Low-density low-acidicity phenol formaldehyde foam board and preparation technique thereof

A phenolic foam board, low acid technology, applied in the field of foam insulation materials

Active Publication Date: 2014-03-05
SHANDONG SHENGQUAN NEW MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to solve the problems of high density, low strength, low pH value and easy corrosion of the above existing phenolic foam, the present invention provides a low density, high strength, pH value High low density low acid phenolic foam board

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] Add 5g of ethylene glycol (toughener), 5g of polysiloxane (emulsifier), 5g of calcium carbonate (inorganic filler), and 5g of zinc borate to 100g of phenolic resin, stir well, and then add 10g of dichloropropane ( Foaming agent) and 20g of organic mixed curing agent (p-toluenesulfonic acid and benzenesulfonic acid weight ratio 1:1, concentration is 80%) are stirred, and then clothed on a chain plate at a temperature of 60℃, and cured for 10 minutes. Forming and cutting to obtain finished products.

[0028] The phenolic resin used has a molar ratio of formaldehyde to phenol of 2:1 during preparation, and the resin viscosity is 15000mpa.s at 25°C.

Embodiment 2

[0030] Add 2g polyethylene glycol 200 (toughener), 2g polyoxyethylene ether (emulsifier), 5g magnesium hydroxide (inorganic filler), 2g antimony trioxide into 100g phenolic resin, stir well, and then add 10g Dichloromethane (foaming agent) and 15g of curing agent obtained by weight ratio of p-toluenesulfonic acid and benzenesulfonic acid at a weight ratio of 7:3, stirred, and then clothed on a chain plate at a temperature of 60℃. The cloth density was 35kg / m 3 , Curing for 10min, forming the plate and cutting to obtain the finished product.

[0031] The phenolic resin used was prepared with a molar ratio of formaldehyde to phenol of 2.3:1, and a resin viscosity of 9000mpa.s at 25°C.

Embodiment 3

[0033] Add 10g polyethylene glycol 1000 (toughening agent), 10g polyethylene sorbitan fatty acid ester (emulsifier), 5g calcium oxide (inorganic filler), 10g decabromodiphenyl ethane into 100g phenolic resin, Stir thoroughly, then add 12g of isopropyl bromide tert-butyl chloride (blowing agent) and 22g of organic acid curing agent (p-toluenesulfonic acid:benzenesulfonic acid weight ratio 6:4, concentration 80%), and stir, Then spread the cloth on the chain plate at a temperature of 60℃, and spread the glass fiber mat on the upper and lower sides of the mold, the density of the cloth is 35kg / m 3 , Curing for 10min, forming the plate and cutting to obtain the finished product.

[0034] The phenolic resin used has a molar ratio of formaldehyde to phenol of 2.3:1 during preparation, and the resin viscosity is 20000mpa.s at 25°C.

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Abstract

The invention relates to the technical field of foam thermal-insulation materials, particularly a low-density low-acidicity phenol formaldehyde foam board which is composed of the following components in parts by weight: 100 parts of phenol aldehyde resin, 1-10 parts of emulsifier, 1-10 parts of toughener, 7-12 parts of foaming agent, 3-10 parts of inorganic filler, 3-10 parts of flame retardant and 15-25 parts of organic acid curing agent. The organic acid curing agent is composed of more than one of p-toluenesulfonic acid, dimethyl benzenesulfonic acid, sulfocarbolic acid and benzenesulfonic acid. The high-proportion resin is combined with organic mixed acid into which an inorganic filler is added, and two surfaces are respectively coated with a glass fiber felt layer. The density of the prepared phenol formaldehyde foam board is 25-40 kg / m<3>, the pull strength is higher than 0.1 MPa, the close-pore ratio is higher than 90%, the heat conductivity coefficient is 0.023W / (m.k), and the pH value is higher than 4.5.

Description

technical field [0001] The invention relates to the technical field of foam insulation materials, in particular to a low-density and low-acid phenolic foam board, and to a preparation process for the low-density and low-acid phenolic foam board. Background technique [0002] Phenolic foam board is a kind of foamed plastic obtained by foaming phenolic resin because of its excellent phenolic foam. One of the fastest growing breeds. [0003] Now the development of phenolic foam has just started, and there are defects in many aspects. Compared with polystyrene board and polyurethane board, the density is high, the strength is low, the brittleness is high, and the pH value is low and easy to corrode. Especially the pH value, because if the pH value is too low, the board will easily cause an acid-base reaction with the cement bonding mortar when it encounters water, which will affect the adhesion. Therefore, on the basis of the excellent flame retardancy of phenolic foam, it i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L61/06C08K13/02C08K5/42C08K3/30C08K3/26C08K3/38C08K5/053C08K3/22C08K5/03C08J9/14B32B27/12B32B27/42
Inventor 邓刚彭绵广秦海洋焦壮宋长啸王元曦
Owner SHANDONG SHENGQUAN NEW MATERIALS CO LTD
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