Al-Sn film negative electrode and preparation method thereof
An al-sn and thin-film technology, applied in battery electrodes, electrical components, circuits, etc., can solve the problems of irregular distribution of Al and Sn, small diffusion rate, etc., achieve structural stability improvement, good flexibility, and ease volume expansion effect of effect
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[0033] According to the microstructure of the invented Al-Sn thin film electrode, according to the characteristics of mutual insolubility of Al and Sn, a regular array pattern is designed, and at the same time, the size of the Sn particles obtained by the vacuum magnetron sputtering thin film deposition technology, and the Al , Sn composition ratio problem, the aperture size design in the array pattern is 500nm. In the whole experiment process, the brass sheet was used as the substrate, pure Al was selected as the target material, and the Al film was prepared by vacuum magnetron sputtering, the sputtering power was 100W, and the sputtering time was 20min. PMMA with a mass fraction of 4% and a molecular weight of 350K was selected as the electron beam resist, coated on the surface of the Al film with a coater, and patterned on the resist layer by electron beam exposure. Then use PMMA as a protective layer, select 25% tetramethylammonium hydroxide aqueous solution to etch Al, so...
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