Standard comprehensive target board for rapid self-calibration of photoelectric system and measurement method for photoelectric system
An optoelectronic system and standard technology, used in measuring devices, target indicating systems, optical instrument testing, etc., and can solve problems such as measurement speed limitations and insufficient brightness.
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Embodiment 1
[0043] according to figure 1 As shown, the preferred embodiment of the present invention provides a standard integrated target plate used on the focal plane of a collimator with a focal length of 3 m, including a substrate 1, a pattern 2, a base 3, and a pressure ring 4, which are sequentially tightly packed in a housing 5, it is characterized in that: the substrate 1 is an optical flat plate that transmits laser light, visible light, and infrared radiation. In this embodiment, a silicon carbide crystal flat plate is preferred, with a diameter of 8 mm and a thickness of 300 μm. The pattern 2 is attached to the substrate 1. Multi-layer metal film 21, nano display powder 22 composition; In this embodiment, it is preferred to plate tungsten thin film and then gold thin film on substrate 1, according to figure 2 , image 3 As shown, a through-hole array with a diameter of 10 μm and a hole spacing of 12 μm is etched on the metal film 21 by photolithography. The through holes are...
Embodiment 2
[0061] according to figure 1 As shown, the preferred embodiment 2 of the present invention provides a standard comprehensive target plate for placing at a distance of 100m, including a substrate 1, a pattern 2, a base 3, and a pressure ring 4, which are tightly packed in a housing 5 in turn, and its characteristics In that: the substrate 1 is an optical flat plate that transmits laser light, visible light, and infrared radiation. In this embodiment, the preferred sapphire flat glass has a diameter of 150 mm and a thickness of 3 mm. The pattern 2 consists of a metal film layer 21 attached to the substrate 1, Micro-nano display powder 22 composition; the preferred gold-plated film material in this embodiment, according to figure 2 , image 3 As shown, an electroplating process is adopted on the metal film 21 and an array of through holes with a diameter of 6 mm and a hole spacing of 7 mm is etched. The centers of adjacent through holes form an equilateral triangle. The throug...
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