Method for producing polyimide laminate, and polyimide laminate

A technology for polyimide layers and laminates, applied in the field of polyimide laminates and their preparation, can solve the problems of reduced adhesion, reduced system vacuum, insufficient heat resistance, etc., and achieves inhibition of thermal decomposition. , Excellent heat resistance, high heat resistance effect

Active Publication Date: 2014-04-16
UBE IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] Regarding the aromatic polyamide film, Patent Document 4 discloses that when an ITO thin film or the like is formed on the surface of the film by sputtering or the like, volatile components generated from the inside of the film may cause The reduction of system vacuum, and thus may reduce the efficiency of sputtering, and may hinder the normal de

Method used

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  • Method for producing polyimide laminate, and polyimide laminate
  • Method for producing polyimide laminate, and polyimide laminate
  • Method for producing polyimide laminate, and polyimide laminate

Examples

Experimental program
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Effect test

Embodiment 1

[0125] In a 500 mL (internal volume) glass reactor equipped with a stirrer and a nitrogen inlet / outlet tube, 410.1267 g of N-methyl-2-pyrrolidone was placed as a solvent. Then, 26.8886 g (0.2486 moles) of PPD and 73.1431 g (0.2486 moles) of s-BPDA were added thereto, and the mixture was stirred at 50° C. to provide polyamic acid having 18.21% solid content and 0.65 dL / g intrinsic viscosity Solution. Then, 2.0006g (0.0061 mol, 2.5 mol% based on 100 mol% of the tetracarboxylic acid component, 2.0wt% based on the total weight of the tetracarboxylic acid component and diamine component, the same applies below) Triphenyl ester is added as a phosphorus compound to the obtained polyamic acid solution.

[0126] The polyamic acid solution was applied on a glass plate as a substrate with a bar coater. The resulting coating film was heated at 120°C for 10 minutes, 150°C for 40 minutes, 180°C for 60 minutes, 200°C for 10 minutes, 250°C for 10 minutes, and then 500°C for 5 minutes to be on ...

Embodiment 2

[0129] The same procedure as in Example 1 was implemented, except that 5.016 g (0.0153 mol, 6.2 mol %, 5.0 wt %) of triphenyl phosphate was added as the phosphorus compound. The results are shown in Table 2.

Embodiment 3

[0131] The same procedure as in Example 1 was performed, except that 15.0160 g (0.0460 mol, 18.5 mol %, 15.0 wt %) of triphenyl phosphate was added as the phosphorus compound. The results are shown in Table 2.

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Abstract

The present invention relates to a polyimide laminate obtained by: casting, onto a substrate, a polyamic acid solution composition including a phosphorus compound, and a polyamic acid that is obtained from a tetracarboxylic acid component including 3,3',4,4'-biphenyltetracarboxylic acid dianhydride as a principal component, and a diamine component including para-phenylenediamine as a principal component; and heating the above to form a polyimide layer having a thickness of less than 50 [mu]m on the substrate.

Description

Technical field [0001] The present invention relates to a polyimide laminate product containing a polyimide layer, and a preparation method thereof. The polyimide layer is formed by a specific tetracarboxylic acid component and a specific diamine component, and has High heat resistance without thermal decomposition in the temperature range of 500℃-650℃. Background technique [0002] It is known that a polyimide film with particularly excellent properties such as heat resistance, chemical resistance, radiation resistance, electrical insulation, dimensional stability, mechanical properties, etc. can be prepared as follows: [0003] A polyamic acid solution is applied on the substrate, and the polyamic acid solution is prepared by adding an aromatic tetracarboxylic dianhydride containing 3,3',4,4'-biphenyltetracarboxylic dianhydride as a main component in a substantially equimolar ratio It is prepared by reacting with aromatic diamine containing p-phenylenediamine as the main compone...

Claims

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Application Information

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IPC IPC(8): B32B27/34B05D3/02B05D7/24
CPCB32B27/34C08G73/1028C09D179/08C08G73/1067Y10T428/264B32B27/281B32B37/06B32B27/18B05D3/02C08J7/04B32B2309/02B32B2309/105
Inventor 中山知则中山刚成
Owner UBE IND LTD
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