is cold, the viscosity will increase greatly, so it is not suitable for printing and coating template (pattern) glue; and its material itself is not high in adhesion to the substrate (such as metal Or other materials with high polarity), therefore, it is not suitable for the templated frame glue mode of the upper and lower splints, such as LCD, OLED, etc.

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