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Soldering flux composition with abietate for soldering and soldering paste composition

A technology of composition and flux, which is applied in the field of flux composition and solder paste composition, can solve the problems of flux residues becoming brittle, flux residue cracks, circuit metal corrosion, etc., to achieve the suppression of cracks, Effect of suppressing stickiness and improving workability

Active Publication Date: 2014-10-01
TAMURA KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, rosin-based resins are hard and brittle. Therefore, there is a problem that the flux residue remaining on the substrate tends to become brittle after soldering using a solder paste composition containing it.
In particular, when such a solder paste composition is used on an automotive substrate that is placed in an environment with a severe temperature difference of -40°C to 125°C during use, cracks are likely to occur in the above-mentioned flux residues, and moisture passes through the cracks. Problems such as cracks soaking through the circuit portion of the printed substrate to short the circuit, or corroding the metal of the circuit

Method used

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  • Soldering flux composition with abietate for soldering and soldering paste composition
  • Soldering flux composition with abietate for soldering and soldering paste composition
  • Soldering flux composition with abietate for soldering and soldering paste composition

Examples

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Embodiment

[0094] Examples and comparative examples are given below to describe the present invention in detail, but the present invention is not limited to these examples.

[0095]

Synthetic example 1）

[0097] Add 138.6g of hydrogenated acid modified rosin (PINECRYSTAL KE-604, manufactured by Arakawa Chemical Industry Co., Ltd.) in a 500ml 4-necked flask equipped with a stirring blade, Dean-Stark device and nitrogen inlet tube (COOH group: 0.6 mol), 85.5 g (OH group: 0.3 mol) of dimer diol (PRIPOL 2033, manufactured by CRODA JAPAN KK), and these were stirred at 150° C. for 1 hour under a nitrogen atmosphere to dissolve the hydrogenated acid-modified rosin.

[0098] Next, 5.7 g (0.03 mol) of p-toluenesulfonic acid monohydrate was added thereto, and the temperature was raised to 180° C. to perform a dehydration reaction. They were allowed to react for 3 hours until dehydration stopped, and then allowed to cool to room temperature, and then 200 g of ethyl acetate was added to form a uniform solution.

[0099] After neutralization and liquid separation with a saturated sodium bicarbonate aqueous solution, the mixture was concentrated to obtain 190.5 g of modified rosin A (acid value: ...

Synthetic example 2）

[0101] As in Synthesis Example 1, 92.4 g (COOH group: 0.4 mol) of hydrogenated acid-modified rosin (PINECRYSTAL KE-604, manufactured by Arakawa Chemical Industry Co., Ltd.) and alcohol-modified dimer acid (PRIPLAST 1838, CRODA JAPAN KK) were added. Preparation) 200.0 g (OH group: 0.2 mol) to obtain 248.2 g of modified rosin B (acid value: 39 mgKOH / g, weight average molecular weight: 7,800).

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Abstract

The invention provides a soldering flux composition with abietate for soldering and a soldering paste composition, wherein crack does not easily occur on soldering flux residue on condition that the soldering flux composition with the abietate is exposed in an intensive cold-and-heat cycle for a long time. A rosin derivative compound is obtained through dehydration condensation between (A) a rosin carboxyl-containing resin and (b-1), (b-2) or (b-3); wherein (b-1) is a dimer acid derivative flexible alcohol compound; in the formula (1), D is a dimer-acid-derived aliphatic chain, and n is 1-3; (b-2) is a dimer acid derivative flexible alcohol compound which is obtained through dehydration condensation between the dimer acid and the compound of the formula (1); (b-3) is a dimer acid derivative flexible alcohol compound which is obtained through dehydration condensation between the dimer acid and the compound of the formula (2); and in the formula (2), R represents an alkyl connecting group with 2-10 carbon atoms and comprises a straight-chain or branched-chain structure, and additionally, n2 is 1-10.

Description

Technical field [0001] The present invention relates to a flux composition used for soldering electronic parts and the like on a printed circuit board and a solder paste composition using the same, and in particular to a board for an automobile that is placed in an environment with a drastic temperature difference such as the engine room of an automobile When the flux residue is hardly cracked, the flux composition for soldering. Background technique [0002] In the past, in the solder paste composition used when mounting electronic components on the substrate, in order to remove the solder alloy powder, the metal oxide on the substrate and reduce the surface tension of the solder alloy powder to improve the wettability, a flux composition was compounded . [0003] In such a flux composition, rosin-based resins such as rosin and rosin derivatives are often blended in order to impart electrical insulation, moisture resistance, wettability, solderability, and the like. [0004] Howev...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09F1/04B23K35/363
Inventor 成濑章一郎土屋雅裕喜多村明清野桃子岛崎贵则大野耐一大年洋司
Owner TAMURA KK
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