Preparation method for nano-composite high-tin copper alloy electroplating material

A tin-copper alloy, nano-composite technology, used in electrolytic coatings, coatings, etc.

Active Publication Date: 2014-03-26
安徽金瑞表面处理有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the alloy is brittle and cannot withstand deformation. There are pores and cracks on the surface, and the microhardness is low and uneven; with the continuous deepening of research on nanomaterials and nanotechnology, it has become a trend for electroplating to introduce nanoscale insoluble particles into alloy coatings; nano-alumina is cheap , the physical and chemical properties are very stable, with special properties such as small size effect, quantum size effect and surface effect, which are superior to ordinary coatings

Method used

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  • Preparation method for nano-composite high-tin copper alloy electroplating material
  • Preparation method for nano-composite high-tin copper alloy electroplating material
  • Preparation method for nano-composite high-tin copper alloy electroplating material

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Effect test

Embodiment 1

[0022] Plating solution formula: Cu 2 P 2 o 7 5g, Sn 2 P 2 o 7 1.6g, K 4 P 2 o 7 50g, K 2 HPO 4 16g, the bath volume is 200ml.

[0023] Plating solution preparation: weigh the required amount of K 4 P 2 o 7 Put it into a beaker, add an appropriate amount of distilled water, and after it is completely dissolved under magnetic stirring, add the required Cu 2 P 2 o 7 Stir to dissolve the solid until the solution is clear, then add the weighed Sn 2 P 2 o 7 , then add the required amount of conductive salt K 2 HPO 4 , and then add an appropriate amount of distilled water, and under stirring conditions, dropwise add phosphoric acid solution to neutralize the solution until the pH reaches 8.8, leave it for a while until the plating solution turns dark blue and clear, pour it into the plating tank, and use air to stir during the electroplating process.

[0024] The method for preparing a composite coating by the composite plating solution comprises the f...

Embodiment 2

[0032] Plating solution formula: Al 2 o 3 Nano powder 0.8g, Cu 2 P 2 o 7 5g, Sn 2 P 2 o 7 1.6g, K 4 P 2 o 7 50g, K 2 HPO 4 16g, the bath volume is 200ml.

[0033] Plating solution preparation: weigh the required amount of K 4 P 2 o 7 Put it into a beaker, add an appropriate amount of distilled water, and after it is completely dissolved under magnetic stirring, add the required Cu 2 P 2 o 7 Stir to dissolve the solid until the solution is clear, then add the weighed Sn 2 P2 o 7 , then add the required amount of conductive salt K 2 HPO 4 , adding nano-Al 2 o 3 , and then add an appropriate amount of distilled water, under stirring conditions, dropwise add phosphoric acid solution to neutralize the solution until the pH reaches 8.8, pour it into the plating tank, and use air stirring during the electroplating process.

[0034] The method for preparing a composite coating by the composite plating solution comprises the following steps:

[0035] ...

Embodiment 3

[0042] Plating solution formula: Al 2 o 3 Nano powder 1.6g, Cu 2 P 2 o 7 5g, Sn 2 P 2 o 7 1.6g, K 4 P 2 o 7 50g, K 2 HPO 4 16g, the bath volume is 200ml.

[0043] Plating solution preparation: weigh the required amount of K 4 P 2 o 7 Put it into a beaker, add an appropriate amount of distilled water, and after it is completely dissolved under magnetic stirring, add the required Cu 2 P 2 o 7 Stir to dissolve the solid until the solution is clear, then add the weighed Sn 2 P 2 o 7 , then add the required amount of conductive salt K 2 HPO 4 , adding nano-Al 2 o 3 , add an appropriate amount of distilled water, and under stirring conditions, add phosphoric acid solution dropwise to neutralize the solution until the pH reaches 8.9, pour it into the plating tank, and use air stirring during the electroplating process.

[0044] The method for preparing a composite coating by the composite plating solution comprises the following steps:

[0045] ...

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Abstract

The invention relates to the field of composite electroplating technology, and particularly relates to a preparation method for a nano-composite high-tin copper alloy electroplating material. The preparation method comprises the steps of adding a certain amount of Al2O3 nano powder (with average particle size of less than 100nm) into pyrophosphate electroplating copper-tin alloy plating solution, stirring bath solution by a stirrer in the preparation process, fully suspending in the plating solution to avoid the clustering of the nano powder, reducing metal ions by utilizing the electro-deposition principle, embedding nano alumina into a plating layer, to reduce holes and cracks on the surface of the plating layer. The surface of the prepared coating is compact, and the microhardness distribution is relatively even.

Description

technical field [0001] The invention relates to the technical field of composite electroplating, in particular to a preparation method of a nanocomposite high-tin copper alloy electroplating material. Background technique [0002] Cupronickel-tin alloy has good coating leveling, good brightness, low cost, more realistic color, good decorative effect, good smoothness, corrosion resistance and suitable hardness; it can prevent the diffusion of the bottom metal to the surface layer, prevent Due to the advantages of discoloration of the metal coating, it has been widely used; the copper-tin alloy plating solution is composed of soluble tin salts, copper salts, organic acids, surfactants and antioxidants. Cyanide-free plating solution; the cyanide-containing electroplating copper-tin alloy process is the most mature, the plating solution has good dispersion ability, and the coating composition and color are easy to control, but the toxicity is high and the pollution is serious; ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D15/00C25D3/58
Inventor 宋仁国郭燕清王超戈云杰
Owner 安徽金瑞表面处理有限公司
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