A kind of method for preparing cerium oxide buffer layer by electrochemical deposition
A cerium oxide and buffer layer technology is applied in the field of electrochemical deposition to prepare cerium oxide buffer layers, which can solve problems such as unfavorable preparation of cerium oxide buffer layers, expensive and harsh reducing atmosphere for high-temperature preparation processes, and avoid the increase of crystal grains and cost. Inexpensive, effect of increasing adhesion
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Embodiment 1
[0026] The preparation method of the present embodiment comprises the following steps:
[0027] Step 1, dissolving 0.868g cerium nitrate hexahydrate in 200mL deionized water to prepare an electroplating solution with a cerium ion concentration of 0.01mol / L, then adding ammonium nitrate solution to adjust the pH value of the electroplating solution to 6;
[0028] Step 2. Place the nickel-tungsten alloy substrate in the electroplating solution after adjusting the pH value in step 1 as the cathode, use the graphite sheet as the anode, and adjust the current density of the DC power supply to 5mA / cm 2 , performing electroplating treatment on the nickel-tungsten alloy substrate at 25°C to form a cerium oxide electroplating layer on the surface of the nickel-tungsten alloy substrate; the electroplating treatment time is 10 minutes;
[0029] Step 3. Place the nickel-tungsten alloy substrate after electroplating in step 2 for annealing treatment in a tube furnace, and cool with the fur...
Embodiment 2
[0032] The preparation method of the present embodiment comprises the following steps:
[0033] Step 1, dissolving 0.434g cerium nitrate hexahydrate in 200mL deionized water to prepare an electroplating solution with a cerium ion concentration of 0.005mol / L, then adding ammonium nitrate solution to adjust the pH value of the electroplating solution to 7;
[0034] Step 2. Place the nickel-tungsten alloy substrate in the electroplating solution after adjusting the pH value in step 1 as the cathode, use the graphite sheet as the anode, and adjust the current density of the DC power supply to 3mA / cm 2 , performing electroplating treatment on the nickel-tungsten alloy substrate at 20°C to form a cerium oxide electroplating layer on the surface of the nickel-tungsten alloy substrate; the electroplating treatment time is 10 minutes;
[0035] Step 3. Place the nickel-tungsten alloy substrate after electroplating in step 2 for annealing treatment in a tube furnace, and cool with the fu...
Embodiment 3
[0038] The preparation method of the present embodiment comprises the following steps:
[0039] Step 1, dissolving 4.34g cerium nitrate hexahydrate in 200mL deionized water to prepare an electroplating solution with a cerium ion concentration of 0.05mol / L, then adding ammonium nitrate solution to adjust the pH of the electroplating solution to be 8;
[0040] Step 2. Place the nickel-tungsten alloy substrate in the electroplating solution after adjusting the pH value in step 1 as the cathode, use the graphite sheet as the anode, and adjust the current density of the DC power supply to 10mA / cm 2 , performing electroplating treatment on the nickel-tungsten alloy substrate at 25° C. to form a cerium oxide electroplating layer on the surface of the nickel-tungsten alloy substrate; the electroplating treatment time is 1 min;
[0041] Step 3. Place the nickel-tungsten alloy substrate after electroplating in step 2 for annealing treatment in a tube furnace, and cool with the furnace t...
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