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Method for separating metal and nonmetal of waste printed circuit board base plate

A technology for waste printed circuits and boards and substrates, applied in the direction of improving process efficiency, can solve problems such as performance degradation, damage, and oxidation of non-metallic materials, and achieve the effects of easy handling, environmental friendliness, and mild reaction conditions.

Active Publication Date: 2014-03-26
INST OF CHEM CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the metal in the substrate is leached with strong acids such as nitric acid and sulfuric acid and hydrogen peroxide, the non-metallic material on the substrate will be oxidized and destroyed on the one hand; on the other hand, the dissolved metal ions will also destroy the molecular structure of the non-metallic material on the substrate. Reduced performance of metal materials

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] Mix n-butylamine and water in a container to prepare a n-butylamine aqueous solution with a pH value of 9, and immerse the single-layer substrate and / or multi-layer substrate of the waste printed circuit board with copper rivets and copper foil in the described In n-butylamine aqueous solution; at room temperature and under the condition of avoiding light, hydrogen peroxide aqueous solution is added dropwise to it while magnetic stirring, and the liquid medium of single-layer substrate and / or multi-layer substrate immersed in waste printed circuit board substrate is prepared system; after observing that bubbles are generated on the surface of copper rivets and copper foils, continue to add the hydrogen peroxide solution dropwise until the copper rivets and copper foils are separated from the waste printed circuit board substrate, then stop adding the hydrogen peroxide solution Hydrogen oxide aqueous solution; take out the treated waste printed circuit board substrate, an...

Embodiment 2

[0023] Mix ethylenediamine and water in a container to prepare an aqueous solution of ethylenediamine with a pH value of 12, and immerse the single-layer substrate and / or multi-layer substrate of the waste printed circuit board with copper rivets and copper foil in the described In the aqueous solution of ethylenediamine; at room temperature and under the condition of avoiding light, add the aqueous solution of benzoyl peroxide dropwise while stirring mechanically, and prepare the single-layer substrate and / or multi-layer substrate immersed in the waste printed circuit board substrate. Liquid medium system; After observing that bubbles are generated on the surface of copper rivets and copper foils, continue to drop the described dibenzoyl peroxide aqueous solution until the copper rivets and copper foils are separated from the waste printed circuit board substrate, and then stop dripping Add the dibenzoyl peroxide aqueous solution; take out the treated waste printed circuit boa...

Embodiment 3

[0027] Mix tert-butylamine and isobutylamine (volume ratio: 1:1) and water in a container to prepare a mixed aqueous solution of tert-butylamine and isobutylamine with a pH value of 10, and use waste printed circuit boards with copper rivets and copper foil The single-layer substrate and / or multi-layer substrate are immersed in the mixed aqueous solution of tert-butylamine and isobutylamine; at room temperature and under the condition of avoiding light, hydrogen peroxide aqueous solution is added dropwise to it while magnetic stirring, and the impregnated The liquid medium system of the single-layer substrate and / or multi-layer substrate of the waste printed circuit board substrate; after observing that there are bubbles on the surface of the copper rivet and copper foil, continue to add the aqueous hydrogen peroxide solution until the copper rivet After the copper foil is separated from the waste printed circuit board substrate, stop dripping the aqueous hydrogen peroxide solu...

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PUM

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Abstract

The invention belongs to the field of recovery of a waste printed circuit board, and relates to a method for separating the metal and nonmetal of a waste printed circuit board base plate. The method comprises the following steps of preparing an organic amine water solution and an oxidizing agent to obtain a liquid medium in the presence of the oxidizing agent by utilizing the property of organic amine and metallic copper on generating complex reaction at room temperature; separating a copper rivet and a copper foil from the nonmetal material of the waste printed circuit board by reacting and dissolving the surface parts of the copper rivet and the copper foil which are positioned on the waste printed circuit board base plate and the liquid medium to obtain the treated nonmetal material of the waste printed circuit board and the copper rivet and the copper foil which are dropped from the waste printed circuit board base plate; recovering copper contained in the liquid medium by electrolyzing the used liquid medium, wherein the electrolyzed liquid medium can be recycled. The method disclosed by the invention is mild in reaction condition, easy to operate and convenient to control; the liquid medium does not damage the nonmetal material of the waste printed circuit board base plate, and 'three wastes' are not discharged.

Description

technical field [0001] The invention belongs to the recycling of waste printed circuit boards, in particular to a method for separating metal and nonmetal of waste printed circuit board substrates. Background technique [0002] In recent years, due to the sharp increase in the use of electronic equipment worldwide, the amount of waste of electronic and electrical equipment, such as televisions, computers, mobile phones, and electronic entertainment equipment, has also increased rapidly. It is estimated that the current annual production of major electronic waste in my country is 1.5 million tons, accounting for about 1% of the total annual production of domestic waste in my country, and growing at a rate of 13% to 15% per year. Among electronic waste, the recycling of printed circuit boards is the most complex, but also the most valuable, because it contains copper, lead, tin, chromium, cadmium, mercury, nickel, gold, silver, palladium and other precious metals . [0003] ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22B7/00C22B15/00
CPCY02P10/20
Inventor 马永梅彭中樑曹新宇贺丹王斌易丹青王佛松
Owner INST OF CHEM CHINESE ACAD OF SCI