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Rosin ester-containing flux composition and solder paste composition for soldering

A composition and flux technology, applied in the field of flux composition and solder paste composition, can solve the problems of easy brittleness of flux residue, cracking of flux residue, corrosion of circuit metal, etc. The effect of suppressing stickiness and improving workability

Active Publication Date: 2018-04-17
TAMURA KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, rosin-based resins are hard and brittle. Therefore, there is a problem that the flux residue remaining on the substrate tends to become brittle after soldering using a solder paste composition containing it.
In particular, when such a solder paste composition is used on an automotive substrate that is placed in an environment with a severe temperature difference of -40°C to 125°C during use, cracks are likely to occur in the above-mentioned flux residues, and moisture passes through the cracks. Problems such as cracks soaking through the circuit portion of the printed substrate to short the circuit, or corroding the metal of the circuit

Method used

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  • Rosin ester-containing flux composition and solder paste composition for soldering
  • Rosin ester-containing flux composition and solder paste composition for soldering
  • Rosin ester-containing flux composition and solder paste composition for soldering

Examples

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Embodiment

[0094] Hereinafter, although an Example and a comparative example are given and this invention is demonstrated in detail, this invention is not limited to these Examples.

[0095]

Synthetic example 1）

[0097] 138.6 g of hydrogenated acid-modified rosin (PINECRYSTAL KE-604, manufactured by Arakawa Chemical Industry Co., Ltd.) (COOH group: 0.6 mol) and 85.5 g (OH group: 0.3 mol) of dimer diol (PRIPOL2033, manufactured by CRODA JAPAN KK) were stirred at 150° C. for 1 hour under a nitrogen atmosphere to dissolve the hydrogenated acid-modified rosin.

[0098] Next, 5.7 g (0.03 mol) of p-toluenesulfonic acid monohydrate was added thereto, and the temperature was raised to 180° C. to perform a dehydration reaction. These were reacted for 3 hours until the dehydration stopped, and then left to cool to room temperature, and 200 g of ethyl acetate was further added to form a uniform solution.

[0099] It was neutralized with saturated sodium bicarbonate aqueous solution, liquid-separated, and concentrated to obtain 190.5 g of modified rosin A (acid value: 77 mgKOH / g, weight average molecular weight: 2,400).

Synthetic example 2）

[0101] As in Synthesis Example 1, 92.4 g (COOH group: 0.4 mol) of hydrogenated acid-modified rosin (PINECRYSTAL KE-604, manufactured by Arakawa Chemical Industry Co., Ltd.), alcohol-modified product of dimer acid (PRIPLAST1838, CRODA JAPAN KK 200.0 g (OH group: 0.2 mol) to obtain 248.2 g of modified rosin B (acid value: 39 mgKOH / g, weight average molecular weight: 7,800).

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Abstract

A flux composition for soldering containing rosin ester and a solder paste composition are provided. Even if the flux composition for soldering containing rosin ester is exposed to intense cooling and heating cycles for a long time, the flux residue is less prone to cracking. The rosin derivative compound is formed by dehydration condensation of (A) rosin carboxyl group-containing resin and any one of (b-1), (b-2) or (b-3): (b-1) the following A dimer acid derivative flexible alcohol compound obtained by reduction of dimer acid represented by general formula (1). In formula (1), D is an aliphatic chain derived from dimer acid, and n is 1 to 3; (b-2 ) a dimer acid derivative flexible alcohol compound obtained by dehydration and esterification of a dimer acid with a compound of the aforementioned general formula (1); (b-3) dehydration of a dimer acid with an alcohol compound represented by the following general formula (2) In the dimer acid derivative flexible alcohol compound obtained by esterification, in the formula (2), R is an alkyl linking group with 2-10 carbons, including straight chain or branched chain structure, and n2 is 1-10.

Description

technical field [0001] The present invention relates to a flux composition used for soldering electronic components etc. on a printed circuit board and a solder paste composition using the same, and particularly relates to an automotive substrate used even in an environment with severe temperature differences such as an engine room of an automobile A flux composition for soldering in which cracks are less likely to occur in the flux residue. Background technique [0002] Conventionally, in solder paste compositions used for mounting electronic components on substrates, flux compositions have been blended in order to remove solder alloy powder and metal oxides on the substrate, and to reduce the surface tension of solder alloy powder to improve wettability. . [0003] In such a flux composition, rosin-based resins such as rosin and rosin derivatives are often compounded in order to impart electrical insulation, moisture resistance, wettability, solderability, and the like. ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09F1/04B23K35/363
Inventor 成濑章一郎土屋雅裕喜多村明清野桃子岛崎贵则大野耐一大年洋司
Owner TAMURA KK
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