Anticorrosion polishing agent for semiconductor materials

Abstract

The invention discloses an anticorrosion polishing agent for semiconductor materials. The polishing agent is characterized by comprising the following substances in parts by weight: 5-8 parts of wax solvent, 10-19 parts of pickling agent, 11-16 parts of chlorine dioxide, 8-12 parts of triethylamine, 5-9 parts of tartaric acid, 6-7 parts of methyl benzoate, 2-3 parts of polyvinyl alcohol, 4-5 parts of silicon dioxide, 7-9 parts of hydrogen peroxide, 1-3 parts of zinc sulfate, 2-4 parts of magnesium sulfate, 3-8 parts of calcium stearate and 1 part of dispersing agent. The chemical mechanical polishing agent for semiconductor chips has lower dielectric layer wear rate and lower degree of corrosion, can promote the stability of polishing particles and maintain extremely high tungsten removal rate, and also reduces the problems of pits, corrosion, wear of dielectric layers and the like as the effect strength of the mechanical forces is relatively reduced.

Description

technical field [0001] The invention relates to an anti-corrosion grinding agent for semiconductor materials. Background technique [0002] In the processing and manufacturing process of semiconductor chips, with the gradual popularization of the embedded (damascene) process (a process that is quite cheap and can build a denser component structure on a silicon chip), the metal wires in the chip It is also necessary to perform chemical mechanical planarization (CMP, chemical mechanical planarization) polishing. Tungsten is widely used in the process of semiconductor chip processing and manufacturing because of its excellent filling performance of through holes and trenches, low electron migration and resistance, and excellent corrosion resistance. Such as metal contacts, through-hole wires and interlayer interconnection lines. Traditionally, tungsten can be etched by plasma, called tungsten etch back. However, tungsten etch-back is a process with high cost and great enviro...

AI Technical Summary

Problems solved by technology

However, tungsten etch-back is a process with high cost and great environmental pollution.