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Halogen-free flame-retardant thermosetting resin composition of integrated circuit, prepreg and laminate

A resin composition and integrated circuit technology, applied in the direction of synthetic resin layered products, layered products, metal layered products, etc., can solve the problems of low dielectric constant, reduced heat and humidity resistance of plates, and high dielectric strength of water absorption. Constant and other issues, to achieve the effect of reducing the dielectric constant, reducing the thermal expansion coefficient, and low dielectric constant

Active Publication Date: 2014-08-13
SHENGYI TECH SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The reactive type is mainly DOPO compounds, mainly phosphorus-containing epoxy resin and phosphorus-containing phenolic resin, and the phosphorus content is between 2-10%. However, it is found in practical applications that phosphorus-containing epoxy resin is used as the main resin or Phosphorus-containing phenolic resin is a resin composition of epoxy resin curing agent, which has a large water absorption rate and a high dielectric constant, and the heat and humidity resistance of the board made of it is reduced; the additive type is mainly phosphazene And phosphate compounds, the flame retardant efficiency of additive flame retardants is lower than that of reactive types, and more phosphorus content needs to be added to achieve UL 94V-0 flame retardancy. At the same time, because of its low melting point (generally lower than 150°C), during the processing of the laminate, it is easy to "migrate" to the surface of the board
[0005] Therefore, the application of the above-mentioned phosphorus-containing flame retardant technology often cannot meet the requirements of the formulation design of the resin composition with low dielectric constant and excellent moisture and heat resistance. Copper clad laminates with high heat resistance and low dielectric constant have become one of the future development directions of copper clad laminates

Method used

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  • Halogen-free flame-retardant thermosetting resin composition of integrated circuit, prepreg and laminate
  • Halogen-free flame-retardant thermosetting resin composition of integrated circuit, prepreg and laminate
  • Halogen-free flame-retardant thermosetting resin composition of integrated circuit, prepreg and laminate

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0058] Preparation 1 of phosphorus-containing active ester compound:

[0059] Weigh 0.6mol of 10-(2,5-dihydroxyphenyl)-10-hydrogen-9-oxa-10-phosphaphenanthrene-10-oxide and 0.6mol of p-hydroxybenzaldehyde, add 65% mass Concentration of H 2 SO 4 , condensed and refluxed at 100°C for 3 to 5 hours, and then the mixture was washed with alcohol 4 to 6 times to obtain the pre-product; the above-mentioned pre-product was dissolved in toluene solution, and 0.2mol of benzoic acid was added. temperature conditions, add 0.05mol catalyst (AlCl 3 ), condensed and refluxed for 4 hours, and then after several times of washing, dried for 4 hours under vacuum at 105°C to obtain the desired phosphorus-containing active ester compound with an esterification rate of 70-80% and a phosphorus content of 6.4%. Phosphorus-containing active ester compound, the specific structure is as follows:

[0060]

[0061] X= , Y=H, Z= , R is phenyl, R1=CH 3 , n is 3~5.

[0062] The NMR spectrum of th...

Synthetic example 2

[0067] Synthesis Example 2: Synthesis of Allyl Modified Bismaleimide Prepolymer

[0068] React 100 parts of 4,4'-diphenylmethane bismaleimide resin with 50 parts of diallyl bisphenol A compound at 135°C for 80 minutes, then cool to room temperature to obtain the desired olefin Propyl modified bismaleimide resin prepolymer A1, its molecular weight is 2000~4000g / mol;

[0069] React 100 parts of 4,4'-diphenyl ether bismaleimide resin with 100 parts of diallyl bisphenol A allyl compound at 155°C for 50 minutes, then cool to room temperature to obtain the obtained The desired allyl-modified bismaleimide resin prepolymer A2 has a molecular weight of 4001-6000 g / mol.

Embodiment

[0071] Allyl modified bismaleimide prepolymer, benzoxazine resin, acid anhydride compound, epoxy resin, phosphorus-containing active ester compound, curing accelerator, inorganic filler and solvent according to the weight ratio shown in table 1 Add it into the rubber mixing kettle, control the solid content of the glue solution to 65%, stir evenly, and ripen it for 8hr to make the resin composition glue solution; then impregnate the glass cloth in the above resin composition glue solution; then soak the impregnated The glass cloth is baked at 155~175°C for 4~7 minutes to form a prepreg; after cutting the prepreg to a certain size, stack 8 prepregs to form a stack, and place an electrolytic copper foil on the top and bottom of the stack. Send them into a vacuum press for pressing, the program is 150°C / 60min+200°C / 120min, to obtain a laminate.

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Abstract

The invention discloses a halogen-free flame-retardant thermosetting resin composition of an integrated circuit, a prepreg and a laminate. Totaling 100 parts, the resin composition contains the following ingredients in parts by solid weight: (a) 10-50 parts of an allyl modified bismaleimide resin prepolymer, (b) 10-30 parts of an acid-anhydride compound, (c) 5-30 parts of benzoxazine resin, (d) 5-30 parts of epoxy resin and (e) 20-40 parts of phosphoric active ester. The resin composition disclosed by the invention has a high glass transition temperature, excellent moist heat resistance and a relatively low dielectric constant, can better meet the design requirements on multilayer board impedance and is beneficial to application in the field of high-performance printed circuit boards, such as high-density interconnected integrated circuit package.

Description

technical field [0001] The invention belongs to the technical field of electronic materials, and relates to a halogen-free resin composition used for integrated circuits and a prepreg and a laminate made using the same, which can be applied to the fields of high-density interconnected integrated circuit packaging and the like. Background technique [0002] In recent years, with the continuous development of electronic technology, the replacement of electronic products has become more and more rapid, which puts forward higher requirements for printed electronic circuits. One of the directions of development. High multi-layer and high wiring density, which requires the basic material of the circuit board - copper clad laminate, has a low thermal expansion coefficient, high heat resistance, and a low dielectric constant, in order to In the process of printed circuit design, it meets the thermal shock suffered during impedance design and processing. [0003] In order to meet t...

Claims

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Application Information

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IPC IPC(8): C08L79/08C08L79/04C08L63/00C08G59/40C08G59/42C08K5/5313C08J5/24B32B27/04B32B15/092
CPCB32B15/092B32B2260/046C08J5/24C08J2379/08C08J2463/00C08J2479/04C08K2201/003C08L79/085C08L2201/02C08L2201/08C08L2201/22C08L2205/03C08L79/04C08L63/00C08K5/5313C08K3/36
Inventor 崔春梅戴善凯肖升高季立富黄荣辉谌香秀
Owner SHENGYI TECH SUZHOU
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