Organic silicon resin as well as preparation method and application thereof

Abstract

The invention discloses organic silicon resin. The organic silicon resin comprises a component A and a component B, the mass ratio of which is 0.1:1-1:10, wherein the component A comprises vinyl phenyl polysiloxane, vinyl phenyl silicone oil, a platinum-containing polysiloxane catalyst and a tackifier, the mass ratio of which is 100: (10-55): (0.5-1): (1-1.5), and the component B comprises phenyl vinyl polysiloxane, hydrogen-containing phenyl polysiloxane and an inhibitor, the mass ratio of which is 100: (40-80): (0.05-0.1). The invention also discloses a preparation method of the organic silicon resin and an application of the organic silicon resin in LED (Light Emitting Diode) encapsulation. The organic silicon resin provided by the invention has the following advantages that 1. Ba(OH)2 can be completely removed, and the storage stability of the resin is not affected; 2. the problem of low curing rate is solved; and 3. the organic silicon resin has high thermal shock resistance, high refractive index and high hardness.

Description

technical field [0001] The invention relates to the field of packaging material design, in particular to a silicone resin used in LED packaging, its preparation method and application. Background technique [0002] Light-emitting diode (LED) is a semiconductor light-emitting device that converts electrical energy into light energy. It saves 80% of electricity compared with incandescent lamps and 50% of energy-saving lamps. Because it does not use mercury that is harmful to the environment, LED light-emitting devices are small in size and long in service life. They have been applied in backlights, street lights, industrial and mining lights, landscape lighting, home lighting, traffic lights, etc. With the improvement of cost performance, It is gradually replacing traditional light sources as a new generation of light sources. [0003] The packaging material is an indispensable part of the lighting device. The packaging material determines the light efficiency and service lif...

AI Technical Summary

Problems solved by technology

However, due to the large difference in the hydrolysis activity of the above components, the synthesized polymer is not uniform, which seriously affects the mechanical properties and light transmittance of the cured film, and finally leads to the product being exposed to severe temperature changes and ultraviolet radiation. Cracking and yellowing occur, and the above methods will generate a large amount of waste water, seriously polluting the environment

[0006] The research team of Byeong-Soo Bae from Korea Advanced Institute of Science and Technology recently published a number of papers on organosilicon hybrid materials in high-level SCI journals Research papers were published on Chemistry of materials in 2010 entitled Thermally Stable Transparent Sol-Gel Based Siloxane Hybrid Material with High Refractive Index for Light Emitting Diode (LED) Encapsulation, and in 2012 on Journal of Materials Chemistry For the research paper on High performance encapsulant for light-emitting diodes (LEDs) by a sol-gel derived hydrogen siloxane hybrid, Byeong-Soo Bae's research team used diphenylsiloxane as one of the raw materials and Ba(OH )2 was used as a catalyst to synthesize a series of silicone resins. The silicone resin synthesized by this method will cause a small amount of Ba(OH)2 to remain in the system, resulting in the storage of the resin. The stability is very poor, and the synthetic resin has a great influence on the curing rate after compounding. In the literature, it is required to add 200ppm of platinum catalyst to increase the curing temperature to 150oC, so it is often It brings the problems of low refractive index and low hardness of the resin and low thermal shock resistance