Al-Sn film negative electrode and preparation method thereof

An al-sn and thin-film technology, applied in battery electrodes, electrical components, circuits, etc., can solve the problems of irregular distribution of Al and Sn, small diffusion rate, etc., achieve structural stability improvement, good flexibility, and ease volume expansion effect of effect

Active Publication Date: 2013-08-28
SOUTH CHINA UNIV OF TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] Mutually insoluble alloy system Al-Sn has been proven to be used as a negative electrode material for lithium-ion batteries (Ref: R.Z.Hu, L. Zhang, et al. Electrochemistry Communications. 2008, 10: 1109-1112.), some researchers have jointly Al-Sn film was obtained by deposition method (Ref: Renzong Hu, Meiqin Zeng, et al.Journal of Power Sources.2009,188:268-273.), the distribution of Al and Sn prepared by this method is irregular , and Sn is easy to generate nanowires during the deposition process, although the final material has better performance, but considering Li + The diffusion rate in Al is small, which will inevitably limit the further improvement of the capacity and cycle performance of the Al-Sn thin film negative electrode. Therefore, if a new microstructure can be designed and prepared, it will help Li + Diffusion in Al, and can also slow down the volume expansion effect of electrode materials in the process of charging and discharging, will be able to obtain better performance

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  • Al-Sn film negative electrode and preparation method thereof
  • Al-Sn film negative electrode and preparation method thereof
  • Al-Sn film negative electrode and preparation method thereof

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Embodiment 1

[0033] According to the microstructure of the invented Al-Sn thin film electrode, according to the characteristics of mutual insolubility of Al and Sn, a regular array pattern is designed, and at the same time, the size of the Sn particles obtained by the vacuum magnetron sputtering thin film deposition technology, and the Al , Sn composition ratio problem, the aperture size design in the array pattern is 500nm. In the whole experiment process, the brass sheet was used as the substrate, pure Al was selected as the target material, and the Al film was prepared by vacuum magnetron sputtering, the sputtering power was 100W, and the sputtering time was 20min. PMMA with a mass fraction of 4% and a molecular weight of 350K was selected as the electron beam resist, coated on the surface of the Al film with a coater, and patterned on the resist layer by electron beam exposure. Then use PMMA as a protective layer, select 25% tetramethylammonium hydroxide aqueous solution to etch Al, so...

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Abstract

The present invention discloses an Al-Sn film negative electrode and a preparation method thereof. The preparation method comprises the following steps: a, depositing an aluminum film on a brass substrate; b, adopting the sample obtained in the step a as a substrate, and adopting PMMA as an electron beam resist to prepare a hole array microstructure on the substrate; c, adopting PMMA as a protection layer, and carrying out an etching treatment on the sample obtained in the step b to obtain a hole array microstructure on the aluminum film; d, adopting the substrate with the microcosmic structure in the step c as a substrate, and adopting pure Sn as a target to deposit the pure Sn; and e, adopting hot acetone to remove the resist PMMA to obtain the Al-Sn film negative electrode. The method has advantages of designability, controllability, high flexibility and the like, wherein artificial control and design can be performed on Al-Sn distribution so as to buffer a volume expansion effect during a lithium ion battery charge and discharge reaction process and carry out quantitative analysis on volume structure change.

Description

technical field [0001] The invention relates to a preparation method for preparing Al-Sn thin film negative electrodes of lithium ion batteries by micro-nano processing. Background technique [0002] In recent years, with the development of micro-nano processing technology, microelectronic technology and microsystem technology are also entering nanoscale from micron level. In this process, the development of various photolithography technologies also plays a very key role. [0003] Electron beam lithography, as a new generation technology to replace optical lithography, has not entered the field of mass production until today because of its low exposure yield. Nevertheless, the technology has gradually found its way into other areas of micro-nanofabrication, and making optical masks is an important commercial use of e-beam lithography. In today's era of nanotechnology, electron beam exposure is an indispensable processing method. The use of modern electron beam exposure eq...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01M4/1395H01M4/134
CPCY02E60/10
Inventor 刘江文刘佳胡仁宗曾美琴朱敏
Owner SOUTH CHINA UNIV OF TECH
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