A polyamide adhesive for card making
A polyamide and adhesive technology, which is applied in the direction of non-polymer adhesive additives, adhesives, adhesive additives, etc., can solve the problems of decreased adhesive force, poor aging performance of cards, and mutual detachment of card layers. , to achieve the effect of improving adhesion, wide applicability and enhancing cohesion
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Embodiment 1
[0031] A kind of card making polyamide adhesive, its preparation method is:
[0032] (1) Preparation of modified polyamide: under a nitrogen atmosphere, 143 g of glutaric acid, 4.2 g of 2-chloro-1,5-glutaric acid, polytetrahydrofuran diol ( Molecular weight 1000) 48g, pentaerythritol 12.1g, 3-chloro-1,2-propanediol 3.6g, control the pressure in the reactor 11×10 5 Pa, the temperature is 195°C, and after 1.5 hours of reaction, the unreacted small molecule dibasic acid is distilled off under reduced pressure, and then 18g of ethylenediamine is added to control the pressure to be 11×10 5 Pa, the temperature is 195°C, after reacting for 1.5 hours, drop to normal pressure and add 200g butanone and 400g isopropanol to obtain a modified polyamide solution.
[0033] (2) Preparation of enhancer: 100 g of isopropanol was added to a container with a stirring and condenser, then 6 g of hydrophobic silica particles were added, and stirred at room temperature for 1.2 hours.
[0034] (3) A...
Embodiment 2
[0036] A kind of card making polyamide adhesive, its preparation method is:
[0037] (1) Preparation of modified polyamide: under a nitrogen atmosphere, add 101 g of adipic acid, 3.2 g of 3-chloro-1,6-hexanedioic acid, polytetrahydrofuran diol ( Molecular weight 1000) 39g, trimethylolpropane 10.3g, 3-chloro-1,2-propanediol 2.1g, control the pressure in the reactor 11×10 5 Pa, the temperature is 195°C, after 1.5 hours of reaction, the unreacted small molecule dibasic acid is distilled off under reduced pressure, and then 11g of ethylenediamine is added to control the pressure to be 11×10 5 Pa, the temperature is 195°C, after reacting for 1.5 hours, drop to normal pressure and add 300g butanone and 290g isopropanol to obtain a modified polyamide solution.
[0038] (2) Preparation of enhancer: 80 g of methyl ethyl ketone was added into a container with stirring and condenser, then 43 g of hydrophobic silicon dioxide particles were added, and stirred at room temperature for 1.2 h...
Embodiment 3
[0041] A kind of card making polyamide adhesive, its preparation method is:
[0042] (1) Preparation of modified polyamide: under nitrogen environment, add pimelic acid 167g, 2-chloro-1,5-glutaric acid 5.8g, polyester diol ( Molecular weight 1000) 62g, pentaerythritol 14.1g, 3-chloro-1,2-butanediol 4.3g, control the pressure in the reactor 11×10 5 Pa, the temperature is 195°C, and after 1.5 hours of reaction, the unreacted small molecule dibasic acid is distilled off under reduced pressure, and then 18g decanediamine is added to control the pressure to be 11×10 5 Pa, the temperature is 195°C, after reacting for 1.5 hours, drop to normal pressure and add 300g butanone and 400g isopropanol to obtain a modified polyamide solution.
[0043] (2) Preparation of enhancer: Add 110 g of isopropanol into a container with a stirring and condenser, then add 8.5 g of hydrophobic silica particles, and stir at room temperature for 1.2 hours.
[0044] (3) After uniformly mixing the modified...
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