Thermosetting resin composition as well as prepreg and laminated board manufactured by using thermosetting resin composition

Abstract

The invention discloses a thermosetting resin composition. The thermosetting resin component comprises the following solids in parts by weight: (a) 10-40 parts of halogen-free flame retardant prepolymer, (b) 0-30 parts of cyanate resin, (c) 10-40 parts of active ester, (d) 10-70 parts of halogen-free epoxy resin, and the gross of four components is 100 parts. A prepreg and a laminated board manufactured by using the thermosetting resin composition provided by the invention have high heat resisting and moisture-proof thermal characteristics and the excellent dielectric property, a halogen-free flame retardant effect is realized under the condition that other phosphonium flame retardants and metallic compound are not added, and the problem that the heat resistance or dielectric properties of the board is reduced due to a lot of existing response type phosphonium flame retardants (phosphatic epoxy or phosphatic phenolic aldehyde) and additive flame-retardants are added is solved.

Description

technical field [0001] The invention belongs to the technical field of electronic materials, and relates to a thermosetting resin composition, a prepreg and a laminate made by using the thermosetting resin composition, which can be applied to the fields of integrated circuit packaging, high-frequency, high-speed and high-density interconnection, and the like. Background technique [0002] At present, epoxy resin has been widely used in various electronic insulating materials due to its advantages of good chemical resistance, good insulation, processability and low cost. However, with the high functionality and high performance of electronic components, the development of high reliability must improve the heat resistance of the plate to meet the requirements of lead-free soldering and multiple pressing. At the same time, with the high-speed information processing of electronic products With increasing application frequency and high frequency, the dielectric properties of trad...

AI Technical Summary

Problems solved by technology

However, due to its own limitations, cyanate resin has disadvantages such as poor flame retardancy and insufficient heat and humidity resistance.

[0004] Flame retardant has always been an unavoidable technical threshold for laminates. Traditional laminates mainly use brominated flame retardants, but bromides will generate hydrogen bromide, furans, dioxins and other harmful substances when burned, which are harmful to the environment and human body. cause great harm

As a substitute for bromine-containing resins, phosphorus-containing resins, phosphorus-containing compounds, and metal compounds have been widely used. However, although metal compounds are helpful to flame retardancy, they will seriously deteriorate the dielectric properties of the board.

[0005] Chinese invention patents CN102504201A, CN101967264A and CN101967265A disclose the use of cyanate esters and active esters as composite curing agents to cure naphthol-type epoxy resins, biphenyl-type epoxy resins and aralkylene epoxy resins, so as to improve the vitrification of the system For the purpose of transition temperature, optimization of dielectric properties and heat and humidity resistance, although the above patents solve the problem of heat and humidity resistance of cyanate esters, there are no special restrictions on flame retardants, and only point out that this formulation system should be selected to use non-reactive Flame retardants (including brominated and phosphorus-based), it is better not to affect the dielectric properties, and the flame retardancy is not considered in the formula of the examples

However, it has been found in practical applications that the addition of non-reactive flame retardants in the resin system has low flame retardant efficiency and will act as a plasticizer, which more or less deteriorates the dielectric properties of the board and reduces the resistance of the board. Thermal and mechanical properties, and there is a risk of migration / bleeding at high temperatures, affecting the reliability of the board

Images