Thermosetting resin composition as well as prepreg and laminated board manufactured by using thermosetting resin composition
A resin composition and prepreg technology, applied in the fields of electronic materials, high-frequency, high-speed and high-density interconnection, and integrated circuit packaging, can solve the problems of deteriorated board dielectric properties, low flame retardant efficiency, poor flame retardant properties, etc. The effect of sheet heat resistance or dielectric properties decline, high heat and humidity resistance, excellent dielectric properties
Active Publication Date: 2013-09-18
常熟生益科技有限公司
View PDF3 Cites 19 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
However, due to its own limitations, cyanate resin has disadvantages such as poor flame retardancy and insufficient heat and humidity resistance.
[0004] Flame retardant has always been an unavoidable technical threshold for laminates. Traditional laminates mainly use brominated flame retardants, but bromides will generate hydrogen bromide, furans, dioxins and other harmful substances when burned, which are harmful to the environment and human body. cause great harm
As a substitute for bromine-containing resins, phosphorus-containing resins, phosphorus-containing compounds, and metal compounds have been widely used. However, although metal compounds are helpful to flame retardancy, they will seriously deteriorate the dielectric properties of the board.
[0005] Chinese invention patents CN102504201A, CN101967264A and CN101967265A disclose the use of cyanate esters and active esters as composite curing agents to cure naphthol-type epoxy resins, biphenyl-type epoxy resins and aralkylene epoxy resins, so as to imp
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Synthetic example
[0038] Synthesis example: Synthesis of halogen-free flame retardant prepolymer
Synthetic example 1
[0040] Take bisphenol A type cyanate resin monomer 110g, 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (hereinafter referred to as DOPO) 55g, 10-(2,5-di Hydroxyphenyl)-10-hydrogen-9-oxa-10-phosphaphenanthrene-10-oxide (hereinafter referred to as DOPO-HQ) 25g and 10-(2,5-dicarboxypropyl)-9,10 - Put 10g of dihydro-9-oxo-10-phosphaphenanthrene-10-oxide (hereinafter referred to as DDP) into the reaction bottle, slowly heat to 140°C in an oil bath, and keep stirring for 4 hours , after the reaction is completed, it is cooled to room temperature for use, and is recorded as PCE-1.
Synthetic example 2
[0042] Take 130g of tetramethylbisphenol F-type cyanate resin monomer, DOPO40g, DOPO-HQ20g and DDP10g into the reaction bottle, use an oil bath to slowly heat to 130°C, and keep stirring for 10 hours, the reaction is complete After cooling to room temperature for use, it was recorded as PCE-2.
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more PUM
Login to view more Abstract
The invention discloses a thermosetting resin composition. The thermosetting resin component comprises the following solids in parts by weight: (a) 10-40 parts of halogen-free flame retardant prepolymer, (b) 0-30 parts of cyanate resin, (c) 10-40 parts of active ester, (d) 10-70 parts of halogen-free epoxy resin, and the gross of four components is 100 parts. A prepreg and a laminated board manufactured by using the thermosetting resin composition provided by the invention have high heat resisting and moisture-proof thermal characteristics and the excellent dielectric property, a halogen-free flame retardant effect is realized under the condition that other phosphonium flame retardants and metallic compound are not added, and the problem that the heat resistance or dielectric properties of the board is reduced due to a lot of existing response type phosphonium flame retardants (phosphatic epoxy or phosphatic phenolic aldehyde) and additive flame-retardants are added is solved.
Description
technical field [0001] The invention belongs to the technical field of electronic materials, and relates to a thermosetting resin composition, a prepreg and a laminate made by using the thermosetting resin composition, which can be applied to the fields of integrated circuit packaging, high-frequency, high-speed and high-density interconnection, and the like. Background technique [0002] At present, epoxy resin has been widely used in various electronic insulating materials due to its advantages of good chemical resistance, good insulation, processability and low cost. However, with the high functionality and high performance of electronic components, the development of high reliability must improve the heat resistance of the plate to meet the requirements of lead-free soldering and multiple pressing. At the same time, with the high-speed information processing of electronic products With increasing application frequency and high frequency, the dielectric properties of trad...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more Application Information
Patent Timeline
Login to view more IPC IPC(8): C08L63/00C08L79/04C08G59/40C08G59/42C08J5/24B32B15/092B32B27/04
Inventor 季立富谌香秀戴善凯肖升高崔春梅顾嫒娟粱国正
Owner 常熟生益科技有限公司
Who we serve
- R&D Engineer
- R&D Manager
- IP Professional
Why Eureka
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Social media
Try Eureka
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap