A kind of preparation method of bisphenol A type cardanol epoxy resin
A cardanol epoxy resin, epoxy resin technology, applied in the preparation of organic compounds, chemical instruments and methods, preparation of aminohydroxy compounds, etc., can solve the problems of epoxy resin toxicity, poor weather resistance, poor heat resistance, etc. Improve weather resistance, good heat resistance and good toughness
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specific Embodiment approach 1
[0025] Specific embodiment one: a kind of bisphenol A type cardanol epoxy resin of the present embodiment is characterized in that the structural general formula of bisphenol A type cardanol epoxy resin is: The R is or
[0026] The beneficial effects of this embodiment are: (1) the bisphenol A cardanol epoxy resin of the present invention is non-irritating, non-toxic and environmentally friendly; (2) has good heat resistance (200° C.) after curing; (3) Good toughness (1.5×10 4 J / m -2 ); (5) improve the weather resistance after curing, the coating will not turn yellow and powder under sunlight or ultraviolet exposure; (6) low temperature curing, curing at room temperature, the strength of the cured product is high.
specific Embodiment approach 2
[0027] Specific embodiment two: the preparation method of a kind of bisphenol A type cardanol epoxy resin described in the present embodiment is carried out according to the following steps:
[0028] Step 1. Add bisphenol A epoxy resin and absolute ethanol into the reaction vessel, stir and heat, then add cardanol amino derivatives dropwise into the reaction vessel at a temperature of 70°C to 80°C, and the dropping rate is 1d / s~2d / s, to obtain the reaction solution after dropping;
[0029] The quality of described bisphenol A type epoxy resin and the volume ratio of dehydrated alcohol are 1g:(10~16) mL; The mol ratio of described cardanol amine derivative and bisphenol A type epoxy resin is 1: (1~1.6);
[0030] Step 2. Continue to condense and reflux the reaction solution after the dropwise addition at a temperature of 70°C to 80°C for 4h to 4.5h to obtain a post-reaction solution, then cool the post-reaction solution to room temperature and evaporate the solvent using a rot...
specific Embodiment approach 3
[0034] Specific embodiment three: the difference between this embodiment and specific embodiment two is: the structural formula of the described bisphenol A epoxy resin is
[0035] The bisphenol A type epoxy resin is prepared according to the following steps: add bisphenol A and epichlorohydrin into a reaction vessel, stir and heat, and then dropwise add The mass percentage is 30% NaOH aqueous solution, the dropping speed is 1d / s~2d / s, after the dropping is completed, it is kept at 50°C~60°C for 1h~2h to obtain a yellow viscous resin, and then add it to the yellow viscous resin Add distilled water and ethyl acetate, stir until the yellow viscous resin dissolves to obtain the dissolved resin, put the dissolved resin in a separatory funnel and remove the water layer to obtain the layered resin, and finally separate the layered After the resin is dried with sodium sulfate and decompressed, bisphenol A type epoxy resin is obtained; the molar ratio of NaOH and bisphenol A is (2.5...
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