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Glass resin LED (light-emitting diode) heat dissipation paint and preparation method thereof

A technology of glass resin and heat-dissipating coatings, applied in coatings and other directions, can solve the problems of poor temperature resistance and aging resistance, poor heat dissipation effect, and low adhesion of substrates, etc., to achieve easy coating, strong light transmittance, Good film-forming effect

Inactive Publication Date: 2014-06-25
程实
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, heat conduction adhesive is used to solve the heat dissipation problem of LED lamps, but the materials used have poor temperature resistance and aging resistance, low adhesion to the substrate, poor heat dissipation effect, and inconvenient construction. It is difficult to meet people's expectations for LED lamps. Cooling Requirements

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0010] A glass resin LED heat dissipation paint made of the following parts by weight (kg) of raw materials: chlorinated polypropylene resin 7, butyl methacrylate 12, glass resin 55, fumed silica 11, chromium complex coupling Agent 4, m-xylylenediamine 6, stearoyl benzoyl methane 4, benzophenone 1.5, butyl carbitol 21, film-forming aid 4.5.

[0011] The said film-forming aid is prepared from the following parts by weight (kg) of raw materials: ethylene glycol ethyl ether acetate 8, 2-oxoacetoxybutyric acid 3, acrylic acid 4, polyvinyl butyral 3, hexamethyl Phosphorus triamide 4, geranyl acetate 4, isopropyl tris(dioctyl pyrophosphate acyloxy) titanate 0.7, hydroxymethyl propyl cellulose 2.5, nano chitin 0.4, plastic starch 1.5, Acetyl peroxide 0.3, propylene glycol monomethyl ether acetate 17; the preparation method is: ethylene glycol ethyl ether acetate, hexamethylphosphoric triamide, geranyl acetate, hydroxymethyl propyl cellulose, nano chitin Mix the plastic starch and propy...

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PUM

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Abstract

The invention relates to a glass resin LED (light-emitting diode) heat dissipation paint which is prepared from the following raw materials in parts by weight: 6-8 parts of chlorinated polypropylene resin, 10-13 parts of butyl methacrylate, 50-60 parts of glass resin, 8-13 parts of gas-phase silica white, 3-6 parts of chrome complex coupling agent, 5-7 parts of meta xylylene diamine, 3-5 parts of stearoyl benzoyl methane, 1-2 parts of diphenyl ketone, 19-22 parts of butyl carbitol and 4-5 parts of film-forming assistant. The paint has the advantages of hard and transparent film, favorable insulating property, friction resistance, heat resistance, aging resistance radiation resistance, no embrittlement at low temperature, high hydrophobicity, moisture resistance, no toxicity and high light transmittance; and by adding the gas-phase silica white the wear resistance and heat dissipation property of the paint are enhanced. By using the film-forming assistant, the paint has favorable film-forming property and is easy for application.

Description

Technical field [0001] The invention belongs to the technical field of coatings, and particularly relates to a glass resin LED heat dissipation coating and a preparation method thereof. Background technique [0002] With the rapid expansion of the scope of use of LED lights, extending the service life of LED lights has also become an urgent problem to be solved. With the increase of LED power, the heat dissipation problem has been paid more and more attention. At present, thermal conductive glue is used to solve the heat dissipation problem of LED lights, but the materials used have poor temperature resistance and aging resistance, low adhesion to the substrate, poor heat dissipation, and inconvenient construction. It is difficult to meet people's technical problems with LED lights. Heat dissipation requirements. Summary of the invention [0003] The purpose of the present invention is to provide a glass resin LED heat dissipation coating and a preparation method thereof. The coa...

Claims

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Application Information

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IPC IPC(8): C09D4/02C09D4/06C09D7/12
Inventor 程实
Owner 程实