Conductive paste and method for producing conductive pattern

A conductive paste, conductive technology, applied in conductive materials dispersed in non-conductive inorganic materials, printed circuit manufacturing, cable/conductor manufacturing, etc. and other problems to achieve the effect of good connection reliability

Active Publication Date: 2014-09-10
TORAY IND INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the alkali-soluble organic component that imparts photosensitivity usually has a high acid value, and even if tin oxide fine powder doped with ant

Method used

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  • Conductive paste and method for producing conductive pattern
  • Conductive paste and method for producing conductive pattern
  • Conductive paste and method for producing conductive pattern

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0060] Examples of the present invention will be described below, but the present invention is not limited to these Examples. Materials and evaluation methods used in Examples and Comparative Examples are as follows.

[0061]

[0062] Regarding the aspect ratio of the composite particles (A), the aspect ratios of 100 particles were obtained from the SEM or TEM images, and the average value was taken.

[0063]

[0064] Coat the conductive paste on the PET film in such a way that the dry thickness reaches 10 μm, and dry it in a drying oven at 90°C for 5 minutes. ) as a unit, exposed and developed through a photomask having a light-transmitting pattern having 9 types of units with different L / S values, and then cured at 130°C for 1 hour to obtain Get a conductive pattern. The L / S value of each unit is set to 500 / 500, 250 / 250, 100 / 100, 50 / 50, 40 / 40, 30 / 30, 25 / 25, 20 / 20, 15 / 15 (indicating the line width (μm) / interval (μm)). The pattern was observed with an optical microscop...

Synthetic example 1

[0082] (Synthesis Example 1) Compound B-1 with an acid value in the range of 30 to 250 mgKOH / g

[0083] Copolymer of ethyl acrylate (EA) / 2-ethylhexyl methacrylate (2-EHMA) / styrene (St) / acrylic acid (AA) (copolymerization ratio: 20 parts by weight / 40 parts by weight / 20 The substance obtained by addition reaction of 5 parts by weight of glycidyl methacrylate (GMA) in parts by weight / 15 parts by weight)

[0084] 150 g of diethylene glycol monoethyl ether acetate was put into the reaction container of nitrogen atmosphere, and it heated up to 80 degreeC using an oil bath. 20 g of ethyl acrylate, 40 g of 2-ethylhexyl methacrylate, 20 g of styrene, 15 g of acrylic acid, 0.8 g of 2,2'-azobisisobutyronitrile, and diethylene glycol were added dropwise thereto over 1 hour. A mixture of monoethyl ether acetate 10 g. After completion of the dropwise addition, polymerization reaction was further performed for 6 hours. Then, 1 g of hydroquinone monomethyl ether was added to stop the polym...

Synthetic example 2

[0085] (Synthesis Example 2) Compound B-2 with an acid value of 30 to 250 mgKOH / g

[0086] Copolymer of ethylene oxide-modified bisphenol A diacrylate FA-324A (product name, manufactured by Hitachi Chemical Industry Co., Ltd.) / EA / AA (copolymerization ratio: 50 parts by weight / 10 parts by weight / 15 parts by weight) Product obtained by addition reaction with 5 parts by weight of glycidyl methacrylate (GMA)

[0087]150 g of diethylene glycol monoethyl ether acetate was put into the reaction container of nitrogen atmosphere, and it heated up to 80 degreeC using an oil bath. It took 1 hour to dropwise add 50 g of ethylene oxide modified bisphenol A diacrylate FA-324A, 20 g of ethyl acrylate, 15 g of acrylic acid, 0.8 g of 2,2'-azobisisobutyronitrile and diethylene glycol Alcohol monoethyl ether acetate 10g mixture. After the dropwise addition was completed, polymerization was carried out for a further 6 hours. Then, 1 g of hydroquinone monomethyl ether was added to stop the poly...

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Abstract

The objective of the present invention is to obtain: a conductive paste favorable for obtaining a conductive pattern, capable of fine patterning, and having a high connection reliability with ITO despite containing a compound having a high acid number; and a method for producing a conductive pattern. The conductive paste is characterized by containing: composite particles (A) resulting from an antimony-containing compound being coated onto the surface of a core material comprising an inorganic material; a compound (B) having an acid number in the range of 30-250 mgKOH/g; and a conductive filler (C).

Description

technical field [0001] The present invention relates to a conductive paste for forming conductive patterns. Background technique [0002] In recent years, a conductive paste obtained by dispersing a conductive filler such as Ag in an organic component containing a resin has been used for peripheral wiring of transparent touch panels, wiring for circuit boards, and membrane switches (see, for example, Patent Documents 1 and 2). However, since these conductive pastes form wiring by screen printing, there is a problem that it is impossible to form narrow-pitch wiring due to problems such as bleeding (bleeding) and plate clogging. Therefore, a technique has been proposed in which fine-pitch wiring can be formed by imparting photosensitivity to an organic component containing a resin, applying a paste on a substrate, and then performing exposure and development steps (for example, refer to Patent Documents 3 and 4). However, when these photosensitive pastes are used for peripher...

Claims

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Application Information

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IPC IPC(8): H01B1/20H01B1/22G03F7/004G03F7/027G06F3/041H01B13/00H05K1/09
CPCC09D201/08H01B1/22H01B1/20C09D201/02H05K2201/0221H01B13/00G03F7/20H05K1/0274H05K1/092G03F7/40C09D11/02G06F3/041C01G1/00H05K2203/0514G03F7/027C09D11/037C09D7/12H05K2201/0326H05K2201/0218H05K3/02C09D11/52G03F7/038G03F7/0047G03F7/004G06F2203/04103C09D7/40G06F3/04164
Inventor 水口创草野一孝
Owner TORAY IND INC
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